CN111795797A - Flexible pressure measurement sensor and pressure distribution measurement system - Google Patents

Flexible pressure measurement sensor and pressure distribution measurement system Download PDF

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Publication number
CN111795797A
CN111795797A CN202010588525.7A CN202010588525A CN111795797A CN 111795797 A CN111795797 A CN 111795797A CN 202010588525 A CN202010588525 A CN 202010588525A CN 111795797 A CN111795797 A CN 111795797A
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CN
China
Prior art keywords
pressure
flexible
pressure measurement
flexible circuit
circuit substrate
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010588525.7A
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Chinese (zh)
Inventor
夏从伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smartstone (shanghai) Sensing & Control Tech Co ltd
Original Assignee
Smartstone (shanghai) Sensing & Control Tech Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smartstone (shanghai) Sensing & Control Tech Co ltd filed Critical Smartstone (shanghai) Sensing & Control Tech Co ltd
Priority to CN202010588525.7A priority Critical patent/CN111795797A/en
Publication of CN111795797A publication Critical patent/CN111795797A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M9/00—Aerodynamic testing; Arrangements in or on wind tunnels
    • G01M9/06—Measuring arrangements specially adapted for aerodynamic testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M9/00—Aerodynamic testing; Arrangements in or on wind tunnels
    • G01M9/02—Wind tunnels
    • G01M9/04—Details

Abstract

The invention discloses a flexible pressure measurement sensor and a pressure distribution measurement system. The flexible pressure measurement sensor comprises a flexible circuit substrate and a pressure measurement module arranged on the flexible circuit substrate, wherein the pressure measurement module comprises a core fence arranged on the flexible circuit substrate; the core body fence is matched with the core body fence to be connected with a core body cover plate, the core body fence, the core body cover plate and the flexible circuit substrate are arranged in an enclosing mode to form an accommodating cavity, a plurality of vent holes are formed in the core body cover plate, and the accommodating cavity is communicated with the outside through the vent holes; the flexible circuit board is arranged on the flexible circuit board and contained in the first pressure chip and the first bonding pad of the containing cavity, and the first pressure chip is electrically connected with the first bonding pad. The flexible pressure measurement sensor can be attached to a surface with a curvature for pressure measurement, and has high measurement accuracy.

Description

Flexible pressure measurement sensor and pressure distribution measurement system
Technical Field
The application relates to the technical field of pressure distribution measurement, in particular to a flexible pressure measurement sensor and a pressure distribution measurement system.
Background
The flexible pressure measurement sensor is mainly applied to surface pressure measurement in flight tests and wind tunnel tests. For example, in a flight test, the wing is placed in a uniform and steady airflow, the pressure distribution of the wing is measured on the surface of the wing, and the lift coefficient of the wing and the speed distribution of the surface of the wing can be obtained through a pressure distribution curve. The existing flexible pressure measurement sensor in the current market has large thickness, influences the fluid mechanics characteristics of the measured surface and has low measurement precision.
Disclosure of Invention
The application provides a flexible pressure measurement sensor and pressure distribution measurement system to solve the great problem of current flexible pressure measurement sensor thickness.
In order to solve the above technical problem, an aspect of the present application provides a flexible pressure measurement sensor, including a flexible circuit substrate and a pressure measurement module disposed on the flexible circuit substrate, the pressure measurement module includes:
the core body fence is arranged on the flexible circuit substrate;
the core body fence is matched with the core body fence to be connected with a core body cover plate, the core body fence, the core body cover plate and the flexible circuit substrate are arranged in an enclosing mode to form an accommodating cavity, a plurality of vent holes are formed in the core body cover plate, and the accommodating cavity is communicated with the outside through the vent holes;
the flexible circuit board is arranged on the flexible circuit board and contained in the first pressure chip and the first bonding pad of the containing cavity, and the first pressure chip is electrically connected with the first bonding pad.
Preferably, the first bonding pad is arranged around the first pressure chip, and a pin of the first pressure chip is electrically connected with the first bonding pad through a gold wire.
Preferably, the flexible pressure measurement sensor further includes a plurality of first circuit modules integrated on the flexible circuit substrate, and the plurality of first circuit modules form a first signal processing circuit for performing signal conversion on the pressure signal output by the first pressure chip.
Preferably, the pressure measurement module further includes a second pressure chip disposed on the flexible circuit substrate and accommodated in the accommodating cavity, and a second bonding pad electrically connected to the second pressure chip, the flexible pressure measurement sensor further includes a plurality of second circuit modules integrated on the flexible circuit substrate, and the plurality of second circuit modules form a second signal processing circuit for performing signal conversion on the pressure signal output by the second pressure chip.
Preferably, the pressure measurement module is disposed at the center of the flexible circuit substrate, and the plurality of first circuit modules are disposed around the pressure measurement module.
Preferably, the flexible circuit board includes a main body portion and two joint portions disposed on the main body portion at an interval, the joint portions and the main body portion are located on the same plane, the main body portion includes a first mounting surface and a second mounting surface which are disposed oppositely, the pressure measurement module and the first circuit module are both disposed on the first mounting surface, and reinforcing members are disposed on positions, corresponding to the modules, of the second mounting surface.
Preferably, the flexible pressure measurement sensor further comprises an electrical interface provided on the engagement portion, the electrical interface being electrically connected to the first signal processing circuit.
Preferably, the flexible circuit substrate is provided with a mark for positioning a measurement central point of the surface to be measured.
Preferably, the flexible pressure measurement sensor further comprises a fairing arranged on the flexible circuit substrate, the fairing comprises a first surface connected with the flexible circuit substrate and a containing part formed by sinking from the first surface along a direction away from the flexible circuit substrate, and the containing part is used for containing each module.
In order to further solve the above technical problem, another aspect of the present application further provides a pressure distribution measuring system, including a plurality of flexible pressure measuring sensors according to any one of the above embodiments, the plurality of flexible pressure measuring sensors being arranged and distributed in a preset manner.
The beneficial effect of this application is: the flexible pressure measurement sensor uses the flexible circuit substrate, so that the flexible circuit substrate can be attached to a surface with curvature to measure pressure; the first pressure chip is directly arranged on the flexible circuit substrate, so that the whole thickness of the sensor can be reduced, the influence on the fluid mechanical property of the measured surface is reduced, and the measurement precision is high. The pressure distribution measuring system can realize the measurement of the strip-shaped or planar pressure distribution.
Drawings
FIG. 1 is a schematic diagram of a top view of a flexible pressure measurement sensor in accordance with an embodiment of the present invention;
FIG. 2 is a schematic sectional view taken along the line A-A in FIG. 1;
FIG. 3 is an enlarged schematic view of the structure at B in FIG. 2;
FIG. 4 is a schematic diagram of a first pressure die and a first bonding pad of a flexible pressure measurement sensor in accordance with an embodiment of the present invention;
FIG. 5 is a schematic view of a fairing in a flexible pressure measurement sensor in accordance with an embodiment of the invention;
FIG. 6 is a schematic illustration of the structure of the fairing shown in FIG. 5;
reference numerals: a flexible pressure measurement sensor 100; a flexible circuit board 1; a main body portion 11; a first mounting surface 111; a second mounting surface 112; a joint portion 12; a pressure measurement module 2; an accommodating cavity 20; a core enclosure 21; a core cover plate 22; a vent hole 221; a first pressure chip 23; pin 231; the first pads 24; a gold wire 25; a first circuit module 3; a reinforcing member 4; an electrical interface 5; an identifier 6; a cowl 7; a first surface 71; and a housing portion 72.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1 to 6, an embodiment of the invention provides a flexible pressure measurement sensor 100, which includes a flexible circuit substrate 1 and a pressure measurement module 2 disposed on the flexible circuit substrate 1. By using a flexible circuit substrate, the sensor 100 has good flexibility and can be attached to a curved surface for pressure measurement.
Specifically, pressure measurement module 2 is including locating core rail 21 on the flexible circuit substrate 1, with core rail 21 cooperation connection core apron 22, core rail 21 with core apron 22 with flexible circuit substrate 1 encloses to establish and forms and accepts chamber 20, be equipped with a plurality of air vent 221 on the core apron 22, it passes through to accept chamber 20 air vent 221 and external intercommunication. The pressure measurement module 2 further comprises a first pressure chip 23 and a first bonding pad 24 which are arranged on the flexible circuit substrate 1 and accommodated in the accommodating cavity 20, and the first pressure chip 23 is electrically connected with the first bonding pad 24.
According to the flexible pressure measurement sensor 100 provided by the embodiment of the invention, the first pressure chip 23 is directly arranged on the flexible circuit substrate 1, so that the overall thickness of the flexible pressure measurement sensor 100 can be reduced, the influence on the fluid mechanical property of the measured surface is reduced, and the measurement precision is high. Meanwhile, by providing the core fence 21 and the core cover plate 22 to physically shield the first pressure chip 23, the housing cavity 20 communicates with the outside through the vent hole 221, so that the first pressure chip 23 can detect the external air pressure and transmit the detected pressure signal to the corresponding signal processing circuit through the first pad 24.
Optionally, the core cover 22 is designed as a porous sheet and is connected to the core enclosure 21 by gluing. Preferably, the through hole 221 is circular.
Referring to fig. 3-4, in the present embodiment, the first bonding pad 24 is disposed around the first pressure chip 23, and the pin 231 of the first pressure chip 23 is electrically connected to the first bonding pad 24 through a gold wire 25. During assembly, the first pressure chip 23 is firstly glued to the chip placing area of the flexible circuit substrate 1; then, one end of a gold wire 25 is connected with the pin 231 of the first pressure chip 23 through a gold wire bonding process, and the other end is connected with the corresponding first bonding pad 24; and finally, spraying silicone gel on each connecting area for insulation protection.
Specifically, referring to fig. 1, the flexible pressure measurement sensor 100 further includes a plurality of first circuit modules 3 integrated on the flexible circuit substrate 1, where the plurality of first circuit modules 3 form a first signal processing circuit, and are configured to perform signal conversion on the pressure signal output by the first pressure chip 23, and convert the pressure measurement value into a standard measurement value for output.
Preferably, the pressure measurement module 2 is disposed at the center of the flexible circuit substrate 1, and the plurality of first circuit modules 3 are disposed around the pressure measurement module 1.
Specifically, referring to fig. 1 and 3, the flexible circuit board 1 includes a main body portion 11 and two engaging portions 12 oppositely disposed on the main body portion 11 at an interval, and the engaging portions 12 and the main body portion 11 are located on the same plane. The main body 11 includes a first mounting surface 111 and a second mounting surface 112 that are oppositely disposed, the pressure measurement module 2 and the first circuit module 3 are both disposed on the first mounting surface 111, and a reinforcing member 4 is disposed on a position of the second mounting surface 112 corresponding to each of the modules (2, 3). The reinforcing part 4 is used for reinforcing the baseband of the module area, and other areas among the modules still have good flexibility, so that the reinforcing part can be applied to surface mounting with curvature.
Further, the flexible pressure measurement sensor 100 further comprises an electrical interface 5 disposed on the joint portion 12, wherein the electrical interface 5 can be used to form a plurality of flexible pressure measurement sensors 100 to be interconnected and finally form a bus output form, thereby greatly reducing the wiring of the measured surface. The electrical interface 5 is further electrically connected to the first signal processing circuit, and is configured to output a result of the signal conversion in a bus manner.
Optionally, the electrical interfaces 5 of the adjacent flexible pressure measurement sensors 100 may be connected by welding, crimping, or riveting, and the like, and the plurality of flexible pressure measurement sensors 100 are connected in pairs, so as to form a strip-shaped or planar structure for measuring the distribution of strip-shaped or planar pressure.
Preferably, the flexible circuit substrate 1 is provided with an identifier 6 for positioning a measurement center point of the surface to be measured, and the measurement center point of the surface to be measured can be accurately positioned by the identifier 6, so that the flexible pressure measurement sensor 100 can be more conveniently installed on the surface to be measured. For example, in the present embodiment, as shown in fig. 1, the mark 6 is two semicircular grooves oppositely arranged on the edge of the flexible circuit substrate 1.
Specifically, as shown in fig. 5 and 6, the flexible pressure measurement sensor 100 further includes a fairing 7 disposed on the flexible circuit board 1, where the fairing 7 includes a first surface 71 connected to the flexible circuit board 1 and a receiving portion 72 formed by recessing from the first surface 71 in a direction away from the flexible circuit board 1, and the receiving portion 72 is configured to receive each of the modules (2, 3). In this embodiment, the cowling 7 is provided with the receiving portions 72 corresponding to the respective modules, and in another embodiment of the present invention, the cowling 7 is provided with only one large receiving portion 72 and receives all the modules provided on the flexible circuit board 1. It is understood that the invention shall also fall within the scope of protection. In the embodiment of the invention, the fairing 7 is arranged to protect each module, so that the influence of the external environment on each module is avoided, and the accurate measurement of the fluid pressure distribution is realized.
Preferably, the cowling 7 is made of rubber.
Preferably, in another embodiment of the present invention, the pressure measurement module 2 further includes a second pressure chip disposed on the flexible circuit substrate 1 and accommodated in the accommodating cavity 20, and a second bonding pad electrically connected to the second pressure chip. The second pressure chip and the first pressure chip 23 are used for detecting the pressure of the same measuring point. The second pressure chip may work simultaneously with the first pressure chip 23, or the second pressure chip may be used as a standby pressure chip of the pressure measurement module 2, and when the first pressure chip 23 fails, a pressure signal detected by the second pressure chip is output. Preferably, the second bonding pad is arranged around the second pressure chip, and the pin of the second pressure chip is electrically connected with the second bonding pad through a gold wire by using a gold wire bonding process.
Specifically, in the other embodiments, the flexible pressure measurement sensor 100 further includes a plurality of second circuit modules integrated on the flexible circuit substrate 1, and the plurality of second circuit modules form a second signal processing circuit, which is used for performing signal conversion on the pressure signal output by the second pressure chip, and converting the pressure measurement value into a standard measurement value for outputting. Preferably, a plurality of the second circuit modules and a plurality of the first circuit modules 3 are all arranged around the pressure measurement module 2.
Specifically, in the other embodiments, the second mounting surface 112 is also provided with the reinforcing member 4 at a position corresponding to each of the second circuit modules. The electrical interface 5 is also electrically connected to the second signal processing circuit. The first surface 71 of the cowling 7 is further provided with a receiving portion 72 for receiving each of the second circuit modules.
Furthermore, the invention also provides a pressure distribution measuring system, which comprises a plurality of flexible pressure measuring sensors as described above, wherein the plurality of flexible pressure measuring sensors are arranged and distributed according to a preset mode, such as arranged into a belt-shaped or plane-shaped structure, and are used for measuring the belt-shaped or plane-shaped pressure distribution condition. The pressure distribution measuring system can be used for measuring the distribution condition of the surface pressure with curvature, and has high measuring precision; the measuring result adopts a bus output form, so that the wiring of the measured surface can be greatly reduced; if a matched fairing is adopted, the influence of the external environment on each module can be avoided, and the measurement precision is improved.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only express preferred embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the inventive concept of the present invention, and these changes and modifications are within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A flexible pressure measurement sensor, comprising a flexible circuit substrate and a pressure measurement module disposed on the flexible circuit substrate, the pressure measurement module comprising:
the core body fence is arranged on the flexible circuit substrate;
the core body fence is matched with the core body fence to be connected with a core body cover plate, the core body fence, the core body cover plate and the flexible circuit substrate are arranged in an enclosing mode to form an accommodating cavity, a plurality of vent holes are formed in the core body cover plate, and the accommodating cavity is communicated with the outside through the vent holes;
the flexible circuit board is arranged on the flexible circuit board and contained in the first pressure chip and the first bonding pad of the containing cavity, and the first pressure chip is electrically connected with the first bonding pad.
2. The flexible pressure measurement sensor of claim 1, wherein the first bonding pad is disposed around the first pressure die, and the pin of the first pressure die is electrically connected to the first bonding pad by a gold wire.
3. The flexible pressure measurement sensor of claim 1 further comprising a plurality of first circuit modules integrated on the flexible circuit substrate, the plurality of first circuit modules forming a first signal processing circuit for signal conversion of the pressure signal output by the first pressure die.
4. The flexible pressure measurement sensor according to claim 3, wherein the pressure measurement module further includes a second pressure chip disposed on the flexible circuit substrate and received in the receiving cavity, and a second bonding pad electrically connected to the second pressure chip, and the flexible pressure measurement sensor further includes a plurality of second circuit modules integrated on the flexible circuit substrate, and the plurality of second circuit modules form a second signal processing circuit for performing signal conversion on the pressure signal output by the second pressure chip.
5. The flexible pressure measurement sensor of claim 3 wherein said pressure measurement module is centrally disposed on said flexible circuit substrate, and a plurality of said first circuit modules are disposed around said pressure measurement module.
6. The flexible pressure measurement transducer of claim 3, wherein the flexible circuit board includes a main body portion and two engaging portions disposed on the main body portion at intervals, the engaging portions and the main body portion are located on the same plane, the main body portion includes a first mounting surface and a second mounting surface that are disposed opposite to each other, the pressure measurement module and the first circuit module are disposed on the first mounting surface, and the second mounting surface is provided with a reinforcing member at a position corresponding to each of the modules.
7. The flexible pressure measurement sensor of claim 6 further comprising an electrical interface disposed on the engagement portion, the electrical interface being electrically connected to the first signal processing circuit.
8. The flexible pressure measurement sensor of claim 1, wherein the flexible circuit substrate has a mark thereon for locating a measurement center point of the surface to be measured.
9. The flexible pressure sensor of claim 3, further comprising a fairing disposed on the flexible circuit substrate, the fairing including a first surface coupled to the flexible circuit substrate and a receptacle formed recessed from the first surface in a direction away from the flexible circuit substrate, the receptacle configured to receive each of the modules.
10. A pressure distribution measuring system comprising a plurality of flexible pressure measuring sensors according to any of claims 1 to 9, wherein the plurality of flexible pressure measuring sensors are arranged in a predetermined pattern.
CN202010588525.7A 2020-06-24 2020-06-24 Flexible pressure measurement sensor and pressure distribution measurement system Pending CN111795797A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010588525.7A CN111795797A (en) 2020-06-24 2020-06-24 Flexible pressure measurement sensor and pressure distribution measurement system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010588525.7A CN111795797A (en) 2020-06-24 2020-06-24 Flexible pressure measurement sensor and pressure distribution measurement system

Publications (1)

Publication Number Publication Date
CN111795797A true CN111795797A (en) 2020-10-20

Family

ID=72803073

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010588525.7A Pending CN111795797A (en) 2020-06-24 2020-06-24 Flexible pressure measurement sensor and pressure distribution measurement system

Country Status (1)

Country Link
CN (1) CN111795797A (en)

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