CN115838167A - Graphene heat-conducting film and preparation method thereof - Google Patents
Graphene heat-conducting film and preparation method thereof Download PDFInfo
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- CN115838167A CN115838167A CN202211742279.1A CN202211742279A CN115838167A CN 115838167 A CN115838167 A CN 115838167A CN 202211742279 A CN202211742279 A CN 202211742279A CN 115838167 A CN115838167 A CN 115838167A
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 104
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 103
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000003054 catalyst Substances 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000002002 slurry Substances 0.000 claims abstract description 15
- 238000005087 graphitization Methods 0.000 claims abstract description 7
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 238000001816 cooling Methods 0.000 claims abstract description 6
- 238000002156 mixing Methods 0.000 claims abstract description 6
- 238000003756 stirring Methods 0.000 claims abstract description 6
- 230000001681 protective effect Effects 0.000 claims abstract description 5
- 239000002904 solvent Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 21
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 6
- 239000004327 boric acid Substances 0.000 claims description 6
- VYLVYHXQOHJDJL-UHFFFAOYSA-K cerium trichloride Chemical group Cl[Ce](Cl)Cl VYLVYHXQOHJDJL-UHFFFAOYSA-K 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 239000002135 nanosheet Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- LUTSRLYCMSCGCS-BWOMAWGNSA-N [(3s,8r,9s,10r,13s)-10,13-dimethyl-17-oxo-1,2,3,4,7,8,9,11,12,16-decahydrocyclopenta[a]phenanthren-3-yl] acetate Chemical compound C([C@@H]12)C[C@]3(C)C(=O)CC=C3[C@@H]1CC=C1[C@]2(C)CC[C@H](OC(=O)C)C1 LUTSRLYCMSCGCS-BWOMAWGNSA-N 0.000 description 1
- 125000002837 carbocyclic group Chemical group 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000000967 suction filtration Methods 0.000 description 1
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Abstract
The invention provides a graphene heat-conducting film and a preparation method thereof, wherein the preparation method comprises the following steps: mixing graphene oxide and a catalyst solvent, and stirring and homogenizing to obtain graphene oxide slurry; coating the graphene oxide slurry on a substrate and sending the substrate into an oven to obtain a dry graphene oxide film; and (3) sequentially feeding the dried graphene oxide film into a low-temperature furnace, a medium-temperature furnace and a high-temperature furnace, introducing protective gas, carrying out graphitization treatment at least twice, and naturally cooling to obtain the graphene heat-conducting film. The catalyst is added in the graphene oxide preparation stage, so that the combination of the catalyst and the graphene oxide is more effective and deeper, and the addition operation in the mode is simpler. The catalyst is added into the slurry, so that the graphene sheet layer can be assembled, the heat-conducting property of the graphene heat-conducting film reduced to graphene in the later period can be improved, and a good heat-radiating effect can be provided for electronic products.
Description
Technical Field
The invention belongs to the technical field of graphene, and particularly relates to a graphene heat-conducting film and a preparation method thereof.
Background
This section provides background information related to the present disclosure only and is not necessarily prior art.
In 2010, andre geom and konstatin novoseov, two professors of manchester university in the united kingdom, raised the worldwide hot trend of graphene research because of the first successful separation of stable graphene to obtain the nobel prize of physics. Graphene (Graphene) is a monolayer two-dimensional crystal, has the highest strength of known materials and excellent electrical and thermal conductivity, and is the most ideal two-dimensional nanomaterial at present.
The graphene film of macroscopically assembled graphene oxide or graphene nanosheets is a main application form of nanoscale graphene, common preparation methods are a suction filtration method, a scraping method, a spin-coating method, a spraying method, a dip-coating method and the like, and the graphene heat-conducting film prepared by the method is low in preparation performance and cannot meet the requirements of high heat dissipation of smart phones, smart portable hardware, tablet computers, notebook computers and the like.
Disclosure of Invention
In view of the above problems, a first aspect of the present invention provides a method for preparing a graphene thermal conductive film, including:
mixing graphene oxide and a catalyst solvent, and stirring and homogenizing to obtain graphene oxide slurry;
coating the graphene oxide slurry on a substrate and sending the substrate into an oven to obtain a dry graphene oxide film;
and (3) sequentially feeding the dried graphene oxide film into a low-temperature furnace, a medium-temperature furnace and a high-temperature furnace, introducing protective gas, carrying out graphitization treatment at least twice, and naturally cooling to obtain the graphene heat-conducting film.
The catalyst is added in the graphene oxide preparation stage, so that the combination of the catalyst and the graphene oxide is more effective and deeper, and the addition operation in the mode is simpler. The catalyst is added into the slurry, so that the graphene sheet layer can be assembled, the heat-conducting property of the graphene heat-conducting film reduced in the later period can be improved, a good heat-radiating effect can be provided for an electronic product, and the requirement for high heat radiation is met.
The dry graphene oxide film fed into the heating furnace is graphitized at least twice, so that the defects caused by the graphene heat-conducting film prepared by a chemical stripping method can be effectively overcome, and the prepared graphene heat-conducting film has good strength and toughness and excellent heat conductivity.
In some embodiments of the invention, the catalyst is cerium chloride or boric acid.
In some embodiments of the invention, the ratio of the graphene oxide to the catalyst in the catalyst solution is 100: (1-5).
In some embodiments of the invention, the oven temperature is from 35 ℃ to 60 ℃.
In some embodiments of the invention, the temperature of the low temperature furnace is 300 ℃, the temperature of the medium temperature furnace is 1000 ℃, and the temperature of the high temperature furnace is 3100 ℃.
In some embodiments of the invention, the temperature rise rate of the low temperature furnace, the medium temperature furnace and the high temperature furnace is 3 ℃/min.
In some embodiments of the invention, the shielding gas is nitrogen or argon.
In some embodiments of the invention, the substrate is a PET substrate.
The second aspect of the present invention provides a graphene thermal conductive film, which is obtained by the preparation method of the graphene thermal conductive film in any one of the above technical solutions.
The graphene heat-conducting film of the embodiment of the invention has the same beneficial effects as the graphene heat-conducting film prepared by the preparation method of the graphene heat-conducting film in any one of the technical schemes, and is not repeated herein.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 is a flowchart of a method for manufacturing a graphene thermal conductive film according to an embodiment of the present invention;
fig. 2 is a scanning electron microscope photograph of a stretched cross section of a graphene thermal conductive film prepared in an embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
It is to be understood that the terminology used herein is for the purpose of describing particular example embodiments only, and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof.
Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
For convenience of description, spatially relative terms, such as "inner", "outer", "lower", "below", "upper", "above", and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the example term "at 8230; \8230; below" may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
As shown in fig. 1, a first aspect of the present invention provides a method for preparing a graphene thermal conductive film, including:
mixing graphene oxide and a catalyst solvent, and stirring and homogenizing to obtain graphene oxide slurry;
coating the graphene oxide slurry on a substrate and sending the substrate into an oven to obtain a dry graphene oxide film;
and (3) sequentially feeding the dried graphene oxide film into a low-temperature furnace, a medium-temperature furnace and a high-temperature furnace, introducing protective gas, carrying out graphitization treatment at least twice, and naturally cooling to obtain the graphene heat-conducting film.
The catalyst is added in the graphene oxide preparation stage, so that the combination of the catalyst and the graphene oxide is more effective and deeper, and the addition operation in the mode is simpler. The catalyst is added into the slurry, so that the graphene sheet layer can be assembled, the heat-conducting property of the graphene heat-conducting film reduced in the later period can be improved, a good heat-radiating effect can be provided for electronic products, and the requirement of high heat radiation is met.
The dry graphene oxide film fed into the heating furnace is graphitized at least twice, so that the defects caused by the graphene heat-conducting film prepared by a chemical stripping method can be effectively overcome, and the prepared graphene heat-conducting film has good strength and toughness and excellent heat conductivity.
In some embodiments of the invention, the catalyst is cerium chloride or boric acid. During the graphitization process of cerium chloride and boric acid, cerium has strong bonding capability with carbon atoms as rare earth metal, generates single bonds, double bonds, benzene ring bonds and the like, promotes the valence state of the carbon atoms to change and tend to a stable state, and thus promotes the carbon atoms to be fused to form a three-dimensional ordered graphite structure. Cerium chloride or boric acid can enter or leave a defective carbocyclic ring structure, promote stable arrangement of carbon atoms and play a catalytic role.
In some embodiments of the invention, the ratio of the graphene oxide to the catalyst in the catalyst solution is 100: (1-5). The graphene heat-conducting film prepared in the range has good thermal conductivity, tensile strength and elongation at break.
In some embodiments of the invention, the oven temperature is from 35 ℃ to 60 ℃.
In some embodiments of the invention, the temperature of the low temperature furnace is 300 ℃, the temperature of the medium temperature furnace is 1000 ℃, and the temperature of the high temperature furnace is 3100 ℃.
In some embodiments of the invention, the temperature rise rate of the low temperature furnace, the medium temperature furnace and the high temperature furnace is 3 ℃/min.
In some embodiments of the invention, the shielding gas is nitrogen or argon.
In some embodiments of the invention, the substrate is a PET substrate.
The following description will be made of graphene thermal conductive films prepared in different embodiments:
example one
Mixing 1g of graphene oxide and 0.01g of cerium chloride, and stirring and homogenizing for 3 times to obtain graphene oxide slurry;
coating the graphene oxide slurry on a base material at a rate of 10mL/h, and sending the base material into an oven at 35-40 ℃ to obtain a dry graphene oxide film;
and (3) sequentially feeding the dried graphene oxide film into a low-temperature furnace, a medium-temperature furnace and a high-temperature furnace, heating from room temperature to 3100 ℃ at a heating rate of 3 ℃/min, introducing nitrogen, carrying out graphitization treatment twice, and naturally cooling to obtain the graphene heat-conducting film.
Through the steps, the graphene heat-conducting film with the thickness of 40 microns is prepared, as shown in fig. 2, the prepared graphene heat-conducting film is formed by stacking graphene nano sheets layer by layer along the plane direction, and the highly-oriented layered structure is beneficial to heat conduction in the horizontal direction. The graphene heat-conducting film has tensile strength larger than 20Mpa, elongation at break of 1-5% and thermal diffusion of 900W/(m.k).
Example two
Mixing 1g of graphene oxide and 0.04g of boric acid, and stirring and homogenizing for 2 times to obtain graphene oxide slurry;
coating the graphene oxide slurry on a substrate at a rate of 10mL/h, and sending the substrate into a 60 ℃ oven to obtain a dry graphene oxide film;
and (3) sequentially feeding the dried graphene oxide film into a low-temperature furnace, a medium-temperature furnace and a high-temperature furnace, heating from room temperature to 3100 ℃ at a heating rate of 3 ℃/min, introducing nitrogen, carrying out graphitization treatment twice, and naturally cooling to obtain the graphene heat-conducting film.
Through the steps, the graphene heat-conducting film with the thickness of 40 microns is prepared, as shown in fig. 2, the prepared graphene heat-conducting film is formed by stacking graphene nano sheets layer by layer along the plane direction, and the highly-oriented layered structure is beneficial to heat conduction in the horizontal direction. The graphene heat-conducting film has tensile strength of more than 20Mpa, elongation at break of 1-5% and thermal diffusion of 800W/(m.k).
As shown in fig. 2, a second aspect of the present invention provides a graphene thermal conductive film, which is obtained by the method for preparing a graphene thermal conductive film according to any one of the above technical solutions.
The graphene heat conduction film in the embodiment of the present invention has the same beneficial effects as the graphene heat conduction film prepared by the preparation method of the graphene heat conduction film in any one of the above technical solutions, and is not described herein again.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are also included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. A preparation method of a graphene heat conduction film is characterized by comprising the following steps:
mixing graphene oxide and a catalyst solvent, and stirring and homogenizing to obtain graphene oxide slurry;
coating the graphene oxide slurry on a substrate and sending the substrate into an oven to obtain a dry graphene oxide film;
and (3) sequentially feeding the dried graphene oxide film into a low-temperature furnace, a medium-temperature furnace and a high-temperature furnace, introducing protective gas, carrying out graphitization treatment at least twice, and naturally cooling to obtain the graphene heat-conducting film.
2. The method according to claim 1, wherein the catalyst is cerium chloride or boric acid.
3. The method according to claim 1, wherein a ratio of the graphene oxide to the catalyst in the catalyst solution is 100: (1-5).
4. The method for preparing the graphene thermal conductive film according to claim 1, wherein the temperature of the oven is 35-60 ℃.
5. The method for preparing the graphene thermal conductive film according to claim 1, wherein the temperature of the low-temperature furnace is 300 ℃, the temperature of the medium-temperature furnace is 1000 ℃, and the temperature of the high-temperature furnace is 3100 ℃.
6. The method for preparing the graphene thermal conductive film according to claim 1, wherein the temperature rise rates of the low-temperature furnace, the medium-temperature furnace and the high-temperature furnace are 3 ℃/min.
7. The method according to claim 1, wherein the protective gas is nitrogen or argon.
8. The method for preparing the graphene thermal conductive film according to claim 1, wherein the substrate is a PET substrate.
9. A graphene thermal conductive film obtained by the method for preparing the graphene thermal conductive film according to any one of claims 1 to 8.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104229782A (en) * | 2014-09-10 | 2014-12-24 | 浙江碳谷上希材料科技有限公司 | Preparation method of ordered graphene porous membrane |
| CN105084355A (en) * | 2015-09-11 | 2015-11-25 | 四川大学 | Controllable-interlamellar-spacing stable graphene oxide film and preparation method thereof |
| CN108314013A (en) * | 2018-01-23 | 2018-07-24 | 杭州高烯科技有限公司 | A kind of regular porous graphene thick film and preparation method thereof |
| US20190023575A1 (en) * | 2016-01-25 | 2019-01-24 | Zhejiang University | Super-flexible high thermal conductive grapheme film and preparation method thereof |
| CN113213463A (en) * | 2020-01-21 | 2021-08-06 | 常州第六元素材料科技股份有限公司 | Graphene oxide slurry with small and medium particle diameters, preparation method of graphene oxide slurry, graphene oxide film and preparation method of graphene oxide film |
| CN113321207A (en) * | 2021-06-25 | 2021-08-31 | 太原理工大学 | Method for preparing high-thermal-conductivity graphene film by using metal catalyst |
| CN114751403A (en) * | 2022-04-15 | 2022-07-15 | 常州富烯科技股份有限公司 | High-thermal-conductivity graphene film and preparation method thereof |
-
2022
- 2022-12-29 CN CN202211742279.1A patent/CN115838167A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104229782A (en) * | 2014-09-10 | 2014-12-24 | 浙江碳谷上希材料科技有限公司 | Preparation method of ordered graphene porous membrane |
| CN105084355A (en) * | 2015-09-11 | 2015-11-25 | 四川大学 | Controllable-interlamellar-spacing stable graphene oxide film and preparation method thereof |
| US20190023575A1 (en) * | 2016-01-25 | 2019-01-24 | Zhejiang University | Super-flexible high thermal conductive grapheme film and preparation method thereof |
| CN108314013A (en) * | 2018-01-23 | 2018-07-24 | 杭州高烯科技有限公司 | A kind of regular porous graphene thick film and preparation method thereof |
| CN113213463A (en) * | 2020-01-21 | 2021-08-06 | 常州第六元素材料科技股份有限公司 | Graphene oxide slurry with small and medium particle diameters, preparation method of graphene oxide slurry, graphene oxide film and preparation method of graphene oxide film |
| CN113321207A (en) * | 2021-06-25 | 2021-08-31 | 太原理工大学 | Method for preparing high-thermal-conductivity graphene film by using metal catalyst |
| CN114751403A (en) * | 2022-04-15 | 2022-07-15 | 常州富烯科技股份有限公司 | High-thermal-conductivity graphene film and preparation method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 宋凌志;徐鹏;戴思畅: "高导热石墨烯薄膜的制备方法及研究进展", 广州化工, vol. 45, no. 09, pages 6 - 7 * |
| 王仕东;顾宝珊;孙世清;邹卫武;李鑫;杨培燕;赵皓琦: "电加热石墨烯薄膜材料的制备及应用研究进展", 炭素技术, vol. 39, no. 01, pages 24 - 28 * |
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