CN109917163A - A kind of Hall current sensor - Google Patents
A kind of Hall current sensor Download PDFInfo
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- CN109917163A CN109917163A CN201711315055.1A CN201711315055A CN109917163A CN 109917163 A CN109917163 A CN 109917163A CN 201711315055 A CN201711315055 A CN 201711315055A CN 109917163 A CN109917163 A CN 109917163A
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- semiconductor chilling
- chilling plate
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- processor
- shell
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Abstract
This application discloses a kind of Hall current sensors, including shell, annular mounting portion and wiring board are equipped in the shell, the annular mounting portion is equipped with annular core, the outer coiling of the annular core and it is equipped with a notch, Hall element is equipped in the notch, the Hall element, coil is and circuit board electrical connection, wiring is drawn the shell by row's needle by the wiring board, cooling device is additionally provided in the shell, the cooling device includes semiconductor chilling plate, cooling ring, temperature sensor, processor and power governor, the semiconductor chilling plate and the cooling ring are glued by heat-conducting silicone grease, the temperature sensor, power governor, semiconductor chilling plate is electrically connected with processor, the processor also with the circuit board electrical connection.Beneficial effects of the present invention: effective temperature-reducing is carried out to Hall element by cooling device, improves the accuracy rate that Hall sensor uses under the higher environment of temperature.
Description
Technical field
The application belongs to neck sensor domain, specifically, being related to a kind of Hall current sensor.
Background technique
With the development of science and technology, productivity level be continuously improved, electric energy as a kind of clean energy resource, be widely deployed in
In daily production and living, Hall current sensor as detection electric current new tool, by feat of its superior performance with exempt from
The detection mode of access type, the popularity rate in industry just gradually rise, and traditional Hall current sensor is highly prone to temperature
It influences, so that error information detection is larger, under the higher environment of temperature, service efficiency and service life will have a greatly reduced quality.
Summary of the invention
In view of this, the technical problem to be solved by the application is to provide a kind of Hall current sensor, in original biography
Automatic cooling device is increased on the basis of sensor, while optimizing the structure of sensor, it is more convenient to use.
In order to solve the above-mentioned technical problem, this application discloses a kind of Hall current sensor, including shell, the shells
Interior to be equipped with annular mounting portion and wiring board, the annular mounting portion is equipped with annular core, the outer coiling of the annular core and
Equipped with a notch, be equipped with Hall element in the notch, the Hall element, coil and circuit board electrical connection, the route
Wiring is drawn the shell by row's needle by plate, and cooling device is additionally provided in the shell, and the cooling device includes partly leading
Body cooling piece, cooling ring, temperature sensor, processor and power governor, the semiconductor chilling plate and the cooling ring
It is glued by heat-conducting silicone grease, the temperature sensor, power governor, semiconductor chilling plate are electrically connected with processor, described
Processor also with the circuit board electrical connection.
More preferably: cooling device is additionally provided with guide duct, the heat dissipation of one end of the guide duct and the semiconductor chilling plate
Face connection, the other end of the guide duct connects a radiator fan, the radiator fan and the circuit board electrical connection, described to lead
Air hose is located at the two sides of the shell, further promotes the refrigerating efficiency of the semiconductor chilling plate.
More preferably: the heat conduction ring includes interior heat dissipating layer, outer heat dissipating layer and intermediate radiator layer, during the interior heat dissipating layer passes through
Between heat dissipating layer connect with outer heat dissipating layer, the intermediate radiator layer be zigzag or waveform, expand refrigeration area, reduce list
Refrigeration amplitude in the time of position, refrigeration modes are more scientific.
More preferably: the power governor is electrodeless adjustment switch or more gears regulating switch.
Based on above-mentioned Hall current sensor, disclosed herein as well is a kind of controls based on the sensor cooling device
Method, comprising the following steps:
Step 1: power and system according to the semiconductor chilling plate of different model, when the semiconductor chilling plate is worked
Cold efficiency is sampled, and sampling precision is the 5% of the semiconductor chilling plate rated power, is become after the completion of sampling by Fourier
Get power/efficiency curve in return；
Step 2: collected data are sent to the processor by temperature sensor, and the processor is according to the temperature
It spends the sensor collected data of institute and the power/efficiency curve carries out PID calculating, and PID calculated result is used to control
Make the power of the semiconductor chilling plate；
Step 3: when the power rise of the semiconductor chilling plate, the heat of radiating surface is also increased with it, in order into
One step promotes the working efficiency of the semiconductor chilling plate, and the processor is according to the power of the semiconductor chilling plate to described
The revolving speed of radiator fan is adjusted, and power increases, and revolving speed rises, and power reduces, revolving speed decline.
Compared with prior art, the application can be obtained including following technical effect:
1) under the relatively high environment of temperature, cooling operation can be carried out to Hall element, Hall is effectively promoted
The service precision of sensor；
2) using automation cooling system, without human intervention, cooling method is more intelligent；
3) temperature-fall period is optimized by pid algorithm, product significantly increases the adaptability of environment.
Certainly, implement any product of the application it is not absolutely required to and meanwhile reach all the above technical effect.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please are not constituted an undue limitation on the present application for explaining the application.In the accompanying drawings:
Fig. 1 is the general structure schematic diagram of the application Hall current sensor embodiment；
Fig. 2 is the application Hall current sensor embodiment with system block diagram.
Specific embodiment
Presently filed embodiment is described in detail below in conjunction with accompanying drawings and embodiments, how the application is applied whereby
Technological means solves technical problem and reaches the realization process of technical effect to fully understand and implement.
A kind of Hall current sensor of the embodiment of the present application as shown in Figure 1:, including shell 1, shell 1 is interior to be equipped with annular
Mounting portion 4 and wiring board, annular mounting portion 4 are being lacked equipped with annular core 3, the outer coiling of annular core 3 and equipped with a notch
Hall element 2 is equipped in mouthful, Hall element 2, coil are drawn wiring by row's needle 12 with circuit board electrical connection, wiring board
Shell 1, row's needle 12 are connect by conducting wire with server terminal, and 1 is additionally provided with cooling device in shell, and cooling device includes partly leading
Body cooling piece 6, cooling ring 7, temperature sensor 5, processor 10 and power governor 11, semiconductor chilling plate 6 with it is described cold
But ring 7 is glued by heat-conducting silicone grease, and semiconductor chilling plate 6 can may be that muti-piece is composed for monolithic, temperature sensor
5, power governor 11, semiconductor chilling plate 6 are electrically connected with processor 10, processor also with circuit board electrical connection, power regulation
Device 11 is electrodeless adjustment switch or more gears regulating switch.
At work due to semiconductor chilling plate, the radiating efficiency of radiating surface determines the refrigeration effect of semiconductor chilling plate
Fruit, therefore guide duct 8 is additionally provided on cooling device, one end of guide duct 8 is connect with the radiating surface of semiconductor chilling plate 6, is led
The other end of air hose 8 connects a radiator fan 9, and radiator fan 9 and circuit board electrical connection, guide duct 8 are located at the two of the shell 1
Side is enhanced the radiating efficiency of 6 radiating surface of semiconductor chilling plate by radiator fan, further improves the system of semiconductor chilling plate
Cold effect.
In order to accomplish that refrigeration amplitude is small in the case where semiconductor chilling plate power is constant, the big effect of refrigeration area will
Heat conduction ring 7 is arranged to include interior heat dissipating layer, outer heat dissipating layer and intermediate radiator layer, and interior heat dissipating layer passes through intermediate radiator layer and outer heat dissipation
Layer connection, intermediate radiator layer can be zigzag or waveform.
Based on above-mentioned Hall current sensor, the control method of cooling device the following steps are included:
Step 1: according to the semiconductor chilling plate 6 of different model, the power when semiconductor chilling plate 6 is worked with
Refrigerating efficiency is sampled, and sampling precision is the 5% of 6 rated power of semiconductor chilling plate, by Fu after the completion of sampling
Leaf transformation obtains power/efficiency curve；
Step 2: collected data are sent to the processor 10 by temperature sensor 5, and the processor 10 is according to institute
It states the 5 collected data of institute of temperature sensor and the power/efficiency curve carries out PID calculating, and PID calculated result is used
In the power for controlling the semiconductor chilling plate 6；
Step 3: when the power rise of the semiconductor chilling plate 6, the heat of radiating surface is also increased with it, in order to
Further promote the working efficiency of the semiconductor chilling plate 6, the processor 10 is according to the power of the semiconductor chilling plate 6
The revolving speed of the radiator fan 9 is adjusted, power increases, and revolving speed rises, and power reduces, revolving speed decline.
As shown in Fig. 2, be directed to above-mentioned Hall current sensor, method in practice the following steps are included:
Step 1: collected electric current and temperature information are sent to by Hall current sensor after data processor processes
Server terminal；
Step 2: information is sent to display in real time and shown by server terminal, and is carried out at regular intervals
The preservation of data, while data are sent to mobile terminal, related work by embedded Wi-Fi module by server terminal in real time
Personnel can monitor in real time from information of the mobile terminal to Hall sensor；
Step 3: if the automatic control circuit in Hall current sensor is unable to satisfy the needs of cooling device power,
When the control program being originally arranged can not cope with actual environment variation, then relevant staff can also by controller or
Mobile terminal carries out artificial intervention to the cooling device operation power in Hall sensor；
Step 4: mobile terminal or controller can also be by server terminals to the heat dissipation in Hall current sensor
Fan carries out rate adaptation, indirectly improves the cooling efficiency of cooling device.
Beneficial effects of the present invention: effective temperature-reducing is carried out to Hall element by cooling device, improves Hall sensor
The accuracy rate used under the higher environment of temperature, and cooling device is controlled by pid algorithm, cooling effect is more managed
Think.
Several preferred embodiments of the invention have shown and described in above description, but as previously described, it should be understood that the present invention
Be not limited to forms disclosed herein, should not be regarded as an exclusion of other examples, and can be used for various other combinations,
Modification and environment, and the above teachings or related fields of technology or knowledge can be passed through within that scope of the inventive concept describe herein
It is modified.And changes and modifications made by those skilled in the art do not depart from the spirit and scope of the present invention, then it all should be in this hair
In the protection scope of bright appended claims.
Claims (5)
1. a kind of Hall current sensor, including shell (1), the shell (1) is interior to be equipped with annular mounting portion (4) and wiring board,
The annular mounting portion (4) is equipped with annular core (3), the outer coiling of the annular core (3) and is equipped with a notch, described to lack
Hall element (2) are equipped in mouthful, the Hall element (2), coil are and circuit board electrical connection, the wiring board pass through row's needle
(12) shell (1) is drawn into wiring, it is characterised in that: (1) is additionally provided with cooling device, the cooling device in the shell
It is described including semiconductor chilling plate (6), cooling ring (7), temperature sensor (5), processor (10) and power governor (11)
Semiconductor chilling plate (6) and the cooling ring (7) are glued by heat-conducting silicone grease, the temperature sensor (5), power governor
(11), semiconductor chilling plate (6) is electrically connected with processor (10), the processor (10) also with the circuit board electrical connection.
2. Hall current sensor according to claim 1, it is characterised in that: cooling device is additionally provided with guide duct (8), institute
The one end for stating guide duct (8) is connect with the radiating surface of the semiconductor chilling plate (6), the other end connection of the guide duct (8)
One radiator fan (9), the radiator fan (9) and the circuit board electrical connection, the guide duct (8) are located at the shell (1)
Two sides.
3. Hall current sensor according to claim 1, it is characterised in that: the heat conduction ring (7) include interior heat dissipating layer,
Outer heat dissipating layer and intermediate radiator layer, the interior heat dissipating layer are connect by intermediate radiator layer with outer heat dissipating layer, the intermediate radiator layer
For zigzag or waveform.
4. Hall current sensor according to claim 1, it is characterised in that: the power governor (11) is electrodeless tune
Section switch or more gears regulating switch.
5. a kind of control method based on cooling device as claimed in claim 2, it is characterised in that: include the following steps,
Step 1: according to the semiconductor chilling plate (6) of different model, the power when semiconductor chilling plate (6) are worked with
Refrigerating efficiency is sampled, and sampling precision is the 5% of the semiconductor chilling plate (6) rated power, passes through Fu after the completion of sampling
In leaf transformation obtain power/efficiency curve；
Step 2: collected data are sent to the processor (10) by temperature sensor (5), processor (10) basis
Temperature sensor (5) the collected data of institute and the power/efficiency curve carry out PID calculating, and PID is calculated and is tied
Fruit is used to control the power of the semiconductor chilling plate (6)；
Step 3: when the power rise of the semiconductor chilling plate (6), the heat of radiating surface is also increased with it, in order into
One step promotes the working efficiency of the semiconductor chilling plate (6), and the processor (10) is according to the semiconductor chilling plate (6)
The revolving speed of the radiator fan (9) is adjusted in power, and power increases, and revolving speed rises, and power reduces, revolving speed decline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711315055.1A CN109917163A (en) | 2017-12-12 | 2017-12-12 | A kind of Hall current sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711315055.1A CN109917163A (en) | 2017-12-12 | 2017-12-12 | A kind of Hall current sensor |
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| CN109917163A true CN109917163A (en) | 2019-06-21 |
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| CN201711315055.1A Pending CN109917163A (en) | 2017-12-12 | 2017-12-12 | A kind of Hall current sensor |
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|---|---|---|---|---|
| US20050156587A1 (en) * | 2004-01-16 | 2005-07-21 | Fieldmetrics Inc. | Current sensor |
| CN102866282A (en) * | 2012-09-11 | 2013-01-09 | 中国科学院等离子体物理研究所 | Zero-flux hall large-current sensor structure |
| CN203798887U (en) * | 2013-12-31 | 2014-08-27 | 上海宝钢磁业有限公司 | Open-loop Hall current sensor |
| CN104267762A (en) * | 2014-09-17 | 2015-01-07 | 深圳英飞拓科技股份有限公司 | Semiconductor chilling plate control device and surveillance camera |
| CN204489548U (en) * | 2015-03-27 | 2015-07-22 | 大连东软信息学院 | Intelligent temperature reduction device |
| CN105675950A (en) * | 2015-12-31 | 2016-06-15 | 深圳青铜剑科技股份有限公司 | Closed loop Hall current sensor |
| CN208140777U (en) * | 2018-04-28 | 2018-11-23 | 宁波海泰汽车电子有限公司 | Hall current sensor |
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2017
- 2017-12-12 CN CN201711315055.1A patent/CN109917163A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050156587A1 (en) * | 2004-01-16 | 2005-07-21 | Fieldmetrics Inc. | Current sensor |
| CN102866282A (en) * | 2012-09-11 | 2013-01-09 | 中国科学院等离子体物理研究所 | Zero-flux hall large-current sensor structure |
| CN203798887U (en) * | 2013-12-31 | 2014-08-27 | 上海宝钢磁业有限公司 | Open-loop Hall current sensor |
| CN104267762A (en) * | 2014-09-17 | 2015-01-07 | 深圳英飞拓科技股份有限公司 | Semiconductor chilling plate control device and surveillance camera |
| CN204489548U (en) * | 2015-03-27 | 2015-07-22 | 大连东软信息学院 | Intelligent temperature reduction device |
| CN105675950A (en) * | 2015-12-31 | 2016-06-15 | 深圳青铜剑科技股份有限公司 | Closed loop Hall current sensor |
| CN208140777U (en) * | 2018-04-28 | 2018-11-23 | 宁波海泰汽车电子有限公司 | Hall current sensor |
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Application publication date: 20190621 |
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