CN113624050B - High-efficiency high-reliability flat heat pipe - Google Patents
High-efficiency high-reliability flat heat pipe Download PDFInfo
- Publication number
- CN113624050B CN113624050B CN202110953124.1A CN202110953124A CN113624050B CN 113624050 B CN113624050 B CN 113624050B CN 202110953124 A CN202110953124 A CN 202110953124A CN 113624050 B CN113624050 B CN 113624050B
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- Prior art keywords
- silicon carbide
- heat pipe
- flat
- heat
- graphene
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 28
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 27
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 24
- 230000017525 heat dissipation Effects 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 4
- 239000012153 distilled water Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000005229 chemical vapour deposition Methods 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000002356 single layer Substances 0.000 claims description 2
- 230000002195 synergetic effect Effects 0.000 abstract description 2
- 239000002131 composite material Substances 0.000 abstract 1
- 239000011257 shell material Substances 0.000 description 12
- 239000011797 cavity material Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A high-efficiency high-reliability flat heat pipe relates to the technical field of flat heat pipes. The structure of the graphene-based composite material comprises a silicon carbide closed flat shell with high heat conductivity and high Young modulus, a heat dissipation working medium and a graphene interconnection array with a microporous structure and vertically grown. The graphene interconnection array with the microporous structure vertically grown is arranged inside the silicon carbide flat plate shell. The structure combines the advantages of high uniform heat of the flat heat pipe, high heat conduction in the graphene layer, high hardness and low thermal expansion coefficient of silicon carbide, and the synergistic effect of the advantages ensures that the flat heat pipe has good uniform heat and heat conduction performance and extremely small deformation under high-temperature working conditions, and is particularly suitable for heat dissipation of various high-power electronic devices.
Description
Technical Field
The invention relates to a high-efficiency high-reliability flat heat pipe, and belongs to the technical field of heat dissipation.
Technical Field
The high heat flux density generated inside the power electronics poses a great threat to the reliability of the device. The heat transfer problem even becomes a bottleneck for the device to develop toward miniaturization because the failure due to high temperature accounts for more than 50% of all electronic equipment failures. In addition to the highest temperature requirements, electronic components also require temperature uniformity. With the rapid development of microelectronics, miniaturization of electronic devices has become a dominant trend in the development of modern electronic devices. Electronic device feature sizes continue to decrease, chip integration, packaging density, and operating frequency continue to increase, all of which lead to rapid increases in chip heat flux density. The problem of heat dissipation of the circuit and its chip is particularly pronounced. The flat heat pipe has high heat conductivity and good temperature uniformity, and becomes one of the promising technologies for solving the electronic heat dissipation problem.
The whole structure of the common flat heat pipe is thicker, and the volume is larger, so that the heat pipe is difficult to adapt to the heat dissipation requirement of a microminiature electronic structure. Meanwhile, at present, the common heat pipe basically adopts metal as a sealing cavity, and the metal cavity is inevitably deformed, raised and the like in the process of conducting a large amount of heat during working, so that the heat resistance in the process of heat transfer is increased, and the performance of a device is reduced. In addition, the metal material and the material of the semiconductor device have larger thermal mismatch, which is easy to cause the separation of the flat heat pipe and the heating device, so that the heat conduction and heat dissipation performance of the flat heat pipe and the heating device are greatly reduced.
Disclosure of Invention
The invention aims to avoid the defects in the prior art and provides the high-efficiency high-reliability flat heat pipe which has the advantages of good heat homogenizing effect, high heat conductivity, good structural heat stability and compatibility with the existing semiconductor technology, and is particularly suitable for heat dissipation of various high-power electronic devices.
The aim of the invention is achieved by the following technical scheme:
a high-efficiency high-reliability flat heat pipe comprises a silicon carbide closed flat shell, a graphene interconnection array which is arranged in the silicon carbide closed flat shell and vertically grows in a microporous structure in thermal contact with the upper inner surface and the lower inner surface of the silicon carbide closed flat shell, and a heat dissipation working medium is further arranged in the silicon carbide closed flat shell.
In the technical scheme, the flat plate shell is made of single crystal silicon carbide with high heat conductivity coefficient of 120-160W/m.K, high Young modulus of 410Gpa and low thermal expansion coefficient of 4.4x10-6oC-1 point.
In the technical scheme, the closed flat plate shell made of the monocrystalline silicon carbide is of a hollow structure formed by bonding two mirror-symmetrical silicon carbide wafers with grooves.
In the technical scheme, the thickness of the silicon carbide closed flat plate shell is 0.5mm-1mm.
In the technical scheme, the vertically grown graphene has a single-layer single crystal structure.
In the technical scheme, the graphene vertically grown is transversely connected with each other to form a honeycomb microstructure, and the graphene has good capillary force and siphon force.
In the above technical scheme, the thickness of the graphene interconnection array is 100um-500um.
In the technical scheme, the heat dissipation working medium is any one or a mixture of distilled water, ethanol, methanol and glycol.
In the technical scheme, the volume filled by the heat dissipation working medium accounts for 5% -30% of the volume of the cavity in the silicon carbide flat plate shell.
By adopting the technical scheme, the invention has the following beneficial effects:
1. After the flat heat pipe is heated locally, the internally filled heat dissipation working medium can absorb a large amount of heat rapidly through the phase change process, and heat is quickly and evenly distributed along the in-plane direction of the flat heat pipe, so that the temperature of local hot spots can be greatly reduced, and structural collapse of a heating element caused by overhigh local temperature is avoided.
2. The heat dissipation working medium filled in the heat dissipation device can absorb heat from a liquid state to a gaseous state after being heated, and can transfer mass to the other surface of the flat heat pipe under the action of pressure gradient while absorbing a large amount of heat, so that the rapid heat dissipation is realized by combining with the heat sink outside the flat heat pipe.
3. The graphene interconnection array vertically grown in the flat plate heat pipe has extremely high heat conductivity in the vertical direction of the flat plate heat pipe, and the flat plate heat pipe can realize extremely high heat conductivity in the normal direction of the flat plate heat pipe by combining the phase change heat radiation of a heat radiation working medium.
4. The graphene interconnection array vertically grown in the flat plate heat pipe has a honeycomb microstructure and good capillary force and siphonage force, so that the flat plate heat pipe can absorb liquefied heat radiation working medium back to the vicinity of a heat source without adding an additional internal capillary structure.
5. The flat heat pipe is a closed shell prepared from the silicon carbide material, has the characteristics of high heat conductivity coefficient, high Young modulus and low thermal expansion coefficient, can not deform, bulge and the like in the high heat transmission process, can ensure that the temperature range of stable operation of the flat heat pipe is large, and is suitable for heat dissipation of high-power devices. In addition, the preparation of the silicon carbide material is compatible with the existing semiconductor device technology, and is very suitable for heat dissipation of semiconductor devices.
Drawings
The invention will be further described with reference to the accompanying drawings, in which embodiments do not constitute any limitation of the invention, and other drawings can be obtained by one of ordinary skill in the art without inventive effort from the following drawings.
FIG. 1 is a schematic structural diagram of a high efficiency and high reliability flat heat pipe of the present invention.
FIG. 2 is an exploded view of a high efficiency and high reliability flat heat pipe of the present invention.
FIG. 3 is a photograph of the top of a graphene microstructure array grown vertically in a honeycomb shape inside a high-efficiency high-reliability flat heat pipe.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
In order to facilitate the understanding of the invention, the invention will be further described with reference to the accompanying drawings. The drawings illustrate an exemplary embodiment of the invention. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, this embodiment is shown for the purpose of illustrating the disclosure in more detail.
1-3, This embodiment illustrates a high efficiency high reliability flat plate heat pipe comprising an enclosed cavity (shown in FIG. 1) made of silicon carbide material, and a honeycomb vertically grown graphene microstructure array inside the enclosed cavity.
The closed cavity is a hollow structure formed by bonding two mirror-symmetrical silicon carbide chips with grooves (an upper cover and a lower cover shown in fig. 2), and the external dimensions are as follows: 10mm long, 10mm wide and 1mm high; the internal hollow size is: length 8mm, width 8mm, height 0.4mm.
The hollow structure in the closed cavity is filled with the honeycomb-shaped vertically-grown graphene microstructure array, the honeycomb-shaped vertically-grown graphene microstructure array is directly grown in a groove (a lower cover) of a silicon carbide chip with a groove by utilizing a plasma chemical vapor deposition method, good thermal contact is formed, the growth time is controlled, and the height of the honeycomb-shaped vertically-grown graphene microstructure array is controlled to be 400um, so that the honeycomb-shaped vertically-grown graphene microstructure array and the concave surface in the upper cover form good thermal contact. Meanwhile, the graphene sheets vertically grown are mutually connected in the transverse direction, so that good transverse heat conduction is ensured.
Distilled water is filled in the closed cavity, and the filling amount is 10% of the volume of the closed cavity.
Because the selected cavity material belongs to the semiconductor silicon carbide material, the manufacturing process of the flat heat pipe is different from that of the conventional metal heat pipe. The upper cover and the lower cover with the grooves are respectively prepared by a chemical etching method. The upper cover and the lower cover are connected into a whole by a bonding method.
After the integral flat plate heat pipe is formed, the heat pipe has no upper and lower parts, and the use effect has mirror symmetry.
The high-efficiency high-reliability flat heat pipe has extremely high longitudinal heat conductivity under the synergistic effect of the heat dissipation working medium and the graphene. The heat generated by the heating element in thermal contact with the flat plate heat pipe can be quickly homogenized by the flat plate heat pipe due to the interconnection effect of the graphene in the transverse direction, and the heat is transferred to the other side by utilizing the extremely high longitudinal heat conductivity of the flat plate heat pipe.
Meanwhile, the flat heat pipe shell material shown in the embodiment is a silicon carbide material with high Young modulus, so that the high pressure generated by the heat dissipation working medium in the flat heat pipe shell material after phase change is converted into a gaseous state can be prevented from deforming or recessing, and the flat heat pipe shell material can ensure that the flat heat pipe is in good thermal contact with a heating element when in use, thereby ensuring high reliability.
Claims (6)
1. A high-efficient high reliability flat heat pipe, its characterized in that: the graphene interconnection array is arranged in the silicon carbide closed flat plate shell and is vertically grown with a micropore structure in thermal contact with the upper and lower inner surfaces of the silicon carbide closed flat plate shell, and a heat dissipation working medium is also arranged in the silicon carbide closed flat plate shell;
the vertically grown graphene is of a single-layer single-crystal structure, and the graphene is transversely connected with each other to form a honeycomb microstructure, so that the graphene has capillary force and siphon force;
the honeycomb-shaped vertically grown graphene microstructure array is directly grown in a groove of a silicon carbide chip with the groove by utilizing a plasma chemical vapor deposition method to form good thermal contact, the growth time is controlled, and the height of the honeycomb-shaped vertically grown graphene microstructure array is controlled to be 400um, so that the graphene microstructure array and the concave surface in the upper cover form thermal contact.
2. The high efficiency, high reliability flat plate heat pipe according to claim 1, wherein the flat plate housing is made of single crystal silicon carbide with high thermal conductivity of 120-160W/m-K, high young's modulus of 410Gpa, low thermal expansion of 4.4x -6 oC-1 points.
3. The efficient high-reliability flat heat pipe according to claim 2, wherein the closed flat shell made of monocrystalline silicon carbide is a hollow structure formed by bonding two mirror-symmetrical silicon carbide chips with grooves.
4. The high efficiency, high reliability flat plate heat pipe of claim 2 wherein the silicon carbide enclosed flat plate housing has a thickness of 0.5mm to 1mm.
5. The efficient high-reliability flat heat pipe according to claim 1, wherein the heat dissipation working medium is any one or a mixture of distilled water, ethanol, methanol and glycol.
6. The efficient high-reliability flat heat pipe according to claim 5, wherein the volume filled by the heat dissipation working medium is 5% -30% of the volume of the cavity inside the silicon carbide flat shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110953124.1A CN113624050B (en) | 2021-08-18 | 2021-08-18 | High-efficiency high-reliability flat heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110953124.1A CN113624050B (en) | 2021-08-18 | 2021-08-18 | High-efficiency high-reliability flat heat pipe |
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| Publication Number | Publication Date |
|---|---|
| CN113624050A CN113624050A (en) | 2021-11-09 |
| CN113624050B true CN113624050B (en) | 2024-04-26 |
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| CN202110953124.1A Active CN113624050B (en) | 2021-08-18 | 2021-08-18 | High-efficiency high-reliability flat heat pipe |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114657636A (en) * | 2022-04-06 | 2022-06-24 | 中国原子能科学研究院 | Metal organic chemical vapor deposition equipment |
| WO2024092617A1 (en) * | 2022-11-03 | 2024-05-10 | Nokia Shanghai Bell Co., Ltd. | Heat exchange apparatus and manufacturing method thereof |
Citations (5)
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|---|---|---|---|---|
| US20170182474A1 (en) * | 2015-12-28 | 2017-06-29 | Aruna Zhamu | Integral 3D graphene-carbon hybrid foam and devices containing same |
| CN111426226A (en) * | 2020-04-21 | 2020-07-17 | 福建永安市永清石墨烯研究院有限公司 | Graphene heat pipe and preparation method thereof |
| CN111473671A (en) * | 2020-04-21 | 2020-07-31 | 福建永安市永清石墨烯研究院有限公司 | Graphene VC soaking plate and preparation method thereof |
| US20200340756A1 (en) * | 2019-04-26 | 2020-10-29 | Nanotek Instruments, Inc. | Graphene-enhanced vapor-based heat transfer device |
| US20200413565A1 (en) * | 2019-06-28 | 2020-12-31 | Ctron Advanced Material Co., Ltd. | Heat conducting structure, manufacturing method thereof, and mobile device |
-
2021
- 2021-08-18 CN CN202110953124.1A patent/CN113624050B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170182474A1 (en) * | 2015-12-28 | 2017-06-29 | Aruna Zhamu | Integral 3D graphene-carbon hybrid foam and devices containing same |
| US20200340756A1 (en) * | 2019-04-26 | 2020-10-29 | Nanotek Instruments, Inc. | Graphene-enhanced vapor-based heat transfer device |
| US20200413565A1 (en) * | 2019-06-28 | 2020-12-31 | Ctron Advanced Material Co., Ltd. | Heat conducting structure, manufacturing method thereof, and mobile device |
| CN111426226A (en) * | 2020-04-21 | 2020-07-17 | 福建永安市永清石墨烯研究院有限公司 | Graphene heat pipe and preparation method thereof |
| CN111473671A (en) * | 2020-04-21 | 2020-07-31 | 福建永安市永清石墨烯研究院有限公司 | Graphene VC soaking plate and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| Shichen Xu.Advanced Functional Materials.2020,第200302（1-7）页. * |
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| CN113624050A (en) | 2021-11-09 |
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