CN110062080B - PC board mobile phone rear cover and production process thereof - Google Patents
PC board mobile phone rear cover and production process thereof Download PDFInfo
- Publication number
- CN110062080B CN110062080B CN201910383692.5A CN201910383692A CN110062080B CN 110062080 B CN110062080 B CN 110062080B CN 201910383692 A CN201910383692 A CN 201910383692A CN 110062080 B CN110062080 B CN 110062080B
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- Prior art keywords
- layer
- mobile phone
- rear cover
- phone rear
- hardening
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000005240 physical vapour deposition Methods 0.000 claims abstract description 16
- 239000011248 coating agent Substances 0.000 claims abstract description 15
- 238000000576 coating method Methods 0.000 claims abstract description 15
- 238000013003 hot bending Methods 0.000 claims abstract description 11
- 238000007650 screen-printing Methods 0.000 claims abstract description 8
- 238000004544 sputter deposition Methods 0.000 claims abstract description 7
- 230000000694 effects Effects 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 238000010023 transfer printing Methods 0.000 claims description 15
- 238000005282 brightening Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 230000000903 blocking effect Effects 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 238000009966 trimming Methods 0.000 claims description 5
- 230000004888 barrier function Effects 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000001746 injection moulding Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 3
- 238000002834 transmittance Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 13
- 238000007639 printing Methods 0.000 abstract description 10
- 238000012545 processing Methods 0.000 abstract description 8
- 238000012546 transfer Methods 0.000 abstract description 8
- 238000000926 separation method Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 abstract 1
- 238000005299 abrasion Methods 0.000 description 4
- 238000007766 curtain coating Methods 0.000 description 4
- 239000005022 packaging material Substances 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 210000002268 wool Anatomy 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/025—Duplicating or marking methods; Sheet materials for use therein by transferring ink from the master sheet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
Abstract
The utility model provides a lid behind PC panel cell-phone and production technology thereof, relates to photoelectric product technical field, and it includes the PC panel layer, the surface coating on PC panel layer has one deck top layer hardening layer, the bottom surface coating on PC panel layer has one deck but printing hardening layer that has the steam separation effect, but the bottom surface on printing hardening layer forms one deck UV transfer layer through UV transfer texture, the bottom surface on UV transfer layer forms one deck PVD brightness enhancement layer through the sputtering, the bottom surface on PVD brightness enhancement layer passes through UV printing ink silk screen printing and forms one deck UV printing ink silk screen printing layer. The invention can avoid the generation of larger smell and bubble point in the subsequent hot bending processing process to a great extent.
Description
Technical Field
The invention relates to the technical field of photoelectric products, in particular to a PC board mobile phone rear cover and a production process thereof.
Background
With the popularization of electronic products, electronic products such as smart phones go deep into thousands of households, become an indispensable part of daily life, from 2G age to 3G age to 4G age and 5G communication to be popularized, the back cover material of the mobile phone is also from original plastics to metals to glass ceramics to PC and PMMA composite materials with good communication, and the products are continuously innovated.
In the research of the 3D cover plate of the mobile phone, PC/PMMA composite plate becomes a current hot spot. Because of the advent of the 5G age, the 3D cover market for cell phones is also faced with re-shuffling, glass and ceramics will be on top of it, metals are facing elimination, and traditional plastics will be "regenerated" as one goes on. The existing production process of the PC+PMMA mobile phone rear cover basically comprises the following steps: PC+PMMA composite board material, UV transfer texture, PVD brightening, silk screen printing ink, cutting, hot bending forming, curtain coating hardening layer, UV curing, CNC trimming and forming, and the conventional processing mode is that PC material is subjected to curtain coating or dip coating hardening material after hot bending forming, so that larger smell and bubble point can be generated, the product yield is low, and the production cost is correspondingly increased.
Disclosure of Invention
The invention aims to solve the problem of providing the PC board mobile phone rear cover and the production process thereof, which can avoid generating larger bubble points in the subsequent hot bending processing process to a great extent.
In order to solve the technical problems, the invention adopts the following technical scheme: the utility model provides a lid behind PC panel cell-phone, includes PC panel layer, the surface coating on PC panel layer has one deck top layer hardening layer, the bottom surface coating on PC panel layer has one deck but printing hardening layer that has the steam separation effect, but the bottom surface on printing hardening layer passes through UV transfer texture formation one deck UV transfer layer, the bottom surface on UV transfer layer forms one deck PVD brightness enhancement layer through the sputtering, the bottom surface on PVD brightness enhancement layer passes through UV printing ink silk screen printing and forms one deck UV printing ink silk screen printing layer.
Preferably, the PC board layer is an optical injection molding grade PC film with the thickness of 0.3-1 mm.
More preferably, the surface hardening layer is a hardening abrasion-resistant structure with the hardness of 3-9H, which is formed by solidifying a solvent-free coating or PM solvent on the surface of the PC board layer, and the water drop angle of the hardening abrasion-resistant structure is more than or equal to 105 degrees.
More preferably, the thickness of the surface hardening layer is 8-20um.
More preferably, the water vapor transmission rate of the printable hardening layer is less than or equal to 10mL/m 2 The oxygen blocking rate is less than or equal to 1 g/m after being multiplied by 24 hours 2 The surface dyne value of the material is more than or equal to 42 and the hardness of the material is 1H after being multiplied by 24 hours.
More preferably, the thickness of the printable hardening layer is 0.1-1um.
As another aspect of the invention, a production process of a PC board mobile phone rear cover comprises the following steps:
a. taking a PC plate as a base layer, and coating a solvent-free coating or PM solvent on the surface of the base layer to form a surface hardening layer by curing;
b. coating a printable hardening layer with a water vapor barrier effect on the bottom surface of the base layer;
c. forming a UV transfer printing layer on the bottom surface of the printable hardening layer through UV transfer printing textures;
d. forming a PVD brightening layer on the bottom surface of the UV transfer printing layer by sputtering;
e. forming a UV ink silk-screen layer on the bottom surface of the PVD brightening layer through UV ink silk-screen to obtain a mobile phone rear cover blank;
f. punching the mobile phone rear cover blank, and cutting the mobile phone rear cover blank into a mobile phone rear cover blank with a regular shape;
g. performing hot bending forming on the regular-shape mobile phone rear cover blank to obtain a hot bent mobile phone rear cover blank;
h. and performing CNC trimming on the thermally bent mobile phone rear cover blank, so as to obtain the PC board mobile phone rear cover.
In the production process, the base layer is an optical injection molding grade PC film with the thickness of 0.3-1 mm.
In the production process, the thickness of the surface hardening layer is 8-20um, the hardness is 3-9H, and the water drop angle is more than or equal to 105 degrees.
The thickness of the printable hardening layer is 0.1-1um, and the water vapor transmittance is less than or equal to 10mL/m 2 The oxygen blocking rate is less than or equal to 1 g/m after being multiplied by 24 hours 2 And the surface dyne value is more than or equal to 42 and the hardness is 1H after being multiplied by 24 hours.
The invention has the beneficial effects that: because the surface of the PC board layer is coated with the surface hardening layer, and the bottom surface is coated with the printable hardening layer with the water vapor blocking effect, in the subsequent hot bending processing process, a larger bubble point is basically not generated, the conditions of scratch defect and the like in the processing process can be reduced to a great extent, and compared with the existing production mode of firstly hot bending and then curtain coating the hardening material, the product with the structure can be produced in the subsequent process production, and the product yield can be effectively improved.
Drawings
Fig. 1 is a schematic diagram of the overall structure in an embodiment of the present invention.
The reference numerals are:
1-PC board layer 2-surface hardening layer 3-printable hardening layer
4-UV transfer layer 5-PVD brightening layer 6-ink screen printing layer.
Detailed Description
The invention will be further described with reference to examples and drawings, to which reference is made, but which are not intended to limit the scope of the invention.
As shown in FIG. 1, the back cover of the PC board mobile phone comprises a PC board layer 1, wherein the surface of the PC board layer 1 is coated with a surface hardening layer 2, the bottom surface of the PC board layer 1 is coated with a printable hardening layer 3 with a water vapor blocking effect, the bottom surface of the printable hardening layer 3 forms a layer of UV transfer printing layer 4 through UV transfer printing textures, the bottom surface of the UV transfer printing layer 4 forms a layer of PVD brightening layer 5 through sputtering, and the bottom surface of the PVD brightening layer 5 forms a layer of UV ink silk-screen layer 6 through UV ink silk-screen.
According to the PC board mobile phone rear cover provided by the embodiment, the surface of the PC board layer is coated with the surface hardening layer, and the bottom surface of the PC board layer is coated with the printable hardening layer with the water vapor blocking effect, so that in the subsequent hot bending processing process, larger smell and bubble point are not generated basically, scratch defects and the like in the processing process can be reduced to a great extent, and compared with the existing production mode of firstly hot bending and then curtain coating of the hardening material, the product with the structure can be produced in the subsequent process production, and the product yield can be effectively improved.
Preferably, the PC board layer 1 is an optical injection molded grade PC film having a thickness of 0.3-1 mm.
More preferably, the surface hardening layer 2 is a hardening abrasion-resistant structure with 3-9H hardness formed by solidifying solvent-free paint or PM solvent on the surface of the PC board layer 1, the water drop angle is more than or equal to 105 degrees, the abrasion-resistant performance can reach more than 3000 times (0000 # steel wool, 1 kg), and meanwhile, the surface hardening layer 2 can be thermally bent, does not corrode the PC board layer 1, and the thickness of the surface hardening layer 2 is 8-20um.
More preferably, the water vapor permeability of the printable hardening layer 3 is 10mL/m or less 2 The oxygen blocking rate is less than or equal to 1 g/m after being multiplied by 24 hours 2 The surface of the printing hardening layer 3 has a dyne value of more than or equal to 42 and a hardness of about 1H, so that the process damage is avoided, and the problem of bubble precipitation can be avoided in the later stage due to the good water vapor barrier effect, and the thickness of the printing hardening layer 3 is 0.1-1um.
As another aspect of the invention, a production process of a PC board mobile phone rear cover comprises the following steps:
a. taking a PC plate as a base layer, and coating a solvent-free coating or PM solvent on the surface of the base layer to form a surface hardening layer by curing;
b. coating a printable hardening layer with a water vapor barrier effect on the bottom surface of the base layer;
c. forming a UV transfer printing layer on the bottom surface of the printable hardening layer through UV transfer printing textures;
d. forming a PVD brightening layer on the bottom surface of the UV transfer printing layer by sputtering;
e. forming a UV ink silk-screen layer on the bottom surface of the PVD brightening layer through UV ink silk-screen printing to obtain a mobile phone rear cover blank;
f. punching the mobile phone rear cover blank, and cutting the mobile phone rear cover blank into a mobile phone rear cover blank with a regular shape, so that typesetting and post-procedure processing are facilitated;
g. performing hot bending forming on the regular-shape mobile phone rear cover blank, and performing the process by adopting a grinding tool with a specific shape and specification to obtain a hot-bent mobile phone rear cover blank;
h. CNC trimming is carried out on the thermally bent mobile phone rear cover blank, edge polishing and trimming are carried out on the thermally bent mobile phone rear cover blank, touch sense and smoothness are improved, and therefore the PC board mobile phone rear cover is obtained.
In the above process, the base layer is preferably an optical injection molding grade PC film having a thickness of 0.3 to 1 mm.
In the above process, preferably, the hardened layer has a thickness of 8-20um, a hardness of 3-9H, a water drop angle of not less than 105 degrees, and wear resistance of 3000 times (0000 # steel wool, 1 kg) or more.
The thickness of the printable hardening layer is 0.1-1um, and the water vapor permeability is less than or equal to 10mL/m 2 The oxygen blocking rate is less than or equal to 1 g/m after being multiplied by 24 hours 2 The surface dyne value is more than or equal to 42 and the hardness is about 1H after being multiplied by 24 hours.
The foregoing embodiments are preferred embodiments of the present invention, and in addition, the present invention may be implemented in other ways, and any obvious substitution is within the scope of the present invention without departing from the concept of the present invention.
In order to facilitate understanding of the improvements of the present invention over the prior art, some of the figures and descriptions of the present invention have been simplified, and some other elements have been omitted from this document for clarity, as will be appreciated by those of ordinary skill in the art.
Claims (6)
1. The utility model provides a lid behind PC panel cell-phone, includes PC panel layer (1), its characterized in that: the surface of the PC board layer (1) is coated with a surface hardening layer (2), the bottom surface of the PC board layer (1) is coated with a printable hardening layer (3) with a water vapor blocking effect, the bottom surface of the printable hardening layer (3) forms a UV transfer printing layer (4) through UV transfer printing textures, the bottom surface of the UV transfer printing layer (4) forms a PVD brightening layer (5) through sputtering, and the bottom surface of the PVD brightening layer (5) forms a UV ink silk screen layer (6) through UV ink silk screen printing;
the production process of the PC board mobile phone rear cover comprises the following steps:
a. taking a PC plate as a base layer, and coating a solvent-free coating or PM solvent on the surface of the base layer to form a surface hardening layer by curing;
b. coating a printable hardening layer with a water vapor barrier effect on the bottom surface of the base layer;
c. forming a UV transfer printing layer on the bottom surface of the printable hardening layer through UV transfer printing textures;
d. forming a PVD brightening layer on the bottom surface of the UV transfer printing layer by sputtering;
e. forming a UV ink silk-screen layer on the bottom surface of the PVD brightening layer through UV ink silk-screen to obtain a mobile phone rear cover blank;
f. punching the mobile phone rear cover blank, and cutting the mobile phone rear cover blank into a mobile phone rear cover blank with a regular shape;
g. performing hot bending forming on the regular-shape mobile phone rear cover blank to obtain a hot bent mobile phone rear cover blank;
h. and performing CNC trimming on the thermally bent mobile phone rear cover blank, so as to obtain the PC board mobile phone rear cover.
2. The PC board mobile phone rear cover of claim 1, wherein: the PC board layer (1) is an optical injection molding grade PC film with the thickness of 0.3-1 mm.
3. The PC board mobile phone rear cover of claim 2, wherein: the surface hardening layer (2) is a hardening wear-resistant structure with the hardness of 3-9H, which is formed by solidifying a solvent-free coating or PM solvent on the surface of the PC board layer (1), and the water drop angle is more than or equal to 105 degrees.
4. A PC board mobile phone rear cover as defined in claim 3, wherein: the thickness of the surface hardening layer (2) is 8-20um.
5. The PC board mobile phone rear cover of claim 4, wherein: the water vapor transmittance of the printable hardening layer (3) is less than or equal to 10mL/m 2 The oxygen blocking rate is less than or equal to 1 g/m after being multiplied by 24 hours 2 The surface dyne value of the material is more than or equal to 42 and the hardness of the material is 1H after being multiplied by 24 hours.
6. The PC board mobile phone rear cover of claim 5, wherein: the thickness of the printable hardening layer (3) is 0.1-1um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910383692.5A CN110062080B (en) | 2019-05-08 | 2019-05-08 | PC board mobile phone rear cover and production process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910383692.5A CN110062080B (en) | 2019-05-08 | 2019-05-08 | PC board mobile phone rear cover and production process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110062080A CN110062080A (en) | 2019-07-26 |
| CN110062080B true CN110062080B (en) | 2024-04-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910383692.5A Active CN110062080B (en) | 2019-05-08 | 2019-05-08 | PC board mobile phone rear cover and production process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110062080B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110802795A (en) * | 2019-10-10 | 2020-02-18 | 维达力实业(深圳)有限公司 | Shell integrally-formed preparation method and shell |
| CN110724472A (en) * | 2019-10-24 | 2020-01-24 | 深圳华硕新材料应用科技有限公司 | Decorative back cover of electronic equipment and processing technology |
| CN112187991A (en) * | 2020-10-14 | 2021-01-05 | 衡山县佳诚新材料有限公司 | Lid behind high heat dissipation PC panel cell-phone |
| CN112187990A (en) * | 2020-10-14 | 2021-01-05 | 衡山县佳诚新材料有限公司 | Production process of high-heat-dissipation PC board rear cover of mobile phone |
| CN112969325B (en) * | 2021-02-24 | 2022-11-22 | Oppo广东移动通信有限公司 | Shell assembly, preparation method thereof and electronic equipment |
| CN116968362B (en) * | 2023-09-22 | 2024-01-02 | 玩出梦想(上海)科技有限公司 | Preparation method of front cover of head-mounted display device |
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| Publication number | Publication date |
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| CN110062080A (en) | 2019-07-26 |
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