CN110311549A - A kind of passive suppressing method of common mode EMI and device based on the floating ground of split-phase - Google Patents
A kind of passive suppressing method of common mode EMI and device based on the floating ground of split-phase Download PDFInfo
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- CN110311549A CN110311549A CN201910637675.XA CN201910637675A CN110311549A CN 110311549 A CN110311549 A CN 110311549A CN 201910637675 A CN201910637675 A CN 201910637675A CN 110311549 A CN110311549 A CN 110311549A
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/44—Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/0003—Details of control, feedback or regulation circuits
- H02M1/0038—Circuits or arrangements for suppressing, e.g. by masking incorrect turn-on or turn-off signals, e.g. due to current spikes in current mode control
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Abstract
The present invention discloses a kind of passive suppressing method of common mode EMI and device based on the floating ground of split-phase, the inhibition strategy mainly contains split-phase floating ground radiator, three key Design links such as Absorption Capacitance and low EPC (parasitic capacitance) ac filter inductance, realize the efficient inhibition of common mode interference source and common mode conducting path.In terms of common mode interference source, the parasitic inductance (ESL) that the present invention passes through introducing Absorption Capacitance, the direct-to-ground capacitance of floating ground radiator and the parasitic capacitance (EPC) of ac filter inductance realize the controllable movement of ringing frequency in interference source, and the inhibition of ringing waveform is realized using the skin effect of conductor itself.For common mode conducting path, the present invention realizes the pathway disruption of suppression common mode electromagnetic interference using the direct-to-ground capacitance of floating ground radiator and the parasitic capacitance (EPC) of ac filter inductance, to further suppress the high-frequency conduction common mode interference in system.Simulation analysis and the experimental test verification present invention to the high of common mode EMI inhibit efficiency.
Description
Technical field
The present invention relates to power electronic equipment Conducted EMI suppression technology fields, floating based on split-phase more particularly, to one kind
The passive suppressing method of the common mode EMI on ground and device.
Background technique
Power electronic equipment is widely used to naval vessel, aircraft, high-speed iron because of its efficient, controllable transformation of electrical energy characteristic
In a variety of pairs of very high modern industries of reliability requirement such as road, power grid.However the high frequency of switching device, height in power electronic equipment
Fast on-off causes the up to voltage of gigabit V/S, A/S change rate, current impulse, and then the wideband of generation switch time or more
Harmonic wave, these high-frequency harmonics can cause serious electromagnetic interference problem to system.In recent years, with power electronic equipment high power
Densification development, power electronic equipment are faced with further serious electromagnetic interference challenge.
The high band of Conducted Electromagnetic Interference is mainly determined by suppression common mode electromagnetic interference, and common mode EMI filtering is generallyd use in engineering
The inhibition of device realization suppression common mode electromagnetic interference.However, for needing to common mode filtering megahertz with the suppression common mode electromagnetic interference of super band
Distributed couplings parameter inside device carries out stringent control, to reduce influence of the stray parameter to filter high-frequency performance.But
Greatly increase the cost that designs and manufactures of common-mode filter in this way, meanwhile, promoted common-mode filter high frequency performance there is also
Higher technical barrier.Therefore, common mode EMI can be filtered to reduce by designing power electronic equipment auxiliary filter strategy
Wave device high frequency performance is depended on unduly.
Summary of the invention
In view of the drawbacks of the prior art, dry it is an object of the invention to solve common mode in two level power electronic device of three-phase
The source ringing effect of disturbing is difficult to eliminate, while the more unquenchable technical problem of high band suppression common mode electromagnetic interference.
To achieve the above object, on the one hand, the present invention provides a kind of passive inhibition side of common mode EMI based on the floating ground of split-phase
Method, comprising:
Each phase bridge arm in power electronic equipment is set and corresponds to a radiator, each phase radiator is used for the phase bridge arm
IGBT module radiate;Adjacent two phase heat-radiation device is arranged is spaced apart pre-determined distance, the radiation tooth of adjacent two phase heat-radiation device
Between be staggered;
The magnetic core of exchange output inductor of power electronic equipment is set using dual stack structure, in same inductance value
It is lower opposite to reduce umber of turn, with opposite reduction turn-to-turn and circle to the distribution capacity of magnetic core;
An Absorption Capacitance is bridged between the positive and negative busbar of each phase bridge arm, by presetting the capacitance of Absorption Capacitance and equivalent
Inductance parameters are to control the ringing frequency in common mode interference source.
Optionally, the ringing frequency of interference source is controlled as follows:
The impedance operator of each phase bridge arm is determined according to the circuit parameter of each phase bridge arm, wherein in the first frequency range and third frequency
Capacitive is presented in section, each phase bridge arm equivalent circuit;In the second frequency range and the 4th frequency range, the circuit of each phase is in perception, at this time usually not
Ring can be generated;In full rate frequency range, first frequency range, the second frequency range, third frequency range and the 4th frequency range are successively continuously held in the mouth
Connect distribution;
By designing the capacitance and its parasitic inductance value of Absorption Capacitance, the frequency separation where third frequency range can be controlled
In 30MHZ or more, so that 30MHZ is with the ringing effect of super band in the case where the skin that becomes damps without high frequency ringing in 30MHZ or less frequency range
It can be inhibited.
Optionally, each phase bridge arm corresponds to a radiator, then the parasitic capacitance C of the ac filter inductance of each phase at this timef、
The sum of IGBT direct-to-ground capacitance C in positive negative busbargdAnd IGBT exports midpoint direct-to-ground capacitance CgaOne is shared compared to all phase bridge arms
The C of each phase of radiatorf、CgdAnd CgaIt is opposite to reduce, block the flow cycle of common mode interference.
Optionally, the equivalent parallel capacitor of the exchange output inductor should be same with the direct-to-ground capacitance of each phase radiator
One magnitude.
On the other hand, the present invention provides a kind of power electronic equipment, comprising: multiple radiators;
Each phase bridge arm corresponds to a radiator in the power electronic equipment, and each phase radiator is used for the phase bridge arm
IGBT module radiate;Adjacent two phase heat-radiation device is arranged is spaced apart pre-determined distance, the radiation tooth of adjacent two phase heat-radiation device
Between be staggered;
The magnetic core of the exchange output inductor of the power electronic equipment uses dual stack structure, in same inductance value
It is lower opposite to reduce umber of turn, with opposite reduction turn-to-turn and circle to the distribution capacity of magnetic core;
An Absorption Capacitance is bridged between the positive and negative busbar of each phase bridge arm of power electronic equipment, the Absorption Capacitance
Capacitance and equivalent inductance parameter can control the ringing frequency in common mode interference source.
Optionally, the circuit parameter of each phase bridge arm determines the impedance operator of each phase bridge arm, wherein in the first frequency range and third
Capacitive is presented in frequency range, each phase bridge arm equivalent circuit;In the second frequency range and the 4th frequency range, the circuit of each phase is in perception, at this time usually
Ring will not be generated;In full rate frequency range, first frequency range, the second frequency range, third frequency range and the 4th frequency range are successively continuous
Linking distribution;
By designing the capacitance and its parasitic inductance value of Absorption Capacitance, the frequency separation where third frequency range can be controlled
In 30MHZ or more, so that 30MHZ is with the ringing effect of super band in the case where the skin that becomes damps without high frequency ringing in 30MHZ or less frequency range
It can be inhibited.
Optionally, each phase bridge arm corresponds to a radiator, then the parasitic capacitance C of the ac filter inductance of each phase at this timef、
The sum of IGBT direct-to-ground capacitance C in positive negative busbargdAnd IGBT exports midpoint direct-to-ground capacitance CgaOne is shared compared to all phase bridge arms
The C of each phase of radiatorf、CgdAnd CgaIt is opposite to reduce, block the flow cycle of common mode interference.
Optionally, the equivalent parallel capacitor of the exchange output inductor should be same with the direct-to-ground capacitance of each phase radiator
One magnitude.
In general, through the invention it is contemplated above technical scheme is compared with the prior art, have below beneficial to effect
Fruit:
The present invention provides a kind of passive suppressing method of common mode EMI and device based on the floating ground of split-phase, is set floatingly based on split-phase
The passive suppressing method of the common mode EMI of meter has height to the efficient inhibition of realization common mode EMI in the case where no electromagnetic interface filter
The high frequency common mode EMI rejection of performance can make electromagnetic interface filter be absorbed in low frequency EMI, greatly as auxiliary inhibition means
Ground reduces the design cost of electromagnetic interface filter.The present invention provide a kind of passive suppressing method of common mode EMI based on the floating ground of split-phase and
Device, design cycle is simple, and technical barrier is low;It designs low with device cost;The height in common mode interference source can greatly be inhibited
Frequency vibration bell;High frequency common mode Conducted EMI circulation path can effectively be blocked.
Detailed description of the invention
Fig. 1 is the common mode EMI passive suppressing method schematic diagram provided by the invention based on the floating ground of split-phase;
Fig. 2 is the topological model schematic diagram of two level power electronic device of three-phase provided by the invention;
Fig. 3 is the high frequency model schematic diagram of two level power electronic device of three-phase provided by the invention;
Fig. 4 is the common mode EMI prediction result schematic diagram of two level power electronic device of three-phase provided by the invention;
Fig. 5 is the low EPC ac filter inductor design schematic diagram of laminated construction provided by the invention;
Fig. 6 is the high frequency model signal of the three-phase two level power electronic device provided by the invention based on the floating ground of split-phase
Figure;
Fig. 7 is the equivalent electricity of passive ring of the three-phase two level power electronic device provided by the invention based on the floating ground of split-phase
Road schematic diagram;
Fig. 8 is each bridge arm high frequency mathematics of the three-phase two level power electronic device provided by the invention based on the floating ground of split-phase
Model schematic;
Fig. 9 is the common mode EMI conducting pathway of the three-phase two level power electronic device provided by the invention based on the floating ground of split-phase
Diameter schematic diagram;
Figure 10 is the three-phase two level power electronic device common mode EMI conducting path provided by the invention based on the floating ground of split-phase
Impedance mathematical model schematic diagram;
Figure 11 is amplitude-frequency characteristic schematic diagram of the common mode current provided by the invention in full frequency band;
Figure 12 is the frequency domain comparing result schematic diagram in common mode interference source provided by the invention;
Figure 13 is the time domain comparing result schematic diagram of common mode interference source provided by the invention ringing effect;
Figure 14 is the frequency domain comparing result schematic diagram of common mode interference provided by the invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in the various embodiments of the present invention described below
Not constituting a conflict with each other can be combined with each other.
To achieve the goals above, the present invention mainly contains following several key technology schemes:
(1) IGBT module in two level power electronic device of three-phase on each phase bridge arm passes through independent radiator heat-dissipation,
Radiator between phase and phase is separated by a distance, to reduce capacitive coupling between each phase radiator as far as possible.Similarly, each phase
Radiator and apparatus housing also design a certain distance, to realize the decoupling between radiator and earth-return.This step is real
The basis that existing interference source ring inhibits, while also playing the effect for blocking common mode EMI conducting path.
Preferably, the supporter that the insulating materials such as plastics can be used between radiator and casing realizes the fixation of bridge arm.
Preferably, interlocked opposite method between each phase radiator using radiation tooth side, can further decrease mutually with
The corresponding area of radiator between phase, to reduce capacitive coupling.
(2) the exchange output inductor of two level power electronic device of three-phase uses low effect shunt capacitance
(Equivalent Parallel Capacitor, EPC) design, so that the decoupling between exchange side and bridge arm is realized in high band,
Influence of the shielding exchange side parasitic parameter to interference source ringing effect, while also playing and blocking suppression common mode electromagnetic interference (Electro
Magnetic Interference, EMI) circulation path effect.
Preferably, inductance EPC can be effectively reduced at a distance from circle by suitably increasing coil turn.In addition, using double
The magnetic core of layer high magnetic permeability, winding needed for inductance pounds number less under identical inductance value, and inductance EPC equally can be effectively reduced.
(3) Absorption Capacitance is bridged between the positive and negative busbar of each phase bridge arm, is based on IGBT module power terminal lead
The parameter value that inductance, junction capacity, direct-to-ground capacitance etc. accurately extract in advance, calculates reasonable Absorption Capacitance capacitance and equivalent inductance
(Equivalent Series Inductance, ESL) parameter is located at one to control the ringing frequency of interference source
(general filter design can have for very high frequency (equipment itself skin effect can be effectively suppressed) or low-down frequency
Effect inhibits).
Fig. 1 is the common mode EMI passive suppressing method schematic diagram provided by the invention based on the floating ground of split-phase;As shown in Figure 1, this
The passive suppressing method of EMI that invention provides comprises the following steps:
Dispersion floating ground fansink designs: each phase bridge arm corresponds to a radiator in setting power electronic equipment, each mutually to dissipate
Hot device is for radiating to the IGBT module on the phase bridge arm;Adjacent two phase heat-radiation device is arranged is spaced apart pre-determined distance, phase
It is staggered between the radiation tooth of adjacent two phase heat-radiation device.
Low EPC ac filter inductor design: the magnetic core of exchange output inductor of power electronic equipment is set using double
Overlay structure reduces umber of turn with opposite under same inductance value, with opposite reduction turn-to-turn and circle to the distribution capacity of magnetic core.
Absorption Capacitance parameter calculates: bridging an Absorption Capacitance between the positive and negative busbar of each phase bridge arm, is inhaled by default
Capacitance and the equivalent inductance parameter of capacitor are received to control the ringing frequency in common mode interference source.
Work mould can be blocked to interfere conducting pathway by dispersing floating ground fansink designs and low EPC ac filter inductor design
Diameter can be inhibited altogether by dispersing floating ground fansink designs, low EPC ac filter inductor design and the calculating of Absorption Capacitance parameter
Mould interferes ring.
The present invention provides one kind based on a two level power electronic device of three-phase, and topological structure is as shown in Fig. 2, explanation
Technical solution of the present invention specifically includes following several parts:
(1) two level power electronic device high frequency model of three-phase is accurately established
Before design split-phase floating ground filters solutions, needs accurately to extract IGBT module in power electronic equipment, busbar, hands over directly
The parasitic parameter of streamline cable, DC support capacitor, load etc. critical component.Wherein, active device IGBT module each terminal
Lead-in inductance and direct-to-ground capacitance are obtained by FEM calculation;Collection emitter-base bandgap grading junction capacitance in IGBT module under voltage rating passes through
The capacitance curve that fitting data handbook provides obtains;The stray parameter of DC master row is extracted by finite element analysis;It is other passive
The stray parameter of component is obtained using impedance analyzer measurement.Two level power electronic device of three-phase used in the present invention respectively closes
The results are shown in Table 1 for the stray parameter extraction of key member, and device high frequency model is as shown in Figure 3.
Based on this, time domain prediction simulation model is established in Ansys Simplorer, respectively obtains common mode interference source and is total to
The time domain prediction of mould Conduction Interference as a result, and frequency domain be transformed by fft analysis compared with actual measurement interference, comparing result is such as
Shown in Fig. 4, to verify the accuracy of established system high-frequency model.
Table 1
Wherein, LACinductorIndicate the inductance value of ac filter inductance, CACinductorIndicate the parasitism electricity of ac filter inductance
Capacitance, RACinductorIndicate the resistance value of ac filter inductance, Ldc-linkIndicate the parasitic inductance value of DC support capacitor,
Cdc-linkIndicate the capacitance of DC support capacitor, Rdc-linkIndicate the resistance of tributary Support Capacitor, LACcapacitorIndicate exchange filter
The parasitic inductance value of wave capacitor, CACcapacitorIndicate the capacitance of ac filter capacitor, RACcapacitorIndicate ac filter capacitor
Resistance value, LloadIndicate the inductance value of load, CloadIndicate the parasitic capacitance value over the ground of load, RloadIndicate load resistor value,
LAC-cableIndicate exchange cable equivalent inductance value, LDC-cableIndicate direct current cable equivalent inductance value, RDC-cableIndicate direct current cable
Equivalent resistance, RAC-cableIndicate exchange cable equivalent resistance, LAIndicate A phase busbar parasitic inductance, LBIndicate that B phase busbar is posted
Raw inductance, LCIndicate C phase busbar parasitic inductance, RAIndicate A phase busbar resistance, RBIndicate B phase busbar resistance, RCIndicate C phase busbar
Resistance, CCIndicate bridge arm collector direct-to-ground capacitance in IGBT module, COIndicate IGBT module midpoint output point direct-to-ground capacitance, CETable
Show IGBT module lower bridge arm emitter-base bandgap grading direct-to-ground capacitance, LiCIndicate bridge arm collector cross-talk parasitic inductance in IGBT module, LiOIt indicates
IGBT module midpoint output terminal parasitic inductance, LiEIndicate IGBT module lower bridge arm emitter terminal parasitic inductance, CjIndicate IGBT
The collection emitter-base bandgap grading parasitic capacitance of chip, CgcIndicate door-collector parasitic capacitance of igbt chip, CgeIndicate door-emitter-base bandgap grading of igbt chip
Parasitic capacitance.
(2) split-phase floating ground fansink designs
The structure of split-phase floating ground radiator is as shown in Figure 4.IGBT module on each phase bridge arm is dissipated by independent radiator
Heat, radiator between phase and phase is separated by a distance, and is staggered between radiation tooth, is dissipated with reducing each phase as far as possible
Capacitive coupling between hot device.Meanwhile each phase radiator is isolated with apparatus housing also by insulation column, thus realize radiator with
Decoupling between earth-return.By this design, the coupling between each phase radiator easily reaches a lesser value, each mutually to dissipate
Coupled capacitor between hot device and ground can be calculated roughly are as follows:
C=ε S/d
Wherein, ε is dielectric constant, and S is the corresponding area between radiator and casing, and d is between radiator and casing
Distance.Coupled capacitor between radiator of the present invention and ground should a magnitude at least smaller than the direct-to-ground capacitance of IGBT module,
Based on this, each phase radiator direct-to-ground capacitance is designed as 15pF in actual experiment rack.
(3) low EPC ac filter inductor design
The structure of low EPC ac filter inductance is as shown in Figure 5.Its magnetic core uses dual stack structure, in identical inductance value
Under greatly reduce umber of turn, to effectively reduce turn-to-turn and circle to the distribution capacity of magnetic core.Designed by the invention
The EPC for exchanging output inductor should be same magnitude with each phase radiator direct-to-ground capacitance, just be able to achieve preferable exchange side solution
Coupling effect, therefore, the EPC of each mutually exchange filter inductance is also configured as 15pF in actual experiment rack.
(4) Absorption Capacitance designs
Design based on (2) and (3), can be by choosing capacitance and the ESL of Absorption Capacitance to realize ringing frequency
Control.At this point, under high band (exchange outputting inductance is switched to the frequency point of capacitive, usually 100,000 hertz of ranks by perception),
The high frequency model of system and the passive ring equivalent circuit of device are as shown in Figure 6 and Figure 7.Impedance (the grey bottom frame of each phase at this time
Interior circuit) it may be expressed as:
Wherein,X=A, B or C, upper bridge arm conducting, CupX=Cc+Co, CdnX=
CE;Lower bridge arm conducting, CupX=CC, CdnX=CO+CE。
In above formula, ω is frequency, LigbtFor IGBT module lead-in inductance, CaddFor Absorption Capacitance capacitance, LaddTo absorb electricity
The stray inductance of appearance, CC、CO、CEThe electricity over the ground of bridge arm collector, upper bridge arm emitter-base bandgap grading and lower bridge arm emitter-base bandgap grading respectively in IGBT module
Hold, CjFor IGBT junction capacity.CX、CupXAnd CdnXFor intermediate variable.
Z is as shown in Figure 8 in the impedance characteristic of full frequency band, wherein In I and III
In frequency range, capacitive is presented in the circuit in grey bottom frame, may generate ring with busbar stray inductance resonance.And in II and IV frequency range
Interior, perception is presented in the circuit in grey bottom frame, will not generate ring herein.Therefore, the electricity of Rational choice Absorption Capacitance can be passed through
Capacitance and ESL, reach and force down f1, and by f2And f3Shift 30MHz or more the band limits that Conducted Electromagnetic Interference is not concerned with onto.?
In 30MHz or more band limits, system damping is very big, and high frequency ringing can quickly be inhibited, and is difficult to see on interference source frequency spectrum
It observes.Selected Absorption Capacitance capacitance is 4.7uF, ESL 20nH in the present invention.
(4) common mode interference conducting path is analyzed
Using split-phase floating ground radiator, the common mode conducting path of two level power electronic device of three-phase is as schemed
In 9 shown in (a), by star-triangular transformation, (a) can be further simplified as circuit shown in (b) in Fig. 9 in Fig. 9.Wherein,
Wherein, CgdThe sum of IGBT direct-to-ground capacitance, C in the negative busbar that is positivegaMidpoint direct-to-ground capacitance is exported for IGBT.CsinkIt is scattered
Hot device direct-to-ground capacitance.
It is worth noting that, common two level device of three-phase and two level of three-phase for floating ground radiator based on split-phase fill
It sets, the high frequency model of common mode interference conducting path is identical (in Fig. 9 (b)), and difference is to radiate floatingly based on split-phase
C in two level device of three-phase of devicef,Cgd,CgaIt is greatly reduced.CfFor the parasitic capacitance of ac filter inductance.
By the design of (2), (3), for general system, all generally existing following parameters relationship:
Cf,Cgd,Cga< < Cl
Ld,La< < Lf
Wherein, ClTo load stray capacitance over the ground, La=LACcable+Lload, Ld=LDCcable, Lf=LACinductor。
At this point, the expression formula of the common mode conducting path impedance within the scope of grey bottom frame are as follows:
Impedance operator under its different frequency range is as shown in Figure 10 and table 2, further, surveys at line impedance stabilization net work LISN
The common mode current I obtainedCMWith common mode interference source VCMBetween mathematical relationship are as follows:
Work as VCMFor one in full frequency band amplitude be 1, phase be 0 signal when, amplitude-frequency of the common mode current in full frequency band
Characteristic is as shown in figure 11.In frequency range II, IV, VI, the mathematic(al) representation of common mode current are as follows:
Wherein, linear () indicates a kind of linear function.With CgdReduction, above formula denominator becomes larger, and molecule is kept not
Become, at this time the common mode current I of systemCMIt is to reduce.
In frequency range II, IV, VI, the mathematic(al) representation of common mode current are as follows:
With Cgd,CgaAnd CfReduction, above formula denominator becomes larger, and molecule becomes smaller or remains unchanged, similarly, the common mode of system
Electric current ICMIt is to reduce.Therefore, Restrain measurement proposed by the invention theoretically can realize common mode interference conduction in full frequency band
The inhibition in path.
Table 2
Experimental verification
Experiment of the invention has carried out suppression common mode electromagnetic interference test in strict accordance with the requirement of DO-160 standard.In 150kHz-
Common mode interference source when inhibiting strategy with compared using split-phase floating floatingly and not using split-phase within the scope of 30MHz and at LISN
The common mode interference frequency spectrum measured.
Figure 12 illustrates the frequency domain comparing result in common mode interference source, it can be seen that using common mode interference source frequency behind the floating ground of split-phase
The High-frequency Interference for not having ring to generate in spectrum.Figure 13 compared the time domain waveform of bell signal in interference source, it is clear that use split-phase
The high frequency ringing after strategy in common mode interference source is inhibited quickly to be inhibited floatingly.Demonstrating the present invention can effectively realize
The inhibition in common mode interference source.
Figure 14 illustrates the frequency domain comparing result of conduction common mode interference, it can be seen that the inhibition strategy on the floating ground of split-phase almost exists
Full frequency band (especially high band) reduces the amplitude of common mode interference.Therefore, the experiment proves that the present invention can effectively realize
The inhibition of two level device common mode interference of three-phase.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should all include
Within protection scope of the present invention.
Claims (8)
1. a kind of passive suppressing method of common mode EMI based on the floating ground of split-phase characterized by comprising
Each phase bridge arm in power electronic equipment is set and corresponds to a radiator, each phase radiator is used for on the phase bridge arm
IGBT module radiates;The pre-determined distance that is spaced apart of adjacent two phase heat-radiation device is set, the radiation tooth of adjacent two phase heat-radiation device it
Between be staggered;
The magnetic core of exchange output inductor of power electronic equipment is set using dual stack structure, with the phase under same inductance value
To umber of turn is reduced, with opposite reduction turn-to-turn and circle to the distribution capacity of magnetic core;
An Absorption Capacitance is bridged between the positive and negative busbar of each phase bridge arm, by the capacitance and equivalent inductance of presetting Absorption Capacitance
Parameter is to control the ringing frequency in common mode interference source.
2. the common mode EMI passive suppressing method according to claim 1 based on the floating ground of split-phase, which is characterized in that by such as
The ringing frequency of lower step control interference source:
The impedance operator of each phase bridge arm is determined according to the circuit parameter of each phase bridge arm, wherein in the first frequency range and third frequency range, respectively
Capacitive is presented in phase bridge arm equivalent circuit;In the second frequency range and the 4th frequency range, the circuit of each phase will not usually generate at this time in perception
Ring;In full rate frequency range, the successively continuously linking distribution of first frequency range, the second frequency range, third frequency range and the 4th frequency range;
By designing the capacitance and its parasitic inductance value of Absorption Capacitance, the frequency separation where third frequency range can be controlled
30MHZ or more, so that without high frequency ringing, 30MHZ energy in the case where the skin that becomes damps with the ringing effect of super band in 30MHZ or less frequency range
Access inhibition.
3. the common mode EMI passive suppressing method according to claim 1 or 2 based on the floating ground of split-phase, which is characterized in that each phase
Bridge arm corresponds to a radiator, then the parasitic capacitance C of the ac filter inductance of each phase at this timef, IGBT is over the ground in positive negative busbar
The sum of capacitor CgdAnd IGBT exports midpoint direct-to-ground capacitance CgaCompared to the C for each phase that all phase bridge arms share a radiatorf、
CgdAnd CgaIt is opposite to reduce, block the flow cycle of common mode interference.
4. the common mode EMI passive suppressing method according to claim 1 or 2 based on the floating ground of split-phase, which is characterized in that described
The equivalent parallel capacitor for exchanging output inductor should be same magnitude with the direct-to-ground capacitance of each phase radiator.
5. a kind of power electronic equipment characterized by comprising multiple radiators;
Each phase bridge arm corresponds to a radiator in the power electronic equipment, and each phase radiator is used for on the phase bridge arm
IGBT module radiates;The pre-determined distance that is spaced apart of adjacent two phase heat-radiation device is set, the radiation tooth of adjacent two phase heat-radiation device it
Between be staggered;
The magnetic core of the exchange output inductor of the power electronic equipment uses dual stack structure, with the phase under same inductance value
To umber of turn is reduced, with opposite reduction turn-to-turn and circle to the distribution capacity of magnetic core;
An Absorption Capacitance, the capacitance of the Absorption Capacitance are bridged between the positive and negative busbar of each phase bridge arm of power electronic equipment
It can control the ringing frequency in common mode interference source with equivalent inductance parameter.
6. power electronic equipment according to claim 5, which is characterized in that the circuit parameter of each phase bridge arm determines each phase bridge
The impedance operator of arm, wherein in the first frequency range and third frequency range, capacitive is presented in each phase bridge arm equivalent circuit;In the second frequency range and
4th frequency range, the circuit of each phase will not usually generate ring in perception at this time;In full rate frequency range, first frequency range, second
The successively continuously linking distribution of frequency range, third frequency range and the 4th frequency range;
By designing the capacitance and its parasitic inductance value of Absorption Capacitance, the frequency separation where third frequency range can be controlled
30MHZ or more, so that without high frequency ringing, 30MHZ energy in the case where the skin that becomes damps with the ringing effect of super band in 30MHZ or less frequency range
Access inhibition.
7. power electronic equipment according to claim 5 or 6, which is characterized in that each phase bridge arm corresponds to a radiator,
The then parasitic capacitance C of the ac filter inductance of each phase at this timef, the sum of IGBT direct-to-ground capacitance C in positive negative busbargdAnd IGBT output
Midpoint direct-to-ground capacitance CgaCompared to the C for each phase that all phase bridge arms share a radiatorf、CgdAnd CgaIt is opposite to reduce, it blocks
The flow cycle of common mode interference.
8. power electronic equipment according to claim 5 or 6, which is characterized in that the exchange output inductor etc.
Imitating shunt capacitance should be same magnitude with the direct-to-ground capacitance of each phase radiator.
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CN109347135A (en) * | 2018-11-14 | 2019-02-15 | 华中科技大学 | The common mode Conducted EMI modeling method and device of MMC three-phase grid-connected inverting system |
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Cited By (4)
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CN109347135A (en) * | 2018-11-14 | 2019-02-15 | 华中科技大学 | The common mode Conducted EMI modeling method and device of MMC three-phase grid-connected inverting system |
CN109347135B (en) * | 2018-11-14 | 2020-06-02 | 华中科技大学 | Common-mode conduction EMI modeling method and device of MMC three-phase grid-connected inverter system |
CN111884500A (en) * | 2020-08-03 | 2020-11-03 | 中车青岛四方车辆研究所有限公司 | Method for suppressing common-mode conducted interference of vehicle-mounted charger |
CN111884500B (en) * | 2020-08-03 | 2022-02-22 | 中车青岛四方车辆研究所有限公司 | Method for suppressing common-mode conducted interference of vehicle-mounted charger |
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