CN109496057A - A kind of printed circuit board layout - Google Patents
A kind of printed circuit board layout Download PDFInfo
- Publication number
- CN109496057A CN109496057A CN201811340901.XA CN201811340901A CN109496057A CN 109496057 A CN109496057 A CN 109496057A CN 201811340901 A CN201811340901 A CN 201811340901A CN 109496057 A CN109496057 A CN 109496057A
- Authority
- CN
- China
- Prior art keywords
- power supply
- welding section
- printed circuit
- circuit board
- managing chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/14—Arrangements for reducing ripples from dc input or output
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/44—Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dc-Dc Converters (AREA)
Abstract
The present invention provides a kind of printed circuit board layout, is applied in printed circuit board, including DC-DC DC power supply managing chip, first capacitor welding section and the second capacitor welding section；DC-DC DC power supply managing chip and first capacitor welding section and the second capacitor welding section are arranged on the same face of printed circuit board；The ground pad of DC-DC DC power supply managing chip and the ground pad of first capacitor welding section and the ground pad of the second capacitor welding section are formed by a metal conductor regions.The beneficial effects of the present invention are: building unit element circuit, to reduce the ripple of DC-DC DC power supply managing chip and improve the Electro Magnetic Compatibility of circuit and the ability of static discharge.
Description
Technical field
The present invention relates to technical field of semiconductors more particularly to a kind of printed circuit board to be laid out.
Background technique
At present in smart television, set-top box, generally according to CPU&GPU loading condition dynamic in the electronic products such as intelligent sound box
Supply line voltage is adjusted to reach system steady operation, but DC-DC power source will appear ripple and cause entire electronic product greatly
In electronic system break down, also result in and occur current sound at the loudspeaker of electronic product, or even Electro Magnetic Compatibility can be caused
And the problem of static discharge, in turn results in manpower financial capacity's to be easily damaged the internal structure and detonator circuit failure of circuit
Unnecessary loss, therefore how to reduce the ripple in DC-DC and promote the ability of the anti-electrostatic discharging of DC-DC and improve DC-
The Electro Magnetic Compatibility of DC is always generally acknowledged problem.
In the prior art using when the power supply ripple of DC-DC increases, voltage and the external mode for increasing power supply are just improved
To reduce the ripple of DC-DC；When the problem of Electro Magnetic Compatibility occurs in DC-DC and static discharge is higher, by increasing barrier
Mode improves Electro Magnetic Compatibility and improves the ability of static discharge, but above-mentioned technology requires higher cost, and not
It can fundamentally solve the problems, such as DC-DC in current circuit.
Summary of the invention
For the above-mentioned problems in the prior art, one kind is now provided and is intended to reduce DC-DC DC power supply managing chip
Ripple and improve circuit Electro Magnetic Compatibility and static discharge ability printed circuit board layout.
Specific technical solution is as follows:
A kind of printed circuit board layout, is applied in printed circuit board, wherein including DC-DC DC power supply managing chip,
First capacitor welding section and the second capacitor welding section；
DC-DC DC power supply managing chip and first capacitor welding section and the second capacitor welding section are arranged in printed circuit
On the same face of plate；
The ground pad of DC-DC DC power supply managing chip and the ground pad of first capacitor welding section and the second capacitor
The ground pad of welding section is formed by a metal conductor regions.
Preferably, printed circuit board is laid out, wherein first capacitor welding section is adjacent with DC-DC DC power supply managing chip
Setting.
Preferably, printed circuit board is laid out, wherein the second capacitor welding section is adjacent with DC-DC DC power supply managing chip
Setting.
Preferably, printed circuit board is laid out, wherein first capacitor welding section is arranged in DC-DC DC power supply managing chip
Top.
Preferably, printed circuit board is laid out, wherein the second capacitor welding section is arranged in DC-DC DC power supply managing chip
Lower section.
Preferably, printed circuit board is laid out, wherein DC-DC DC power supply managing chip includes feedback pad, and DC-DC is straight
The ground pad and feedback pad for flowing power management chip are disposed adjacent.
Preferably, printed circuit board is laid out, wherein further includes the first feedback resistance welding section, the welding of the first feedback resistance
Area and DC-DC DC power supply managing chip are disposed adjacent.
Preferably, printed circuit board is laid out, wherein further includes the second feedback resistance welding section, the welding of the second feedback resistance
Area and DC-DC DC power supply managing chip are disposed adjacent.
Preferably, printed circuit board is laid out, wherein further includes inductance, inductance and DC-DC DC power supply managing chip are adjacent
Setting.
Above-mentioned technical proposal has the following advantages that or the utility model has the advantages that by by DC-DC DC power supply managing chip and first
Capacitor welding section and the second capacitor welding section are arranged on the same face of printed circuit board, and the ground connection of above-mentioned three is welded
Disk is formed to construct unit element circuit by a metal conductor regions, to reduce the wave of DC-DC DC power supply managing chip
The ability of the Electro Magnetic Compatibility and static discharge of line and raising circuit.
Detailed description of the invention
With reference to appended attached drawing, more fully to describe the embodiment of the present invention.However, appended attached drawing be merely to illustrate and
It illustrates, and is not meant to limit the scope of the invention.
Fig. 1 is the structural schematic diagram of printed circuit board Layout Embodiment of the present invention；
Fig. 2 is the structural schematic diagram of the bulk loop of printed circuit board Layout Embodiment of the present invention；
Fig. 3 is that the DC-DC of printed circuit board Layout Embodiment of the present invention opens the structural schematic diagram in circuit；
Fig. 4 is that the DC-DC of printed circuit board Layout Embodiment of the present invention closes the structural schematic diagram in circuit；
Fig. 5 is the structural schematic diagram of the DC-DC feedback loop of printed circuit board Layout Embodiment of the present invention.
Appended drawing reference, 1, DC-DC DC power supply managing chip, 21, first capacitor welding section, the 22, second capacitor welding section,
31, the first feedback resistance welding section, the 32, second feedback resistance welding section, 4, ground pad, 5, feedback pad, 6, inductance, K1,
First switch, K2, second switch.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art without creative labor it is obtained it is all its
His embodiment, shall fall within the protection scope of the present invention.
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
The present invention will be further explained below with reference to the attached drawings and specific examples, but not as the limitation of the invention.
The present invention includes a kind of printed circuit board layout, is applied in printed circuit board, as shown in Figs. 1-2, including DC-DC
DC power supply managing chip 1, first capacitor welding section 21 and the second capacitor welding section 22；
DC-DC DC power supply managing chip 1 and first capacitor welding section 21 and the setting of the second capacitor welding section 22 are printing
On the same face of printed circuit board；
The ground pad 4 of DC-DC DC power supply managing chip 1 and the ground pad 4 of first capacitor welding section 21 and
The ground pad 4 of two capacitor welding sections 22 is formed by a metal conductor regions.
Further, in a preferred embodiment, DC-DC DC power supply managing chip 1 and first capacitor welding section 21
And second capacitor welding section 22 can be arranged in together on the top layer face of printed circuit board；
DC-DC DC power supply managing chip 1 and first capacitor welding section 21 and the second capacitor welding section 22 can also be with one
On the round floor for playing setting printed circuit board.
Further, in a preferred embodiment, in the printed circuit boards, by adjusting DC-DC DC power supply management
The position of chip 1 and first capacitor welding section 21 and the second capacitor welding section 22, and make DC-DC DC power supply managing chip
1 and first capacitor welding section 21 and the second capacitor welding section 22 is arranged on the same face of printed circuit board and DC-DC is straight
Flow the ground pad 4 of power management chip 1 and the ground pad 4 of first capacitor welding section 21 and the second capacitor welding section 22
Ground pad 4 is formed by a metal conductor regions.To construct three short signal circuits, such as DC-DC ON signal circuit,
DC-DC OFF signal circuit, DC-DC feedback signal circuit, and then realize the influence for reducing the interference path in each signal circuit,
And reduce the ripple of DC-DC DC power supply managing chip 1 in each signal circuit and improve Electric Circuit Electromagnetic Compatibility, and
Improve the ability of the static discharge of circuit.
The beneficial effect of above embodiment is by welding DC-DC DC power supply managing chip 1 and first capacitor
Area 21 and the second capacitor welding section 22 are arranged on the same face of printed circuit board, and by the ground pad 4 of above-mentioned three
Three signal circuits that can realize that building is shorter are formed by a metal conductor regions, to reduce cost, and then are suitble to
In popularization and use, the experience sense of user is improved.
Further, in the above-described embodiments, first capacitor welding section 21 is adjacent with DC-DC DC power supply managing chip 1
Setting.
Further, in the above-described embodiments, the second capacitor welding section 22 is adjacent with DC-DC DC power supply managing chip 1
Setting.
To realize first capacitor welding section 21 and DC-DC DC power supply managing chip 1 and the second capacitor welding section 22
Between constitute unit element circuit, and then increase the line width width of each welding section indirectly, reduce the resistance of signal circuit, increase
The strong electrostatic pressure resistance amount of signal circuit and the ripple for reducing the DC-DC DC power supply managing chip 1 in signal circuit, and
And the Electro Magnetic Compatibility of DC-DC DC power supply managing chip 1 is improved, while also improving the Electro Magnetic Compatibility of entire circuit.
Further, in the above-described embodiments, first capacitor welding section 21 is arranged in DC-DC DC power supply managing chip 1
Top.
Further, in the above-described embodiments, the second capacitor welding section 22 is arranged in DC-DC DC power supply managing chip 1
Lower section.
To make first capacitor welding section 21 and DC-DC DC power supply managing chip 1 and input power condenser welding successively
It is connected, to increase the line width width of each welding section indirectly, reduces the resistance of signal circuit, and then enhance signal circuit
Electrostatic pressure resistance amount and reduce the ripple of the DC-DC DC power supply managing chip 1 in signal circuit, and improve raising
The Electro Magnetic Compatibility of DC-DC DC power supply managing chip 1, while also improving the Electro Magnetic Compatibility of entire circuit.
Further, in the above-described embodiments, DC-DC DC power supply managing chip 1 includes feedback pad 5, DC-DC direct current
The ground pad 4 and feedback pad 5 of power management chip 1 are disposed adjacent.
DC-DC DC power supply managing chip 1 and first capacitor welding section 21 and the second capacitor are welded to realize
Most short feedback signal circuit is constructed between area 22, and then is enhanced the electrostatic pressure resistance amount in feedback signal circuit and reduced feedback
The ripple of DC-DC DC power supply managing chip 1 in signal circuit, and improve and improve DC-DC DC power supply managing chip 1
Electro Magnetic Compatibility.
It further, in the above-described embodiments, further include the first feedback resistance welding section 31, the first feedback resistance welding section
31 and DC-DC DC power supply managing chip 1 is disposed adjacent；It further include the second feedback resistance welding section 32, the weldering of the second feedback resistance
It meets area 32 and DC-DC DC power supply managing chip 1 is disposed adjacent.
To construct most short feedback signal circuit, and then enhances the electrostatic pressure resistance amount in feedback signal circuit and reduce
The ripple of DC-DC DC power supply managing chip 1 in feedback signal circuit, and improve and improve the management of DC-DC DC power supply
The Electro Magnetic Compatibility of chip 1.
It further, in the above-described embodiments, further include inductance 6, inductance 6 and DC-DC DC power supply managing chip 1 are adjacent
Setting.
In conclusion in the printed circuit boards, by adjusting DC-DC DC power supply managing chip 1 and capacitor welding section
Position, and DC-DC DC power supply managing chip 1 and capacitor welding section are set with a piece of metal conductor layer.To construct
Three short signal circuits；
As shown in figure 3, when second switch K2 is closed, circuit at this time is that DC-DC opens circuit when first switch K1 is opened
(being wherein signal transmission path represented by dotted line), and DC-DC at this time open circuit signal circuit it is most short；To realize
The ripple of DC-DC DC power supply managing chip 1 is reduced in the signal circuit that DC-DC opens circuit and improves the electromagnetic compatibility of circuit
Property, and improve the ability of the static discharge of circuit；
As shown in figure 4, when second switch K2 is opened, circuit at this time is that DC-DC closes circuit when first switch K1 is closed
(being wherein signal transmission path represented by dotted line), and the signal circuit in the pass DC-DC circuit at this time are most short；To realize
The ripple of DC-DC DC power supply managing chip 1 is reduced in the signal circuit that DC-DC opens circuit and improves the electromagnetic compatibility of circuit
Property, and improve the ability of the static discharge of circuit；
As shown in figure 5, DC-DC feedback loop signal circuit be most it is short (be represented by dotted line wherein signal transmission
Path)；To realize the ripple of reduction DC-DC DC power supply managing chip 1 in the signal circuit that DC-DC opens circuit and mention
The Electro Magnetic Compatibility of high circuit, and improve the ability of the static discharge of circuit.
The foregoing is merely preferred embodiments of the present invention, are not intended to limit embodiments of the present invention and protection model
It encloses, to those skilled in the art, should can appreciate that all with made by description of the invention and diagramatic content
Equivalent replacement and obviously change obtained scheme, should all be included within the scope of the present invention.
Claims (9)
1. a kind of printed circuit board layout, is applied in printed circuit board, which is characterized in that including DC-DC DC power supply management
Chip, first capacitor welding section and the second capacitor welding section；
The DC-DC DC power supply managing chip and the setting of the first capacitor welding section and second capacitor welding section exist
On the same face of the printed circuit board；
The ground pad of the ground pad of the DC-DC DC power supply managing chip and the first capacitor welding section and described
The ground pad of second capacitor welding section is formed by a metal conductor regions.
2. printed circuit board layout as described in claim 1, which is characterized in that the first capacitor welding section and the DC-
DC DC power supply managing chip is disposed adjacent.
3. printed circuit board layout as described in claim 1, which is characterized in that second capacitor welding section and the DC-
DC DC power supply managing chip is disposed adjacent.
4. printed circuit board layout as described in claim 1, which is characterized in that the first capacitor welding section is arranged described
The top of DC-DC DC power supply managing chip.
5. printed circuit board layout as described in claim 1, which is characterized in that second capacitor welding section is arranged described
Below DC-DC DC power supply managing chip.
6. printed circuit board layout as described in claim 1, which is characterized in that the DC-DC DC power supply managing chip packet
Feedback pad is included, the ground pad of the DC-DC DC power supply managing chip and the feedback pad are disposed adjacent.
7. printed circuit board layout as described in claim 1, which is characterized in that further include the first feedback resistance welding section, institute
It states the first feedback resistance welding section and the DC-DC DC power supply managing chip is disposed adjacent.
8. printed circuit board layout as described in claim 1, which is characterized in that further include the second feedback resistance welding section, institute
It states the second feedback resistance welding section and the DC-DC DC power supply managing chip is disposed adjacent.
9. printed circuit board layout as described in claim 1, which is characterized in that it further include inductance, the inductance and the DC-
DC DC power supply managing chip is disposed adjacent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811340901.XA CN109496057A (en) | 2018-11-12 | 2018-11-12 | A kind of printed circuit board layout |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811340901.XA CN109496057A (en) | 2018-11-12 | 2018-11-12 | A kind of printed circuit board layout |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109496057A true CN109496057A (en) | 2019-03-19 |
Family
ID=65695734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811340901.XA Pending CN109496057A (en) | 2018-11-12 | 2018-11-12 | A kind of printed circuit board layout |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109496057A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109640515A (en) * | 2019-01-28 | 2019-04-16 | 晶晨半导体（深圳）有限公司 | A kind of printed circuit board structure |
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| CN109640515A (en) * | 2019-01-28 | 2019-04-16 | 晶晨半导体（深圳）有限公司 | A kind of printed circuit board structure |
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Application publication date: 20190319 |
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