CN112375383A - Piezoresistive rubber composite material for robot touch sensor and preparation method thereof - Google Patents

Piezoresistive rubber composite material for robot touch sensor and preparation method thereof Download PDF

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CN112375383A
CN112375383A CN202011112163.0A CN202011112163A CN112375383A CN 112375383 A CN112375383 A CN 112375383A CN 202011112163 A CN202011112163 A CN 202011112163A CN 112375383 A CN112375383 A CN 112375383A
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piezoresistive
glass plate
composite material
piezoresistive rubber
touch sensor
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曹建国
程春福
周建辉
范阳
李洋
缪存孝
孔宁
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University of Science and Technology Beijing USTB
Shunde Graduate School of USTB
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University of Science and Technology Beijing USTB
Shunde Graduate School of USTB
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K3/041Carbon nanotubes
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
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    • C08K3/042Graphene or derivatives, e.g. graphene oxides
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5425Silicon-containing compounds containing oxygen containing at least one C=C bond
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
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    • C08K5/549Silicon-containing compounds containing silicon in a ring
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/02Ingredients treated with inorganic substances
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/003Measuring arrangements characterised by the use of electric or magnetic techniques for measuring position, not involving coordinate determination
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/18Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J2383/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04Polysiloxanes
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    • C08K2003/085Copper
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • C08K2003/0862Nickel
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives

Abstract

The invention provides a piezoresistive rubber composite material for a robot touch sensor and a preparation method thereof, belonging to the field of robot flexible touch sensor materials and preparation thereof. The mass ratio of the conductive filler to the silicone rubber Polydimethylsiloxane (PDMS) is 1: 5-1: 2, the mass ratio of resin in the PDMS to a curing agent is 5-10:1, the mixture is poured onto a glass plate after being uniformly mixed, the glass plate is placed in a vacuum environment for degassing, glass sheets with the thickness of 0.5-1mm are placed at the four corners of the glass plate after degassing, another glass plate is placed on the glass sheets, and the glass sheets are placed in a thermostat for a period of time to prepare the piezoresistive rubber with the thickness of 0.5-1 mm. The invention adopts PDMS base material with good flexibility, good mechanical property and high chemical inertia, adds conductive filler with smaller granularity, and reasonably designs the proportion among the components, so that the piezoresistive effect is more obvious while the piezoresistive rubber takes the flexibility into consideration. The method has simple process, and the prepared piezoresistive rubber has good flexibility and elasticity and remarkable piezoresistive property, and can be attached to the curved surface joint of the robot to measure pressure information.

Description

Piezoresistive rubber composite material for robot touch sensor and preparation method thereof
Technical Field
The invention belongs to the field of robot flexible touch sensor materials and preparation thereof, and particularly relates to a piezoresistive rubber composite material for a robot touch sensor and a preparation method thereof.
Background
The resistive touch sensor detects the position and the magnitude of an applied force by using the change of the resistance value of the sensing unit, and is most widely applied because the principle is simple and the cost is generally low. The traditional resistance type touch sensor is usually prepared by using a semiconductor silicon material, when the semiconductor silicon material is stressed, the change of an energy band is caused, the energy of an energy valley moves, the resistivity of the energy valley changes, and the resistance value changes. Although the touch sensor prepared from the semiconductor silicon material has the advantages of high sensitivity and good stability, the silicon material is brittle and hard, so that curved surface arrangement is difficult to realize, and the flexibility is poor. In order to achieve flexibility, conductive polymer materials formed by filling conductive materials such as conductive particles, conductive nanosheets, and the like in a polymer matrix are increasingly being applied to the field of tactile sensors. The electronic skin touch sensor made of the conductive composite material has very good flexibility and can be better attached to curved surfaces of fingers, wrists and the like of a robot.
When the piezoresistive rubber is not stressed, the conductive particles in the piezoresistive rubber are separated and blocked by the insulated rubber material to present an insulated state (an insulated area); under the action of external force, the intervals between the conductive particles are gradually reduced until the conductive particles are contacted with each other, so that a complete conductive path is formed, and the resistance value change (seepage zone) is caused. When the pressure is increased to a certain value, the number of conductive paths approaches saturation, and the influence of the pressure increase on the conductive paths is small, so that the resistivity tends to be flat (conductive region). Only when the piezoresistive rubber works in a seepage area, the pressure change sensed by the piezoresistive rubber can be converted into the change of the resistance value, and the core of the resistance type touch sensor for realizing pressure measurement is realized.
Therefore, aiming at the different working pressures of the application occasions of the touch sensor, the proportion of the silicon rubber, the conductive material, the Polydimethylsiloxane (PDMS) and the thickness of the piezoresistive rubber are correspondingly adjusted, so that the piezoresistive rubber can have flexibility and elasticity to be attached to the joints of the robot and the like, and the piezoresistive rubber is in a 'seepage area' in the measuring process.
Disclosure of Invention
The invention provides a piezoresistive rubber composite material for a robot tactile sensor and a preparation method thereof, aiming at solving the problems that the tactile sensor prepared from a semiconductor silicon material is difficult to realize curved surface arrangement, the flexibility is poor and a conductive area where piezoresistive rubber is located is unstable when the piezoresistive rubber works.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
in one aspect, the present invention provides a piezoresistive rubber composite for a robotic tactile sensor, the composite comprising a polydimethylsiloxane matrix and a conductive filler.
Further, the conductive filler comprises graphene, carbon nano tubes, micron nickel powder, silver-plated copper powder and copper-plated nickel powder.
Further, the mass ratio of the polydimethylsiloxane to the conductive filler is 1: 5-1: 2.
Furthermore, the particle size of the conductive filler is 10-100 μm.
In another aspect, the present invention provides a method for preparing a piezoresistive rubber composite material for a robot tactile sensor, comprising the steps of:
s101: respectively weighing polydimethylsiloxane and conductive filler, and fully mixing;
s102: adding a curing agent into the mixture, and mixing and stirring;
s103: pouring the viscous liquid prepared in the step S102 onto a glass plate, and placing the glass plate in a vacuum environment to remove bubbles generated during stirring;
s104: placing four glass sheets at four corners of the glass plate respectively, and slowly covering the other glass plate on the four glass sheets;
s105: and (3) placing the glass plate in a thermostat, and preserving the temperature for a period of time to obtain the piezoresistive rubber.
Further, the curing agent in step S102 includes, but is not limited to, one or more of vinyltriethoxysilane, vinyltrimethoxysilane, octamethylcyclotetrasiloxane, butadienyltriethoxysilane, vinyltriperoxide-t-butylsilane, preferably octamethylcyclotetrasiloxane; the mass ratio of the curing agent to the polydimethylsiloxane is 1: 5-10.
Further, the processing time of the glass plate in the vacuum environment in step S103 is 50-80 min.
Further, the thickness of the glass sheet in step S104 is 0.5 to 1 mm.
Further, in the step S105, the heat preservation temperature is 50-70 ℃, and the heat preservation time is 4-6 hours.
Further, the thickness of the piezoresistive rubber in step S105 is 0.5-1 mm.
The technical scheme provided by the embodiment of the invention has the following beneficial effects:
the base material of the invention adopts PDMS with good flexibility and elasticity, and the material has good mechanical property and high chemical inertia; the conductive filler with smaller granularity is mixed with the base material, and the small size effect is beneficial to ensuring the flexibility and elasticity of the piezoresistive rubber; by reasonably adjusting the proportion of the PDMS to the conductive filler and the PDMS, the piezoresistive effect of the rubber material is more obvious while the flexibility and the elasticity are considered. The invention not only has simple process, but also the prepared piezoresistive rubber has good flexibility and elasticity and obvious piezoresistive property, can be attached to the curved surface joint of the robot to measure the pressure information, and can also have larger signal output even if the applied pressure is smaller.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a flow chart of the piezoresistive rubber manufacturing process of the present invention;
FIG. 2 is a characteristic curve of piezoresistive rubber prepared by mixing different silicon rubber and micron nickel powder according to a mass ratio of PDMS as a PDMS main agent to a curing agent of 10:1 and a thickness of the piezoresistive rubber of 1 mm;
FIG. 3 is a characteristic curve of piezoresistive rubber prepared from different PDMS main agents and curing agents when the ratio of silicone rubber to micron nickel powder is 1:3.5 and the thickness of the piezoresistive rubber is 1 mm;
FIG. 4 shows that the mass ratio of the PDMS main agent to the curing agent is 10:1, the proportion of the PDMS main agent to the curing agent is 3.5:1, and the piezoresistive rubber with different thicknesses has a characteristic curve.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
The invention provides a piezoresistive rubber composite material for a robot touch sensor, which comprises a conductive filler and silicon rubber, wherein the composite material comprises a polydimethylsiloxane matrix and the conductive filler.
Further, the conductive filler comprises graphene, carbon nano tubes, micron nickel powder, silver-plated copper powder and copper-plated nickel powder. As a preferred embodiment of the invention, the conductive filler is micron nickel powder, and the particle size of the micron nickel powder is 10-100 μm. The micron nickel powder has good conductivity, low price, wear resistance, large area and long-term use.
Further, the mass ratio of the polydimethylsiloxane to the conductive filler is 1: 5-1: 2.
From the viewpoint of flexibility, the higher the composition of the conductive filler, the more hard particles are present in the piezoresistive rubber, and the poorer the flexibility is; in terms of the conductive performance of the piezoresistive rubber, the higher the composition of the conductive filler, the more conductive paths exist in the piezoresistive rubber itself, and the less sensitive it is to pressure, and conversely, too low a composition of the conductive filler may cause the piezoresistive rubber itself to be insulated and insensitive to pressure. Therefore, the selection and the proportion of the conductive filler have great influence on the performance of the piezoresistive rubber.
The invention also provides a preparation method of the piezoresistive rubber composite material for the robot touch sensor, which comprises the following five steps of material preparation, curing agent addition, bubble removal and glass pressing, and curing, as shown in figure 1:
s101, preliminary mixing of ingredients
Respectively weighing polydimethylsiloxane and conductive filler, pouring 1 part of PDMS prepolymer and 2-5 parts of conductive filler into a beaker for mixing, and slowly stirring by using a stirring rod to prevent the tip of the surface of the conductive filler from being damaged, thereby obtaining a uniformly mixed viscous liquid mixture;
s102, adding a curing agent
Adding a curing agent into the mixture, and stirring and mixing uniformly;
s103, removing bubbles
0.1-0.2 parts of curing agent is added to the mixture and slowly stirred. Mixing occurs during the addition of the curing agent, generating a large number of bubbles. In order to remove bubbles and ensure the uniformity of the mixture, the mixture is poured on a glass plate to stand, and then the mixture is placed in a vacuum environment for treatment for 50-80 min. Under vacuum, the bubbles can be slowly released.
S104, pressing the glass plate
The mixture is placed in a normal temperature environment, and the mixture naturally flows until the upper surface is smooth. Taking four glass sheets with the thickness of 0.5-1mm to surround the mixture, and slowly pressing and covering another glass plate above the glass sheets and the mixture to obtain piezoresistive rubber with the thickness consistent with that of the glass sheets;
s105, putting the tightly fixed glass plate-mixture-glass plate whole body into a thermostat with the temperature of 50-70 ℃, preserving heat for 4-6 hours, curing the glass plate-mixture-glass plate, and slowly tearing off the glass plate-mixture-glass plate to obtain the piezoresistive rubber.
FIG. 2 shows that the mass ratio of PDMS as the main agent to the curing agent is 10:1, when the thickness of the piezoresistive rubber is 1mm, the piezoresistive rubber has a characteristic curve of different ratios of silicon rubber and micron nickel powder. As can be seen from FIG. 2, when the nickel powder content is reduced, as shown in the two curves of the ratio of 1:3.25 to 1:3.0 between the silicone rubber and the micron nickel powder, the piezoresistive rubber is not very sensitive to a small pressure, and when the pressure reaches about 800kPa, the resistance starts to change significantly, and a large pressure can be detected. When the nickel powder content is high, a conductive path and a tunneling path are easily formed inside the piezoresistive rubber, for example, two curves of the ratio of the silicon rubber to the micron nickel powder being 1:3.75 and 1:4.0, and when the pressure is 0-200 kPa, the resistance change of the piezoresistive rubber is very sensitive to the pressure. When the pressure reaches about 400kPa, the piezoresistive rubber enters the conductive area, the resistance value is very small, the resistance value change is slight along with the increase of the pressure, and the detection of the wide-range pressure is not facilitated. The silicon rubber and the micron nickel powder have a piezoresistive characteristic curve with a ratio of 1:3.5, are sensitive to pressure in the whole pressure range, and can realize tiny pressure detection and measurement of pressure in a larger range.
FIG. 3 is a characteristic curve of piezoresistive rubber prepared from different PDMS main agents and curing agents when the ratio of silicone rubber to micron nickel powder is 1:3.5 and the thickness of the piezoresistive rubber is 1 mm. As can be seen from fig. 3, although the piezoresistive rubber prepared by two PDMS two-component ratios has good piezoresistive characteristics, the piezoresistive characteristic curve of the sample is relatively flat when the mass ratio of the main agent to the curing agent is 6:1, and the change of the resistance value of the sample is not as obvious as when the mass ratio of the main agent to the curing agent is 10: 1.
FIG. 4 is a characteristic curve of piezoresistive rubber with different thicknesses, wherein the mass ratio of the PDMS main agent to the curing agent is 10:1, the ratio of the PDMS main agent to the curing agent is 3.5-1. As can be seen from fig. 4, the initial resistance of the piezoresistive rubber with a thickness of 0.5mm is an order of magnitude lower than the initial resistance of the piezoresistive rubber with the other two thicknesses, the resistance value from the insulating region to the conductive region varies by an order of magnitude lower than the piezoresistive rubber with the other two thicknesses, and the piezoresistive properties are not as significant as those with the other two thicknesses. The pressure sensitivity of the piezoresistive rubber with the thickness of 0.8mm is very close to that of the piezoresistive rubber with the thickness of 1mm, which shows that the thickness is no longer a key factor influencing the piezoresistive characteristics.
According to the invention, through the reasonable design of the selection and the proportion of the conductive filler, the piezoresistive effect is more obvious while the flexibility and the elasticity of the rubber material are considered. The invention not only has simple process, but also the prepared piezoresistive rubber has good flexibility and elasticity and obvious piezoresistive property, can be attached to the curved surface joint of the robot to measure the pressure information, and can also have larger signal output even if the applied pressure is smaller.
The present invention will be described in further detail below with reference to several specific examples in order to better illustrate embodiments of the present invention.
Example 1
The embodiment provides a preparation method of a piezoresistive rubber composite material for a robot touch sensor, which comprises the following steps:
step S111, batching: weighing the components according to the mass ratio, putting 1 part of polydimethylsiloxane and 3.5 parts of micron nickel powder in a beaker, and uniformly mixing to obtain a viscous liquid;
step S112, adding 0.1 part of octamethylcyclotetrasiloxane into a beaker, continuously and slowly stirring, and fully mixing the viscous liquid prepared in the step 111 with a curing agent to obtain further mixed viscous liquid;
step S113, removing bubbles: pouring the viscous liquid prepared in the step S112 onto a glass plate, placing the glass plate in a vacuum environment for 60 minutes, and removing bubbles generated during stirring;
step S114, pressing the glass plate: after the treatment of the step S113, four glass sheets with the thickness of 0.8mm are placed at four corners of the glass plate, and the other glass plate is slowly covered on the four glass sheets;
step S115, curing: and (4) putting the glass plate processed in the step (S114) into a thermostat at 70 ℃, preserving heat for 4 hours, and cutting the prepared piezoresistive rubber into a wafer with the diameter of 5mm, namely, the piezoresistive rubber with the thickness of 0.8mm is prepared.
Example 2
Step S121, batching: weighing the components according to the mass ratio, putting 1 part of polydimethylsiloxane and 5 parts of micron nickel powder in a beaker, and uniformly mixing to obtain a viscous liquid;
step S122, adding 0.1 part of octamethylcyclotetrasiloxane into a beaker, continuously and slowly stirring, and fully mixing the viscous liquid prepared in the step 121 with a curing agent to obtain further-mixed viscous liquid;
step S123, removing bubbles: pouring the viscous liquid prepared in the step S122 onto a glass plate, placing the glass plate in a vacuum environment for 60 minutes, and removing bubbles generated during stirring;
step S124, pressing the glass plate: after the treatment of the step S123, placing four glass sheets with the thickness of 0.5mm at four corners of the glass plate, and slowly covering the other glass plate on the four glass sheets;
step S125, curing: and (4) putting the glass plate processed in the step (S124) into a thermostat at 70 ℃, preserving heat for 4 hours, and cutting the prepared piezoresistive rubber into a wafer with the diameter of 5mm, namely, the piezoresistive rubber with the thickness of 0.5mm is prepared.
Example 3
Step S131, batching: weighing the components according to the mass ratio, putting 1 part of polydimethylsiloxane and 2 parts of micron nickel powder in a beaker, and uniformly mixing to obtain a viscous liquid;
step S132, adding 0.2 part of octamethylcyclotetrasiloxane into a beaker, continuously and slowly stirring, and fully mixing the viscous liquid prepared in the step 131 with a curing agent to obtain a further-mixed viscous liquid;
step S133, removing bubbles: pouring the viscous liquid prepared in the step S132 onto a glass plate, placing the glass plate in a vacuum environment for 60 minutes, and removing bubbles generated during stirring;
step S134, pressing the glass plate: after the treatment of the step S133, placing four glass sheets with the thickness of 1mm at four corners of the glass plate, and slowly covering the other glass plate on the four glass sheets;
step S135, curing: and (4) putting the glass plate processed in the step (S134) into a thermostat at 70 ℃, preserving heat for 4 hours, and cutting the prepared piezoresistive rubber into a wafer with the diameter of 5mm, namely, the piezoresistive rubber with the thickness of 1mm is prepared.
Example 4
Step S141, batching: weighing the components according to the mass ratio, putting 1 part of polydimethylsiloxane and 3 parts of graphene in a beaker, and uniformly mixing to obtain a viscous liquid;
step S142, adding 0.1 part of silver-plated copper powder into a beaker, continuously and slowly stirring, and fully mixing the viscous liquid prepared in the step 141 and a curing agent to obtain further mixed viscous liquid;
step S143, removing bubbles: pouring the viscous liquid prepared in the step S142 onto a glass plate, placing the glass plate in a vacuum environment for 60 minutes, and removing bubbles generated during stirring;
step S144, pressing the glass plate: after the treatment of the step S143, placing four glass sheets with the thickness of 1mm at four corners of the glass plate, and slowly covering the other glass plate on the four glass sheets;
step S145, curing: and (4) putting the glass plate processed in the step (S144) into a thermostat at 70 ℃, preserving heat for 4 hours, and cutting the prepared piezoresistive rubber into a wafer with the diameter of 5mm, namely, the piezoresistive rubber with the thickness of 1mm is prepared.
Example 5
Step S151, batching: weighing the components according to the mass ratio, putting 1 part of polydimethylsiloxane and 3 parts of micron nickel powder in a beaker, and uniformly mixing to obtain a viscous liquid;
step S152, adding 0.1 part of silver-plated copper powder into a beaker, continuously and slowly stirring, and fully mixing the viscous liquid prepared in the step 151 with a curing agent to obtain further mixed viscous liquid;
step S153, bubble removal: pouring the viscous liquid prepared in the step S152 onto a glass plate, placing the glass plate in a vacuum environment for 60 minutes, and removing bubbles generated during stirring;
step S154, pressing the glass plate: after the treatment of the step S153, placing four glass sheets with the thickness of 0.8mm at four corners of the glass plate, and slowly covering the other glass plate on the four glass sheets;
step S155, curing: and (4) putting the glass plate processed in the step (S154) into a thermostat at 70 ℃, preserving heat for 4 hours, and cutting the prepared piezoresistive rubber into a wafer with the diameter of 5mm, namely, the piezoresistive rubber with the thickness of 0.8mm is prepared.
Example 6
Step S161, batching: weighing the components according to the mass ratio, putting 1 part of polydimethylsiloxane and 4 parts of micron nickel powder in a beaker, and uniformly mixing to obtain a viscous liquid;
step S162, adding 0.1 part of butadienyl triethoxysilane into a beaker, continuously and slowly stirring, and fully mixing the viscous liquid prepared in the step 161 with a curing agent to obtain a further mixed viscous liquid;
step S163, removing bubbles: pouring the viscous liquid prepared in the step S162 onto a glass plate, placing the glass plate in a vacuum environment for 60 minutes, and removing bubbles generated during stirring;
step S164, pressing the glass plate: after the treatment of the step S163, placing four glass sheets with the thickness of 1mm at four corners of the glass plate, and slowly covering the other glass plate on the four glass sheets;
step S165, curing: and (4) putting the glass plate processed in the step (S164) into a thermostat at 70 ℃, preserving heat for 4 hours, and cutting the prepared piezoresistive rubber into a wafer with the diameter of 5mm, namely, the piezoresistive rubber with the thickness of 1mm is prepared.
Example 7
Step S171, batching: weighing the components according to the mass ratio, putting 1 part of polydimethylsiloxane and 4 parts of carbon nano tubes in a beaker, and uniformly mixing to obtain viscous liquid;
step S172, adding 0.1 part of octamethylcyclotetrasiloxane into a beaker, continuously and slowly stirring, and fully mixing the viscous liquid prepared in the step 171 with a curing agent to obtain further mixed viscous liquid;
step S173, bubble removal: pouring the viscous liquid prepared in the step S172 onto a glass plate, placing the glass plate in a vacuum environment for 60 minutes, and removing bubbles generated during stirring;
step S174, pressing the glass plate: after the treatment of the step S173, four glass sheets with the thickness of 0.8mm are placed at four corners of the glass plate, and the other glass plate is slowly covered on the four glass sheets;
step S175, curing: and (4) putting the glass plate processed in the step (S174) into a thermostat at 70 ℃, preserving the heat for 4 hours, and cutting the prepared piezoresistive rubber into a wafer with the diameter of 5mm, namely preparing the piezoresistive rubber with the thickness of 0.8 mm.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims (10)

1. A piezoresistive rubber composite for a robotic tactile sensor, characterized by: the composite material comprises a polydimethylsiloxane matrix and a conductive filler.
2. Piezoresistive rubber composite material for a robotic tactile sensor according to claim 1, characterized in that: the mass ratio of the polydimethylsiloxane to the conductive filler is 1: 5-1: 2.
3. Piezoresistive rubber composite material for a robotic tactile sensor according to claim 1, characterized in that: the conductive filler comprises graphene, carbon nano tubes, micron nickel powder, silver-plated copper powder and copper-plated nickel powder.
4. Piezoresistive rubber composite material for a robotic tactile sensor according to claim 1, characterized in that: the particle size of the conductive filler is 10-100 mu m.
5. A preparation method of the piezoresistive rubber composite material for the robot touch sensor according to any one of the claims 1-4, characterized by comprising the following steps:
s101: respectively weighing polydimethylsiloxane and conductive filler, and fully mixing;
s102: adding a curing agent into the mixture, and mixing and stirring;
s103: pouring the prepared viscous liquid onto a glass plate, and placing the glass plate in a vacuum environment to remove bubbles generated during stirring;
s104: placing four glass sheets at four corners of the glass plate respectively, and slowly covering the other glass plate on the four glass sheets;
s105: and (3) placing the glass plate in a thermostat, and preserving the temperature for a period of time to obtain the piezoresistive rubber.
6. The method for preparing piezoresistive rubber composite material for robot touch sensor according to claim 5, wherein: the curing agent in the step S102 comprises one or more of vinyltriethoxysilane, vinyltrimethoxysilane, octamethylcyclotetrasiloxane, butadienyltriethoxysilane and vinyltri-tert-butylhydroperoxide; the mass ratio of the curing agent to the polydimethylsiloxane is 1: 5-10.
7. The method for preparing piezoresistive rubber composite material for robot touch sensor according to claim 5, wherein: in the step S103, the processing time of the glass plate in the vacuum environment is 50-80 min.
8. The method for preparing piezoresistive rubber composite material for robot touch sensor according to claim 5, wherein: the thickness of the glass sheet in step S104 is 0.5-1 mm.
9. The method for preparing a piezoresistive rubber composite material for a robot touch sensor according to claim 5, wherein the temperature of the heat preservation in step S105 is 50-70 ℃, and the heat preservation time is 4-6 h.
10. The preparation method of the piezoresistive rubber composite material for the robot touch sensor according to any one of claims 6 to 9, wherein: the thickness of the piezoresistive rubber in the step S105 is 0.5-1 mm.
CN202011112163.0A 2020-10-16 2020-10-16 Piezoresistive rubber composite material for robot touch sensor and preparation method thereof Pending CN112375383A (en)

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Application publication date: 20210219