CN110459672B - Piezoelectric ceramic sensor and preparation method thereof - Google Patents

Piezoelectric ceramic sensor and preparation method thereof Download PDF

Info

Publication number
CN110459672B
CN110459672B CN201910643824.3A CN201910643824A CN110459672B CN 110459672 B CN110459672 B CN 110459672B CN 201910643824 A CN201910643824 A CN 201910643824A CN 110459672 B CN110459672 B CN 110459672B
Authority
CN
China
Prior art keywords
piezoelectric
layer
flexible film
conductive layer
piezoelectric ceramics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910643824.3A
Other languages
Chinese (zh)
Other versions
CN110459672A (en
Inventor
丁小恒
李明愚
孙思雨
晏义伍
丁莉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Academy of Aerospace Technology
Original Assignee
Shenzhen Academy of Aerospace Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Academy of Aerospace Technology filed Critical Shenzhen Academy of Aerospace Technology
Priority to CN201910643824.3A priority Critical patent/CN110459672B/en
Publication of CN110459672A publication Critical patent/CN110459672A/en
Application granted granted Critical
Publication of CN110459672B publication Critical patent/CN110459672B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302—Sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Further insulation means against electrical, physical or chemical damage, e.g. protective coatings

Abstract

The invention discloses a piezoelectric ceramic sensor and a preparation method thereof, wherein the sensor comprises an upper flexible film substrate and a lower flexible film substrate, a first conducting layer, a piezoelectric layer and a second conducting layer are sequentially arranged between the upper flexible film substrate and the lower flexible film substrate, the piezoelectric layer comprises a plurality of piezoelectric ceramics arranged at intervals, and 2 electrodes of the piezoelectric ceramics are respectively in electrical contact with the first conducting layer and the second conducting layer. The piezoelectric sensor prepared by the invention adopts a piezoelectric ceramic material, and compared with a flexible material PVDF, the piezoelectric sensor has the advantages of good thermal stability, puncture resistance and higher piezoelectric efficiency. Meanwhile, the preparation process directly uses the polarized piezoelectric ceramics for cutting, realizes the interval arrangement of the ceramic pieces by using the material loss in the cutting process, has simple and controllable process and high yield, and can realize large-scale production.

Description

Piezoelectric ceramic sensor and preparation method thereof
Technical Field
The invention relates to the field of piezoelectric sensors, in particular to a piezoelectric ceramic sensor and a preparation method thereof.
Background
When some electrolytes are deformed by an external force in a certain direction, polarization occurs in the electrolytes, and opposite positive and negative charges appear on two opposite surfaces of the electrolytes. When the external force is removed, it returns to an uncharged state, which is called a positive piezoelectric effect, and a material capable of generating the piezoelectric effect is called a piezoelectric material. The piezoelectric sensor utilizes the piezoelectric effect to realize the functional conversion between mechanical energy and electric energy. The piezoelectric sensor prepared by the piezoelectric material has the advantages of simple structure, high stability, low cost, quick response, wide frequency response range, high sensitivity, large dynamic range and the like. With the development of the electronic industry, piezoelectric sensors are widely applied in the related fields of acoustics, mechanics, medical treatment, aerospace and the like.
The piezoelectric effect of piezoelectric materials is due to the special arrangement of atoms in the crystal lattice, which can be divided into four types, piezoelectric single crystal, piezoelectric polycrystal (piezoelectric ceramic), piezoelectric Polymer (PVDF) and piezoelectric composite material. The piezoelectric ceramic has higher electromechanical coupling coefficient, larger piezoelectric constant, higher sensing sensitivity and stable performance, however, the piezoelectric ceramic material does not have flexibility and cannot be used in a curved annular shape. The organic piezoelectric material PVDF is a material having both flexibility and piezoelectric properties, but the material has poor thermal stability, is not puncture resistant, and has a lower piezoelectric constant than a ceramic material.
In the prior art, the piezoelectric device with certain flexibility is prepared, the process is complex, and the yield is low.
Disclosure of Invention
The present invention is intended to solve at least one of the technical problems described in the related description to a certain extent. Therefore, it is an object of the present invention to provide a piezoelectric ceramic sensor which is simple in structure, flexible, and highly reliable.
Therefore, the second purpose of the invention is to provide a method for preparing the piezoelectric ceramic sensor with simple process and high yield.
The technical scheme adopted by the invention is as follows:
in a first aspect, the present invention provides a piezoelectric ceramic sensor, including an upper flexible film substrate and a lower flexible film substrate, wherein a first conductive layer, a piezoelectric layer, and a second conductive layer are sequentially disposed between the upper flexible film substrate and the lower flexible film substrate, the piezoelectric layer includes a plurality of piezoelectric ceramics arranged at intervals, the piezoelectric ceramics are fixed between the first conductive layer and the second conductive layer through an adhesive material, and 2 electrodes of the piezoelectric ceramics are electrically connected to the first conductive layer and the second conductive layer, respectively.
Furthermore, the first conducting layer and the second conducting layer both comprise at least one conducting electrode and a circuit for connecting and/or leading out the conducting electrode, electrodes at two ends of the piezoelectric ceramic are respectively and electrically connected with the at least one conducting electrode of the first conducting layer and the at least one conducting electrode of the second conducting layer, and the surface of the circuit, which is connected and/or led out by the conducting electrode, is covered with an insulating protective layer.
Further, the conductive electrodes on the first conductive layer and the conductive electrodes on the second conductive layer are mutually connected in series and/or in parallel and/or respectively led out to be used as a connection and/or test and/or output port of the sensor.
Further, the material of the conductive electrode and the circuit connecting and/or leading out the conductive electrode is at least one of conductive metal, alloy, polymer and the like.
Furthermore, the upper flexible film substrate, the lower flexible film substrate and the insulating protection layer are made of at least one of flexible film materials such as a polyester film, a polyimide film, a polypropylene film and a polyvinyl chloride film.
Further, the adhesive material thickness is not higher than the thickness of the conductive layer.
In a second aspect, the present invention further provides a method for manufacturing a piezoelectric ceramic sensor, which includes the following steps:
step 1, cutting the sintered and polarized piezoelectric ceramics by using a cutting machine, dividing the piezoelectric ceramics into a plurality of small piezoelectric ceramics with required sizes, and keeping a certain distance between the small piezoelectric ceramics;
step 2, respectively printing or depositing or printing a conducting layer on the surfaces of the two flexible films;
step 3, transferring the small pieces of piezoelectric ceramics prepared in the step 1 to the surface of the flexible film prepared in the step 2, wherein the surfaces of the small pieces of piezoelectric ceramics are respectively and electrically connected with the conducting layer in the transferring process;
and 4, covering the flexible film prepared in the step 2 on the surface of the ceramic chip subjected to transfer printing in the step 3, and ensuring that the small pieces of piezoelectric ceramics are electrically connected with the conducting layer.
Further, the step 2 further comprises carrying out anti-oxidation process treatment on the surface of the conductive layer.
Further, in the step 3, the distance between the small piezoelectric ceramic pieces before and after the transfer printing is kept unchanged.
The invention has the beneficial effects that:
the invention utilizes the cutting process to lead the piezoelectric ceramic pieces to have certain intervals, and the packaged piezoelectric sensor has certain flexibility. Compared with a flexible material PVDF, the piezoelectric sensor prepared by the invention adopts a piezoelectric ceramic material, and has the advantages of good thermal stability, puncture resistance and higher piezoelectric efficiency. Meanwhile, the polarized piezoelectric ceramic is directly used for cutting, the ceramic pieces are arranged at intervals by material loss in the cutting process, the process is simple and controllable, the yield is high, and large-scale production can be realized.
Drawings
FIG. 1 is a side view of one embodiment of a piezoceramic sensor of the present invention;
FIG. 2 is a schematic view of the bending of one embodiment of a piezoceramic sensor of the present invention;
FIG. 3 is a top view of an electrode layer in an embodiment of a piezoceramic sensor of the present invention;
FIG. 4 is a top view of an electrode layer in another embodiment of a piezoceramic sensor of the present invention;
FIG. 5 is a top view of an electrode layer in another embodiment of a piezoceramic sensor of the present invention;
FIG. 6 is a schematic flow chart of a method for manufacturing a piezoceramic sensor according to an embodiment of the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
Referring to fig. 1 to 2, a piezoceramic sensor is shown, which comprises an upper flexible film substrate 1 and a lower flexible film substrate 5, wherein preferably, the material of the upper flexible film substrate 1 and the lower flexible film substrate 5 is at least one of flexible film materials such as polyester film, polyimide film, polypropylene film, polyvinyl chloride film and the like. A first conductive layer 2, a piezoelectric layer and a second conductive layer 9 are sequentially arranged between the upper flexible film substrate 1 and the lower flexible film substrate 5, wherein the first conductive layer 2 and the second conductive layer 9 are made of at least one of conductive metals, alloys, polymers and the like and have certain flexibility, the conductive layers comprise electrodes 202 and circuits 201 for connecting and/or leading out the electrodes, and the surfaces of the circuits 201 are covered with insulating protection films 8. The piezoelectric layer comprises a plurality of piezoelectric ceramics 4 which are arranged at intervals, and the piezoelectric ceramics 4 are fixed between the first conducting layer 2 and the second conducting layer 9 through the adhesive material 3. 2 electrodes of the piezoelectric ceramic 4 are respectively electrically connected with the first conducting layer 2 and the second conducting layer 9, so that measurable electric signals can be output under certain load.
Further, the first conductive layer 2 and the second conductive layer 9 each include a plurality of conductive electrodes 202, two electrodes (upper and lower surfaces) of the piezoelectric ceramic 4 are electrically connected to at least one conductive electrode of the first conductive layer 2 and at least one conductive electrode of the second conductive layer 9, respectively, and a contact area is not less than 50% of a surface area of the piezoelectric ceramic 4, wherein a certain gap 7 is reserved between the piezoelectric ceramic pieces. The conductive electrodes on the first conductive layer 2 and the conductive electrodes on the second conductive layer 9 are connected in series and/or in parallel and/or respectively led out to be used as a connection and/or test and/or output port of the sensor.
Preferably, as shown in fig. 3, fig. 3 illustrates a first conductive layer 1 and a second conductive layer 2, conductive electrodes of the first conductive layer 1 and the second conductive layer 2 are respectively connected in series, the first conductive layer 1 has a unique leading-out terminal a, the second conductive layer 2 has a unique leading-out terminal B, and after packaging, a high-speed recorder is used to connect the ports a and B, so that the applied load conditions of sixteen electrode positions in the figure can be recorded. Because the electrodes are connected in series, the sensor prepared by the film can record large-area data acquisition.
Referring to fig. 4, the conductive electrodes of the first conductive layer 1 are grounded and have only one output port a, the conductive electrodes (1, 2, 5, 6) of the second conductive layer 2 are grounded and are connected to the terminal C, the conductive electrodes (3, 4, 7, 8) are grounded and are connected to the terminal B, the conductive electrodes (11, 12, 15, 16) are grounded and are connected to the terminal D, and the conductive electrodes (9, 10, 13, 14) are grounded and are connected to the terminal E. After packaging, one end of the high-speed recorder is connected with the upper electrode output port A, and the other end of the high-speed recorder is respectively connected with the ports B, C, D and E, so that the external load condition applied to the positions of the common ground electrodes can be output without mutual interference.
Referring to fig. 5, the conductive electrodes of the first conductive layer 1 are grounded and have only one output port a, and the conductive electrodes of the second conductive layer 2 are led out of the respective output ports, respectively, as shown. After packaging, one end of a high-speed recorder is connected with an upper electrode output port A, the other end of the high-speed recorder is respectively connected with ports B, C, D, \ 8230and Q, so that external load conditions respectively borne by sixteen electrodes can be respectively output, and integration of the small piezoelectric sensor is realized.
Furthermore, the ports of the first conductive layer and the second conductive layer are provided with interface circuits electrically connected with the ports. The material of the interface circuit is at least one of conductive metal, alloy, polymer and the like.
Referring to fig. 6, the present invention also provides a method for manufacturing a piezoelectric ceramic sensor, which includes the following steps:
step 1, cutting the sintered and polarized piezoelectric ceramic 1 by using a cutting machine, dividing the piezoelectric ceramic into a plurality of small pieces of piezoelectric ceramic with required sizes, and keeping a certain distance between the small pieces of piezoelectric ceramic;
step 2, respectively printing or depositing or printing a conducting layer 2 on the surfaces of the two flexible films;
step 3, transferring the small pieces of piezoelectric ceramics prepared in the step 1 to the surface of the flexible film prepared in the step 2, wherein the surface of each small piece of piezoelectric ceramics is electrically connected with the conducting layer in the transferring process;
and 4, covering the flexible film prepared in the step 2 on the surface of the ceramic wafer subjected to transfer printing in the step 3, and ensuring that the small pieces of piezoelectric ceramics are electrically connected with the conducting layer.
The sintered and polarized piezoelectric ceramic is pre-cut before packaging, a large inflexible piezoelectric ceramic piece is divided into a plurality of small pieces of piezoelectric ceramic with required size, material loss generated by cutting is used as packaging interval of the integrated piezoelectric ceramic piece, and the material loss is directly transferred to the surface of a thin film printed with a conductive electrode and a circuit, so that the bendable piezoelectric sensor integrated by more than one piezoelectric ceramic piece is formed.
Further as a preferred embodiment, step 2 further comprises performing an anti-oxidation process on the surface of the conductive layer.
Further preferably, in step 3, the distance between the plurality of small piezoelectric ceramic pieces before and after the transfer is kept unchanged.
Examples
In this embodiment, a method for manufacturing a piezoelectric ceramic sensor is provided, which includes the following steps:
step 1: cutting the sintered and polarized piezoelectric ceramic plate by using a ceramic laser cutting machine, and dividing the ceramic plate with the size of 40mm multiplied by 1mm into sixteen small ceramic plates with the size of 8mm multiplied by 1mm and the distance between the ceramic plates (cutting loss size) of 2mm;
step 2: printing sixteen corresponding electrodes and connecting and/or leading-out circuits on the surface of a polyimide flexible film, adhering the polyimide film on the surface of the connecting and/or leading-out circuit position to serve as an insulating protective layer, performing surface gold plating treatment on leading-out ends and the surfaces of the electrodes, and fixing adhesive materials around the conductive electrodes;
and step 3: aligning and transferring the ceramic plates prepared in the step 1 to the surface of the flexible film prepared in the step 2, ensuring that each ceramic plate is embedded and fixed between viscous materials in the transfer printing, respectively keeping a conductive layer on the surface of the piezoelectric ceramic in contact with a corresponding electrode, and keeping the distance between each ceramic plate before and after the transfer printing unchanged;
and 4, step 4: and (4) aligning the surfaces of the ceramic plates subjected to transfer printing in the step (3) and covering the second layer of flexible film prepared in the step (2) to ensure that each ceramic plate is kept in contact with the conductive electrode.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (8)

1. A piezoceramic sensor, characterized by: the piezoelectric flexible film comprises an upper flexible film substrate and a lower flexible film substrate, wherein a first conductive layer, a piezoelectric layer and a second conductive layer are sequentially arranged between the upper flexible film substrate and the lower flexible film substrate, the piezoelectric layer comprises a plurality of piezoelectric ceramics which are arranged at intervals, the piezoelectric ceramics are fixed between the first conductive layer and the second conductive layer through adhesive materials, and 2 electrodes of the piezoelectric ceramics are respectively and electrically connected with the first conductive layer and the second conductive layer;
the first conducting layer and the second conducting layer respectively comprise at least one conducting electrode and a circuit for connecting and/or leading out the conducting electrodes, the electrodes at two ends of the piezoelectric ceramics are respectively and electrically connected with the at least one conducting electrode of the first conducting layer and the at least one conducting electrode of the second conducting layer, and the surfaces of the circuits, connected and/or led out by the conducting electrodes, are covered with insulating protective layers.
2. Piezoceramic sensor according to claim 1, characterized in that: and the conductive electrodes on the first conductive layer and the conductive electrodes on the second conductive layer are mutually connected in series and/or in parallel and/or are respectively led out to be used as a connection and/or test and/or output port of the sensor.
3. The piezoceramic sensor of claim 1, wherein: the material of the conductive electrode and the circuit for connecting and/or leading out the conductive electrode is at least one of the following materials: conductive metals, alloys, polymers.
4. A piezoceramic sensor according to any one of claims 2 to 3, wherein: the upper flexible film substrate, the lower flexible film substrate and the insulating protection layer are all made of at least one of the following flexible film materials: polyester film, polyimide film, polypropylene film, polyvinyl chloride film.
5. The piezoceramic sensor of claim 4, wherein: the thickness of the adhesive material is not higher than that of the conductive layer.
6. A preparation method of a piezoelectric ceramic sensor is characterized by comprising the following steps:
step 1, cutting the sintered and polarized piezoelectric ceramics by using a cutting machine, dividing the piezoelectric ceramics into a plurality of small piezoelectric ceramics with required sizes, and keeping a certain distance between the small piezoelectric ceramics;
step 2, respectively printing or depositing or printing a conducting layer on the surfaces of the two flexible films;
step 3, transferring the small pieces of piezoelectric ceramics prepared in the step 1 to the surface of the flexible film prepared in the step 2, wherein the surfaces of the small pieces of piezoelectric ceramics are respectively and electrically connected with the conducting layer in the transferring process;
and 4, covering the flexible film prepared in the step 2 on the surface of the ceramic chip subjected to transfer printing in the step 3, and ensuring that the small pieces of piezoelectric ceramics are electrically connected with the conducting layer.
7. The method for manufacturing a piezoelectric ceramic sensor according to claim 6, wherein: and the step 2 also comprises the step of carrying out anti-oxidation process treatment on the surface of the conductive layer.
8. The method for manufacturing a piezoelectric ceramic sensor according to claim 7, wherein: in the step 3, the distance between the small piezoelectric ceramic pieces before and after the transfer printing is kept unchanged.
CN201910643824.3A 2019-07-17 2019-07-17 Piezoelectric ceramic sensor and preparation method thereof Active CN110459672B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910643824.3A CN110459672B (en) 2019-07-17 2019-07-17 Piezoelectric ceramic sensor and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910643824.3A CN110459672B (en) 2019-07-17 2019-07-17 Piezoelectric ceramic sensor and preparation method thereof

Publications (2)

Publication Number Publication Date
CN110459672A CN110459672A (en) 2019-11-15
CN110459672B true CN110459672B (en) 2023-01-03

Family

ID=68481348

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910643824.3A Active CN110459672B (en) 2019-07-17 2019-07-17 Piezoelectric ceramic sensor and preparation method thereof

Country Status (1)

Country Link
CN (1) CN110459672B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111446359B (en) * 2020-05-15 2023-05-30 京东方科技集团股份有限公司 Piezoelectric device, manufacturing method thereof, electronic device and control method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007003373A (en) * 2005-06-24 2007-01-11 Toko Inc Piezo electric acceleration sensor
KR101433655B1 (en) * 2013-08-28 2014-08-25 주식회사 네미센스 Monitoring Patch Sensor Using Macro Fiber Composite For Wind Power Generation Blade
CN108400231A (en) * 2017-02-08 2018-08-14 南昌欧菲生物识别技术有限公司 The manufacturing method of ultrasonic sensor and ultrasonic sensor

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1806568A1 (en) * 2004-10-28 2007-07-11 Matsushita Electric Industrial Co., Ltd. Piezoelectric element and method for manufacturing the same
JP2013021300A (en) * 2011-06-16 2013-01-31 Murata Mfg Co Ltd Multilayer ceramic electronic component

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007003373A (en) * 2005-06-24 2007-01-11 Toko Inc Piezo electric acceleration sensor
KR101433655B1 (en) * 2013-08-28 2014-08-25 주식회사 네미센스 Monitoring Patch Sensor Using Macro Fiber Composite For Wind Power Generation Blade
CN108400231A (en) * 2017-02-08 2018-08-14 南昌欧菲生物识别技术有限公司 The manufacturing method of ultrasonic sensor and ultrasonic sensor

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Thermal Stability of (1−x)BiScO3−xPbTiO3 Piezoelectric Ceramics for High-Temperature Sensor Applications;Si Chen等;《Communications of the American Ceramic Society》;20060905;第89卷(第10期);全文 *
柔性机构及其应用研究进展;于靖军 等;《机械工程学报》;20150731;第51卷(第13期);全文 *

Also Published As

Publication number Publication date
CN110459672A (en) 2019-11-15

Similar Documents

Publication Publication Date Title
CN108180927B (en) Full-flexible self-powered sensor and manufacturing method thereof
US9207134B2 (en) Electronic device and quad-axial force and torque measurement sensor thereof
WO2018090892A1 (en) Piezoelectric sensing device and application
JP2006019433A5 (en)
KR20040105705A (en) Apparatus incorporating small-feature-size and large-feature-size components and method for making same
CN108028308A (en) Transducer layer pressing plate
JP2017152711A (en) Perpendicular switching configuration for esd protection
CN101556975A (en) Wafer level interconnection and method
CN109429534A (en) Generator and its manufacturing method including magnetoelastic transducer
CN103210703B (en) Assembling and encapsulation discrete electronic component
CN110459672B (en) Piezoelectric ceramic sensor and preparation method thereof
KR102353065B1 (en) Embedded dry film battery module and method of manufacturing thereof
CN106557741A (en) Fingerprint identification device, its manufacture method, display device
WO2024041237A1 (en) Resonant sensor, battery, battery pack and energy storage system
CN111024213B (en) Flexible capacitive vibration sensor and manufacturing method thereof
KR101203176B1 (en) A manufacturing method for plastic piezoelectric device using sacrificial substrate, plastic piezoelectric device manufactured by the same
CN112903150B (en) Flexible pressure sensor with series structure and preparation method thereof
CN113432773B (en) Sensor suitable for measuring pressure of shock wave on surface of flexible object and manufacturing method
JPH10135528A (en) Dielectric film sheet for electronic part, its manufacture and dielectric element
CN209764303U (en) Pressure-sensitive film and micro-pressure sensor
CN115667754A (en) Vehicle brake pad and method for producing the same
CN111048608A (en) Flexible malleable solar cell and method of manufacturing the same
CN219265546U (en) N x N array piezoelectric film flexible pressure sensor
CN115014583B (en) Friction electrotouch sensor and preparation method thereof
EP3729530A1 (en) Piezoelectric device with a sensor and method for measuring the behaviour of said piezoelectric device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant