CN113347778B - Printed circuit board and method for connecting common mode capacitor and switching device radiator - Google Patents
Printed circuit board and method for connecting common mode capacitor and switching device radiator Download PDFInfo
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- CN113347778B CN113347778B CN202110598985.2A CN202110598985A CN113347778B CN 113347778 B CN113347778 B CN 113347778B CN 202110598985 A CN202110598985 A CN 202110598985A CN 113347778 B CN113347778 B CN 113347778B
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- circuit board
- printed circuit
- top layer
- copper
- ground plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The embodiment of the application provides a printed circuit board and a method for connecting a common-mode capacitor and a switching device radiator, wherein the printed circuit board comprises: a TOP layer; the copper-clad layer is positioned on the surface of the TOP layer; the radiator is welded on the copper-clad layer; the switch device is welded on the TOP layer, and the heat dissipation surface of the switch device is tightly attached to the heat sink; and the common mode capacitor is electrically connected with the copper-clad layer. According to the printed circuit board in the embodiment of the application, the high-frequency impedance on the common-mode noise current return path can be effectively reduced, and the high-frequency current capacity of the common-mode capacitor is improved. In addition, in the actual circuit design, under the condition of realizing the same filtering effect, the using quantity of the common-mode capacitors can be reduced, and the product cost is reduced.
Description
Technical Field
The application relates to the field of printed circuit board manufacturing, in particular to a printed circuit board and a method for connecting a common-mode capacitor and a switching device radiator.
Background
In the prior art, a great number of semiconductor switching devices such as MOSFETs (metal-oxide semiconductor field effect transistors) are used in circuits such as a switching power supply and a servo control, and such devices have power loss in conduction and switching transient states, and in actual products, a heat dissipation surface of the device needs to be attached to a metal heat sink for heat dissipation (adhered by a heat conductive insulating material). The switching devices generate high frequency common mode noise during the on and off transients, which noise current does not pass through the intended circuit but instead enters the reference ground along the distributed capacitance of the thermally conductive and insulating material, e.g., a metal heat sink, as shown in fig. 3, where Cs is the distributed capacitance of the thermally conductive and insulating material. In order to control the return path of the common mode noise current and minimize the loop area, a common mode capacitor Cy is generally designed at a suitable location such as the power interface, and the reference ground is connected to the high end and the low end of the power input. Cy requires passing high frequency current and therefore very small parasitic and lead inductances are necessary to reduce the high frequency impedance.
In the circuit design, cy generally has two packaging forms of pin and surface mount, and pin capacitors and reference ground are generally connected by direct welding, wherein the reference ground is generally a metal conductor shell or a bracket, although the connection mode does not introduce large parasitic inductance, the lead inductance of the capacitors cannot be ignored, and large high-frequency impedance is caused; the surface-mounted capacitor does not have a lead inductance, and is generally used for a high-frequency common-mode filter capacitor in the design of a printed circuit board, but the surface-mounted capacitor cannot be directly welded with a radiator of a switching device, and only can be welded on a reference ground plane in the printed circuit board firstly, and a metalized hole of the reference ground is electrically connected with the radiator through standard parts such as a screw and the like, so that the loop impedance is increased due to the existence of the screw and a mounting contact surface, and the high-frequency performance of the surface-mounted capacitor is poor.
Disclosure of Invention
The application aims to provide a printed circuit board and a method for connecting a common-mode capacitor and a switching device radiator so as to reduce impedance between the common-mode capacitor and the switching device radiator and improve high-frequency through-current capacity of the common-mode capacitor and the switching device radiator. In order to achieve the above purpose, the present application provides the following technical solutions:
an embodiment of a first aspect of the present application provides a printed circuit board, including: a TOP layer; the copper-clad layer is positioned on the surface of the TOP layer; the radiator is welded on the copper-clad layer; the switch device is welded on the TOP layer, and the heat dissipation surface of the switch device is tightly attached to the heat sink; and the common mode capacitor is electrically connected with the copper-clad layer.
According to the printed circuit board provided by the embodiment of the application, the TOP layer of the printed circuit board is coated with copper, the position coated with copper is used as a reference ground plane, a radiator matched with the reference ground plane is manufactured, the radiator is directly welded on the reference ground plane of the TOP layer of the printed circuit board, a switch device is welded on the TOP layer of the printed circuit board, and the common-mode capacitor is electrically connected with the reference ground plane. The printed circuit board in the embodiment of the application can effectively reduce high-frequency impedance on a common-mode noise current return path and improve high-frequency current capacity of the common-mode capacitor. In addition, in the actual circuit design, under the condition of realizing the same filtering effect, the using quantity of the common-mode capacitors can be reduced, and the product cost is reduced.
In addition, according to the embodiment of the application, the following additional technical features can be provided:
in some embodiments of the present application, the electronic component further includes an electronic component, the electronic component is electrically connected to the TOP layer, the TOP layer includes an electronic component region and a blank region, the electronic component is disposed in the electronic component region, and the copper-clad layer covers the blank region.
In some embodiments of the present application, the heat spreader may completely cover the copper clad layer.
In some embodiments of the present application, a heat conducting and insulating material is disposed at a portion where the heat sink abuts against the switching device.
An embodiment of another aspect of the present application provides a method for connecting a common-mode capacitor to a heat sink of a switching device, where the method includes: covering copper on a TOP layer of the printed circuit board, and taking the copper-covered part as a reference ground plane; manufacturing a radiator matched with the reference ground plane; soldering the heat sink directly onto the reference ground plane of the TOP layer of the printed circuit board; welding a switching device on the TOP layer of the printed circuit board; and electrically connecting the common-mode capacitor with the reference ground plane.
According to the method for connecting the common mode capacitor and the heat radiator of the switching device, copper is coated on the TOP layer of the printed circuit board, and the position coated with the copper is used as a reference ground plane; manufacturing a radiator matched with the reference ground plane; directly welding the radiator on a reference ground plane of a TOP layer of the printed circuit board; welding a switching device on a TOP layer of the printed circuit board; and electrically connecting the common mode capacitor with the reference ground plane. By the method, the high-frequency impedance on the common-mode noise current return path can be effectively reduced, and the high-frequency through-current capacity of the common-mode capacitor is improved. In addition, in the actual circuit design, under the condition of realizing the same filtering effect, the using quantity of the common-mode capacitors can be reduced, and the product cost is reduced.
In some embodiments of the present application, the step of electrically connecting the common mode capacitor to the reference ground plane includes: and welding the common-mode capacitor on the printed circuit board and the reference ground plane of the TOP layer of the printed circuit board together.
In some embodiments of the present application, the step of fabricating a heat sink adapted to the reference ground plane comprises: and manufacturing a radiator with the shape identical to that of the reference ground plane.
In some embodiments of the present application, the step of coating copper on the TOP layer of the printed circuit board comprises: and copper is coated on the TOP layer of the printed circuit board where no electronic component is welded.
In some embodiments of the present application, the step of electrically connecting the common mode capacitor to the reference ground plane includes: and welding a common mode capacitor on the printed circuit board and the BOTTOM layer of the printed circuit board together, and connecting the BOTTOM layer of the printed circuit board and the reference ground plane through a through hole.
In some embodiments of the present application, after the switching device is soldered on the TOP layer of the printed circuit board, the heat dissipation surface of the switching device is attached to the surface of the heat sink through a heat conductive insulating material;
drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Like parts are designated with like reference numerals throughout the drawings. In the drawings:
FIG. 1 is a schematic cross-sectional view of a printed circuit board in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a TOP view of a TOP layer of a printed circuit board according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a common mode capacitor and a heat sink of a switching device in the prior art.
Detailed Description
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and it is also obvious for a person skilled in the art to obtain other embodiments according to the drawings.
For convenience in description, the relationship of one element or feature to another element or feature as illustrated in the figures may be described herein using spatially relative terms, such as "inner", "outer", "lower", "below", "upper", "over", and the like. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the description herein are intended to be within the scope of the present disclosure.
As shown in fig. 1, an embodiment of the first aspect of the present application provides a printed circuit board, including: a TOP layer 10; a copper-clad layer 20, wherein the copper-clad layer 20 is positioned on the surface of the TOP layer 10; a heat sink 30, wherein the heat sink 30 is welded on the copper-clad layer 20; the switching device 40, the switching device 40 is welded on the TOP layer 10, and the heat dissipation surface of the switching device 40 is attached to the heat sink 30; and the common mode capacitor 50 is electrically connected with the copper-clad layer 20.
The TOP layer of the printed circuit board, also called as the TOP layer of the printed circuit board, according to the printed circuit board provided by the embodiment of the application, the TOP layer 10 of the printed circuit board is provided with a copper-coated layer 20, the position coated with the copper is used as a reference ground plane, a radiator 30 matched with the reference ground plane is manufactured, the radiator 30 is directly welded on the reference ground plane of the TOP layer 10 of the printed circuit board, a switching device 40 is welded on the TOP layer 10 of the printed circuit board, and a common mode capacitor 50 is electrically connected with the reference ground plane. The printed circuit board in the embodiment of the application can effectively reduce the high-frequency impedance on the common mode noise current backflow path and improve the high-frequency current capacity of the common mode capacitor 50. In addition, in the actual circuit design, under the condition of realizing the same filtering effect, the number of the common mode capacitors 50 can be reduced, and the product cost can be reduced.
As shown in fig. 2, in some embodiments of the present application, the printed circuit board further includes an electronic component 60, the electronic component 60 is electrically connected to the TOP layer 10, the TOP layer 10 of the printed circuit board includes an electronic component area 80 and a blank area 70, the electronic component 60 is disposed in the electronic component area 80, and the copper-clad layer 10 covers the blank area 70, that is, when copper is clad, a large area of copper is clad in the TOP layer 10 of the printed circuit board where the electronic component 60 is not soldered, and the impedance can be more effectively reduced by the large area of copper.
In some embodiments of the present application, the heat spreader 30 may completely cover the copper-clad layer 20, and in the embodiments of the present application, after the copper-clad layer is completed, the heat spreader 30 having the same shape as the copper-clad layer 20 is fabricated.
In some embodiments of the present application, the heat sink 30 is provided with a thermally conductive and insulating material adjacent to the switching device 40. It can be understood that, by attaching the heat dissipation surface of the switching device 40 to the surface of the heat sink 30 through the heat conductive insulating material, the switching device 40 can dissipate heat while ensuring the insulating performance.
An embodiment of another aspect of the present application provides a method for connecting a common-mode capacitor to a heat sink of a switching device, where the method includes: s10, coating copper on the TOP layer 10 of the printed circuit board, and taking the copper-coated layer as a reference ground plane; s20, manufacturing a radiator 30 matched with the reference ground plane; s30, directly welding the radiator 30 on the reference ground plane of the TOP layer 10 of the printed circuit board; s40, welding a switching device 40 on the TOP layer 10 of the printed circuit board; and S50, electrically connecting the common mode capacitor 50 with the reference ground plane.
According to the connection method of the common mode capacitor and the radiator of the switching device, copper is coated on the TOP layer 10 of the printed circuit board, and the copper-coated layer 20 is used as a reference ground plane; manufacturing a radiator 30 matched with the reference ground plane; the heat sink 30 is soldered directly to the reference ground plane of the TOP layer 10 of the printed circuit board; soldering the switching device 40 to the TOP layer 10 of the printed circuit board; the common mode capacitor 50 is electrically connected to the reference ground plane. Exemplarily, as shown in fig. 2, which is a schematic circuit diagram of a TOP layer of a printed circuit board, no copper is coated in a region where an electronic component 60 is welded in the TOP layer 10 of the printed circuit board, copper is coated on the region where the electronic component 60 is not welded, the copper-coated layer 20 is used as a reference ground plane, a corresponding heat sink 30 is manufactured, the heat sink 30 is directly welded on the reference ground plane of the TOP layer 10 of the printed circuit board, and a switching device 40 is welded on the TOP layer 10 of the printed circuit board; the common mode capacitor 50 is electrically connected with the reference ground plane, and the high-frequency impedance on the common mode noise current return path can be effectively reduced through the method, so that the high-frequency through-current capacity of the common mode capacitor is improved. In addition, in the actual circuit design, under the condition of realizing the same filtering effect, the number of the common mode capacitors 50 can be reduced, and the product cost can be reduced.
In some embodiments of the present application, the step of electrically connecting the common mode capacitor 50 with the reference ground plane includes: as an optional technical solution in the embodiment of the present application, the common mode capacitor 50 on the printed circuit board is soldered to the reference ground plane of the TOP layer 10 of the printed circuit board, and the common mode capacitor 50 is electrically connected to the reference ground plane in such a manner that the common mode capacitor 50 on the printed circuit board is soldered to the reference ground plane of the TOP layer 10 of the printed circuit board, that is, the common mode capacitor 50 is directly soldered to the copper-clad layer 20 of the TOP layer 10 of the printed circuit board, and the common mode capacitor 50 is soldered to the copper-clad TOP layer 10, so that the resistance of the signal returning to the ground can be reduced.
In some embodiments of the present application, the step of fabricating the heat sink 30 adapted to the reference ground plane comprises: the heat sink 30 is made to have the same shape as the reference ground plane, and in the embodiment of the present application, the shape of the heat sink 30 is the same as the shape of the reference ground plane.
In some embodiments of the present application, the step of coating copper on TOP layer 10 of the printed circuit board comprises: copper is coated on the part, where the electronic component 60 is not welded, of the TOP layer 10 of the printed circuit board, in the embodiment of the application, copper is coated on the part, where the electronic component 60 is not welded, of the TOP layer 10 of the printed circuit board, specifically, copper is coated on the part, where the electronic component 60 is not welded, of the TOP layer 10 of the printed circuit board in a large area, through the large area of copper, the passing current can be increased, and the signal ground resistance is reduced.
In some embodiments of the present application, the step of electrically connecting the common mode capacitor 50 with the reference ground plane includes: common mode electric capacity 50 on with printed circuit board can be in the same place with printed circuit board's BOTTOM layer welding, and connect printed circuit board's BOTTOM layer and reference ground plane through the through-hole, that is to say, as another technical scheme of this application embodiment, common mode electric capacity 50 on the printed circuit board can be in the same place with printed circuit board's BOTTOM layer welding, and it connects printed circuit board's BOTTOM layer and reference ground plane through the through-hole, can be according to printed circuit board's design demand like this, can weld common mode electric capacity 50 on printed circuit board's BOTTOM layer.
In some embodiments of the present application, after the switching device 40 is soldered on the TOP layer 10 of the printed circuit board, the heat dissipation surface of the switching device 40 is attached to the surface of the heat sink 30 through a heat conductive insulating material, and it can be understood that the heat dissipation surface of the switching device 40 is attached to the surface of the heat sink 30 through a heat conductive insulating material, so that the switching device 40 can dissipate heat while ensuring insulation performance.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
The embodiments of the present application are described in a related manner, and the same and similar parts among the embodiments can be referred to each other, and each embodiment focuses on the differences from the other embodiments.
The above description is only for the preferred embodiment of the present application, and is not intended to limit the scope of the present application. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application are included in the scope of protection of the present application.
Claims (6)
1. A printed circuit board, comprising:
a TOP layer;
the copper-clad layer is positioned in the empty board area on the surface of the TOP layer and is used as a reference ground plane;
the radiator is welded on the copper-clad layer;
the switch device is welded on the TOP layer and is tightly attached to the heat radiator;
the common-mode capacitor is directly welded on the copper-clad layer;
or the like, or a combination thereof,
the common mode capacitor and the BOTTOM layer are welded together and connected with the BOTTOM layer and the reference ground plane through a through hole.
2. The printed circuit board of claim 1, further comprising an electronic component electrically connected to the TOP layer, wherein the TOP layer comprises an electronic component area and a blank area, the electronic component is disposed in the electronic component area, and the copper-clad layer covers the blank area.
3. The printed circuit board of claim 1, wherein the heat sink completely covers the copper-clad layer when the common mode capacitor is soldered to the BOTTOM layer and the BOTTOM layer is connected to the reference ground plane by a via.
4. The printed circuit board of claim 1, wherein the heat sink is provided with a thermally conductive and insulating material at a location adjacent to the switching device.
5. A method of connecting a common mode capacitor to a switching device heat sink comprising the printed circuit board of claim 1, wherein when the common mode capacitor is soldered to the BOTTOM layer and the BOTTOM layer is connected to the reference ground plane by a via, the method comprises:
covering copper on the TOP layer of the printed circuit board where no electronic component is welded, and taking the copper-covered part as a reference ground plane;
manufacturing a radiator with the shape identical to that of the reference ground plane;
soldering the heat sink directly onto the reference ground plane of the TOP layer of the printed circuit board;
welding a switch device on the TOP layer of the printed circuit board, wherein the heat dissipation surface of the switch device is tightly attached to the heat sink;
and welding the common-mode capacitor on the printed circuit board and the BOTTOM layer of the printed circuit board together, and connecting the BOTTOM layer of the printed circuit board and the reference ground plane through a through hole.
6. The method as claimed in claim 5, wherein after the soldering of the switching device on the TOP layer of the printed circuit board, the heat dissipation surface of the switching device is adhered to the surface of the heat sink through a heat conductive insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110598985.2A CN113347778B (en) | 2021-05-31 | 2021-05-31 | Printed circuit board and method for connecting common mode capacitor and switching device radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110598985.2A CN113347778B (en) | 2021-05-31 | 2021-05-31 | Printed circuit board and method for connecting common mode capacitor and switching device radiator |
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| CN113347778A CN113347778A (en) | 2021-09-03 |
| CN113347778B true CN113347778B (en) | 2023-02-28 |
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| CN113347778A (en) | 2021-09-03 |
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