CN114525113A - Method for enhancing interface heat transfer of metal material and organic material - Google Patents
Method for enhancing interface heat transfer of metal material and organic material Download PDFInfo
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- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Abstract
The invention discloses a method for enhancing interface heat transfer of a metal material and an organic material, belonging to the field of enhanced heat transfer. The method of the invention uses the electro-acoustic coupling material at the metal/organic interface as a bridge for connecting electron and phonon heat conduction, wherein electron heat conduction is mainly used between the metal material and the electro-acoustic coupling material, phonon heat conduction is mainly used between the organic material and the electro-acoustic coupling material, so that the heat transport of the electron-phonon interface is enhanced, and the enhanced heat transfer of the metal/organic interface is realized. The method is beneficial to enhancing the heat transfer performance of the metal/organic interface and improving the performance of a thermal interface material, a nano fluid and a solid-liquid phase change material.
Description
Technical Field
The invention relates to the field of enhanced heat transfer, in particular to a method for enhancing interface heat transfer of a metal material and an organic material.
Background
Metal/organic interface heat transfer is widely present in the fields of energy generation, conversion and transmission. The thermal interface material takes an organic material as a substrate, the thermal conductivity of the material is increased by adding high-thermal-conductivity filler, the material is used for filling gaps, and the metal micro-nano particles are one of the commonly used high-thermal-conductivity fillers. A large number of interfaces are formed between the metal micro-nano particles and the organic material, so that the limitation that the heat conducting performance of the thermal interface material is improved to a limited extent due to the large number of doped metal particles is caused. The nano fluid is prepared by adding high-thermal-conductivity particles into organic liquid such as water or oil, so that the thermal conductivity of the fluid is improved. When the metal micro-nano particles are contacted with the organic liquid, great interface thermal resistance is generated. The solid-liquid phase change material is a medium for storing heat in the solid-liquid phase change, and since the thermal conductivity of the phase change is small, the thermal conductivity is generally increased by constructing metal fins or adding metal particles in the phase change material. The large number of metal/organic interfaces increases the temperature difference between the heat source and the phase change material, reducing the efficiency of thermal energy storage. In sum, these interfacial heat transfer bottlenecks ultimately lead to reduced material and device reliability. Therefore, enhancing interfacial heat transport is a technical challenge facing many leading-edge technology areas.
Especially for a metal/organic interface, from the view of a microscopic heat conduction mechanism, metal is the electron heat conduction leading factor, heat conduction silicone grease is the phonon heat conduction leading factor, and the two energy transfer mechanisms are different, so that huge interface thermal resistance is caused. In order to enhance the heat transfer at the metal/organic interface, a method of enhancing the phonon transport at the interface is usually adopted, and an intermediate material is inserted at the interface for increasing the phonon density matching and enhancing the interface bonding strength. However, this method is only from the viewpoint of phonons, and the main carriers in the metal are electrons, so that the effect of enhancing heat transfer to the interface is limited. How to enhance the electron-phonon interface heat transport is the key of metal/organic interface enhanced heat transfer.
Disclosure of Invention
In order to enhance the heat transfer of a metal/organic interface, the invention provides a method for enhancing the heat transfer of the interface of a metal material and an organic material. The method is characterized in that the electro-acoustic coupling material is used at a metal/organic interface and serves as a bridge for connecting electron and phonon heat conduction, wherein electron heat conduction is mainly used between the metal material and the electro-acoustic coupling material, phonon heat conduction is mainly used between the organic material and the electro-acoustic coupling material, heat transport of the electron-phonon interface is enhanced, and metal/organic interface enhanced heat transfer is realized.
The invention firstly provides a method for enhancing interface heat transfer of a metal material and an organic material, which comprises the following steps: introducing a layer of electro-acoustic coupling material at an interface of the metallic material and the organic material.
In the above method, the metal material and the organic material are connected in a planar form; or the like, or, alternatively,
the metallic material is dispersed in a matrix of organic material.
The electro-acoustic coupling material is a material with the electric conductivity between that of a metal material and that of an organic material, and comprises a conductive polymer, ionic liquid or liquid metal.
The conductive polymer is a material with a conjugated main electron system in a main chain and can reach a conductive state through doping; specifically polyacetylene, polythiophene, polypyrrole, polyaniline, polyphenylene ethylene or polydiyne;
the ionic liquid is composed of cations and anions; the cation is quaternary ammonium salt ion, quaternary phosphonium salt ion or imidazole salt ion; the anion is halogen ion, tetrafluoroborate ion or hexafluorophosphate ion; more specifically, it may be 1-ethyl-3-methylimidazolium hexafluorophosphate.
The liquid metal is pure metal or alloy with the melting point at room temperature; specifically, it can be gallium, gallium indium tin zinc, indium tin, bismuth indium tin or bismuth indium tin lead; more specifically gallium indium alloy.
In the above method, the metallic material and the electroacoustic coupling material are connected by metallic bond, covalent bond, or van der waals force;
the electro-acoustic coupling material and the organic material are connected by covalent bonds, hydrogen bonds, or van der waals forces.
In the method, the metal material and the electroacoustic coupling material are connected by soaking, spin coating, magnetron sputtering, high-temperature corrosion or electroplating;
the connection method of the electroacoustic coupling material and the organic material comprises soaking, spin coating, magnetron sputtering, high-temperature corrosion or electroplating.
In the above method, the metal material is one of pure metals such as aluminum, copper, iron, nickel and the like and alloys thereof; specifically, copper may be used.
The organic material is high molecular polymer or silicone oil and the like; specifically, polydimethylsiloxane is used.
The invention also provides a composite material which comprises the metal material, the electroacoustic coupling material and the organic material which are sequentially connected.
The composite material, wherein the metal material and the organic material are connected in a planar manner; or the like, or, alternatively,
the metallic material is dispersed in a matrix of organic material.
The electro-acoustic coupling material is a material with the electric conductivity between that of a metal material and that of an organic material, and comprises a conductive polymer, ionic liquid or liquid metal.
Specifically, the conductive polymer is a material with a conjugated main electron system in a main chain and can reach a conductive state through doping; more specifically polyacetylene, polythiophene, polypyrrole, polyaniline, polyphenylene ethylene or polydiyne;
specifically, the ionic liquid is composed of a cation and an anion; the cation is quaternary ammonium salt ion, quaternary phosphonium salt ion or imidazole salt ion; the anion is halogen ion, tetrafluoroborate ion or hexafluorophosphate ion; more specifically, it may be 1-ethyl-3-methylimidazolium hexafluorophosphate.
The liquid metal is pure metal or alloy with the melting point at room temperature; more specifically gallium, gallium indium tin zinc, indium tin, bismuth indium tin, or bismuth indium tin lead.
The composite material, wherein the metal material and the electroacoustic coupling material are connected by metal bonds, covalent bonds or van der waals forces;
the electro-acoustic coupling material and the organic material are connected by covalent bonds, hydrogen bonds or van der waals forces;
specifically, the connection method of the metal material and the electroacoustic coupling material can be soaking, spin coating, magnetron sputtering, high-temperature corrosion or electroplating;
the connection method of the electroacoustic coupling material and the organic material can be soaking, spin coating, magnetron sputtering, high-temperature corrosion or electroplating.
In the composite material, the metal material is one of pure metals such as aluminum, copper, iron, nickel and the like and alloys thereof; specifically, copper may be used.
The organic material is high molecular polymer or silicone oil and the like; specifically, polydimethylsiloxane is used.
The method of the invention is that the electro-acoustic coupling material is used at the metal/organic interface as a bridge for connecting electron and phonon heat conduction, wherein the electron heat conduction is mainly used between the metal material and the electro-acoustic coupling material, and the phonon heat conduction is mainly used between the organic material and the electro-acoustic coupling material; the method of the invention is beneficial to enhancing the heat transfer performance of the metal/organic interface and improving the performance of the thermal interface material, the nanometer fluid and the solid-liquid phase change material.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention; in the figure, 1 is a metal material, 2 is an electroacoustic coupling material, and 3 is an organic material.
FIG. 2 is a schematic view of the structure of example 2 of the present invention; in the figure, 1 is a metal material, 2 is an electroacoustic coupling material, and 3 is an organic material.
Detailed Description
The present invention is described in further detail below with reference to specific embodiments, which are given for the purpose of illustration only and are not intended to limit the scope of the invention.
The experimental procedures in the following examples are conventional unless otherwise specified.
Materials, reagents and the like used in the following examples are commercially available unless otherwise specified.
The gallium indium alloy used in the following examples is a eutectic alloy of metal gallium and metal indium, with a melting point of 15 degrees celsius. Firstly, 75.5% of gallium and 24.5% of indium (by mass) are weighed, placed in a crucible, heated at 100 ℃ for 2 hours, taken out and stirred for 2 minutes to obtain the gallium-indium alloy.
Polydimethylsiloxane is available from Shanghai Aladdin Biotechnology Ltd.
1-Ethyl-3-methylimidazolium hexafluorophosphate was purchased from Shanghai Arlatin Biotech Ltd.
The method of the invention is to attach a layer of electro-acoustic coupling material on the surface of metal, and then attach an organic material on the surface of the electro-acoustic coupling material to form a sandwich structure. The principle is that electronic heat conduction is mainly used between the metal material and the electroacoustic coupling material, phonon heat conduction is mainly used between the organic material and the electroacoustic coupling material, and a bridge for connecting the electronic heat conduction and the phonon heat conduction is built through the electroacoustic coupling material.
Example 1
As shown in fig. 1, there is provided a material of a sandwich structure, which is in the form of a flat plate, including a metal material 1, an electro-acoustic coupling material 2 and an organic material 3; the electro-acoustic coupling material 2 is intermediate the metallic material 1 and the organic material 3.
Wherein, the electroacoustic coupling material 3 is liquid metal gallium.
The metal material 1 can be pure metals such as copper, iron, nickel and the like and alloys thereof;
the organic material 3 can be a high molecular polymer, silicone oil and the like;
the metal material 1 is connected with the electroacoustic coupling material 2 by metal bonds or van der waals force; specifically, the metal material 1 may be soaked in the electroacoustic coupling material 2, and then placed in a high temperature furnace for 10 minutes, so that a metal bond is formed at the interface between the two; it is also possible to connect the two in the form of van der waals forces by spin coating the electro-acoustic coupling material 2 on the surface of the metallic material 1.
The organic material 3 is connected with the electroacoustic coupling material 2 by a covalent bond, a hydrogen bond or Van der Waals force; specifically, the organic material 3 can be vulcanized to form-HS end groups which are connected with the electroacoustic coupling material 2 in a covalent bond form; or the organic material 3 is processed by hydroxyl or carboxyl to form-OH and-COOH terminal groups which are connected with the electroacoustic coupling material 2 in a hydrogen bond form; in the absence of such functional groups, they are attached by van der Waals forces.
For the three-layer structure of the electro-acoustic coupling material 3 being liquid metal gallium, inside the metal material 1, electrons carry most of energy and are transmitted to the interface of the metal material 1/the electro-acoustic coupling material 2; then the electrons pass through the interface to be transmitted into the electroacoustic coupling material 2, the electroacoustic coupling action is generated inside the electroacoustic coupling material, and partial energy is transmitted to the phonons; then at the interface of the electro-acoustic coupling material 2/the organic material 3, the two materials conduct heat mainly through phonons, and energy is transferred to the organic material 3, so that the enhanced heat transfer of the metal/organic interface is realized.
Example 2
As shown in fig. 2, the metal material is dispersed in the organic material matrix, and includes a metal material 1, an electro-acoustic coupling material 2, and an organic material 3. In this embodiment, the electroacoustic coupling material 2 is first attached to the surface of the metal material 1, and then the metal material 1 is dispersed in the organic material 3. The material selection and connection method are the same as those in the first embodiment.
Example 3
1. Preparation of copper powder/gallium indium/polydimethylsiloxane composite material
Firstly, 20g of copper powder (800 meshes) is soaked in 30mL of 1mol/L hydrochloric acid for 10 minutes at room temperature environment, and a surface oxidation layer is removed; then, 110g of gallium-indium alloy is poured into the solution, and the solution is stirred for 10 minutes at room temperature, so that a layer of liquid metal is plated on the surface of the copper powder; then taking out the mixture of the liquid metal and the copper powder, and drying to completely remove moisture; the dried mixture was added to 21g of polydimethylsiloxane, sufficiently stirred for 10 minutes, placed in a vacuum drying oven, evacuated for 30 minutes, and then heated at 120 ℃ for 2 hours to cure.
2. Preparation of copper powder/polydimethylsiloxane composite material
Soaking 89g of copper powder (800 meshes) in 50mL of 1mol/L hydrochloric acid for 10 minutes at room temperature to remove a surface oxide layer; then taking out the copper powder for drying, and completely removing moisture; then, the copper powder was added to 10g of polydimethylsiloxane, sufficiently stirred for 10 minutes, placed in a vacuum drying oven, evacuated for 30 minutes, and then heated at 120 ℃ for 2 hours to cure the copper powder.
3. Preparation of gallium indium/polydimethylsiloxane composite material
64g of gallium-indium alloy is added into 10g of polydimethylsiloxane, fully stirred for 10 minutes, placed in a vacuum drying oven, vacuumized for 30 minutes, heated for 2 hours at 120 ℃ and cured.
In the copper powder/gallium indium/polydimethylsiloxane composite material, a metal material 1 is 800-mesh copper powder, an electroacoustic coupling material 2 is gallium indium alloy, and an organic material 3 is polydimethylsiloxane. The thermal conductivity of the materials is measured, and the thermal conductivity of the copper powder/gallium indium/polydimethylsiloxane composite material is 6.20W/(m.K). The thermal conductivity of the copper powder/polydimethylsiloxane composite material is 0.96W/(m.K); the thermal conductivity of the gallium indium/polydimethylsiloxane composite material is 2.10W/(m.K). From the above, it can be seen that gallium indium alloy is used as a bonding material, which is beneficial to reducing the interface thermal resistance between copper and polydimethylsiloxane.
Example 4
Firstly, a copper plate with the diameter of 5cm is immersed into 1mol/L hydrochloric acid to remove an oxidation layer, and the copper plate is dried to remove moisture for later use; then, dropping 1g of ionic liquid 1-ethyl-3-methylimidazole hexafluorophosphate on the surface of the copper plate, and performing spin coating; subsequently, 5g of polydimethylsiloxane was dropped on the surface of the copper plate after spin coating, and then spin coating was performed, and finally, the copper plate was placed in a vacuum drying oven and heated at 120 ℃ for 2 hours to be cured.
In the prepared composite material, the electroacoustic coupling material 2 is ionic liquid 1-ethyl-3-methylimidazolium hexafluorophosphate. By spin coating the electro-acoustic coupling material 2 on the surface of the metallic material 1, the two are connected in van der waals force.
Example 5
Firstly, 50g of copper powder is soaked in 30mL of 1mol/L hydrochloric acid for 10min at room temperature environment, and a surface oxidation layer is removed; then, 5g of polypyrrole was poured into the solution, and stirred for 10 minutes; then taking out the mixture of polypyrrole and copper powder, and drying to remove moisture; and adding the dried mixture into 10g of polydimethylsiloxane, fully stirring for 10 minutes, placing the mixture in a vacuum drying oven, vacuumizing for 30 minutes, heating at 120 ℃ for 2 hours, and curing.
In the prepared material, the electroacoustic coupling material 2 is polypyrrole, and the difference from the third embodiment is as follows: the polypyrrole is chemically close to the organic material 3 and forms a covalent bond with the organic material 3.
Claims (10)
1. A method for enhancing interface heat transfer of a metal material and an organic material comprises the following steps: introducing a layer of electro-acoustic coupling material at an interface of the metallic material and the organic material.
2. The method of claim 1, wherein: the metal material and the organic material are connected in a planar form; or the like, or, alternatively,
the metallic material is dispersed in a matrix of organic material.
3. The method according to claim 1 or 2, characterized in that: the electro-acoustic coupling material is a material with the electric conductivity between that of a metal material and that of an organic material, and comprises a conductive polymer, ionic liquid or liquid metal;
the metal material is one of pure metals of aluminum, copper, iron and nickel and alloys thereof;
the organic material is high molecular polymer or silicone oil.
4. The method of claim 3, wherein: the conductive polymer is a material with a conjugated main electron system in a main chain and can reach a conductive state through doping; specifically polyacetylene, polythiophene, polypyrrole, polyaniline, polyphenylene ethylene or polydiyne;
the ionic liquid is composed of cations and anions; the cation is quaternary ammonium salt ion, quaternary phosphonium salt ion or imidazole salt ion; the anion is halogen ion, tetrafluoroborate ion or hexafluorophosphate ion;
the liquid metal is pure metal or alloy with the melting point at room temperature; specifically, it may be gallium, gallium indium tin zinc, indium tin, bismuth indium tin, or bismuth indium tin lead.
5. The method according to any one of claims 1-4, wherein: the metal material and the electroacoustic coupling material are connected by metal bonds, covalent bonds or van der waals forces;
the electro-acoustic coupling material and the organic material are connected by covalent bonds, hydrogen bonds, or van der waals forces.
6. The method according to any one of claims 1-5, wherein: the connection method of the metal material and the electroacoustic coupling material comprises soaking, spin coating, magnetron sputtering, high-temperature corrosion or electroplating;
the connection method of the electroacoustic coupling material and the organic material comprises soaking, spin coating, magnetron sputtering, high-temperature corrosion or electroplating.
7. A composite material comprises a metal material, an electroacoustic coupling material and an organic material which are connected in sequence.
8. The composite material of claim 7, wherein: the metal material and the organic material are connected in a planar form; or the like, or, alternatively,
the metallic material is dispersed in a matrix of organic material.
9. The composite material according to claim 7 or 8, characterized in that: the electro-acoustic coupling material is a material with the electric conductivity between that of a metal material and that of an organic material, and comprises a conductive polymer, ionic liquid or liquid metal;
the metal material is one of pure metals of aluminum, copper, iron and nickel and alloys thereof;
the organic material is high molecular polymer or silicone oil;
specifically, the conductive polymer is a material with a conjugated main electron system in a main chain and can reach a conductive state through doping; more specifically polyacetylene, polythiophene, polypyrrole, polyaniline, polyphenylene ethylene or polydiyne;
specifically, the ionic liquid is composed of a cation and an anion; the cation is quaternary ammonium salt ion, quaternary phosphonium salt ion or imidazole salt ion; the anion is halogen ion, tetrafluoroborate ion or hexafluorophosphate ion;
specifically, the liquid metal is a pure metal or an alloy with a melting point at room temperature; more specifically gallium, gallium indium tin zinc, indium tin, bismuth indium tin, or bismuth indium tin lead.
10. The composite material according to any one of claims 7-9, characterized in that: the metal material and the electroacoustic coupling material are connected by metal bonds, covalent bonds or van der waals forces;
the electro-acoustic coupling material and the organic material are connected by covalent bonds, hydrogen bonds or van der waals forces;
specifically, the connection method of the metal material and the electroacoustic coupling material can be soaking, spin coating, magnetron sputtering, high-temperature corrosion or electroplating;
the connection method of the electroacoustic coupling material and the organic material can be soaking, spin coating, magnetron sputtering, high-temperature corrosion or electroplating.
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