CN109282950A - The pressure-detecting device of fingerprint mould group and fingerprint mould group - Google Patents
The pressure-detecting device of fingerprint mould group and fingerprint mould group Download PDFInfo
- Publication number
- CN109282950A CN109282950A CN201710601378.0A CN201710601378A CN109282950A CN 109282950 A CN109282950 A CN 109282950A CN 201710601378 A CN201710601378 A CN 201710601378A CN 109282950 A CN109282950 A CN 109282950A
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- layer
- hole
- electronic device
- mould group
- fingerprint mould
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M3/00—Investigating fluid-tightness of structures
- G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
- G01M3/26—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors
Abstract
The invention discloses a kind of fingerprint mould groups, the sealing element of setting is contacted with the side wall of electronic device layer and elastic layer, the side wall and elastic layer of connection of electronic devices layer, electronic device layer and elastic layer are sealed by sealing element, after sealing element loosens failure, seal failure between electronic device layer and elastic layer, it is ventable, so, it can be ventilated again with outside atmosphere by welding layer and first through hole, the path being connected to outside atmosphere can be formed in fingerprint mould group, the circulation of atmosphere can be carried out in fingerprint mould group, the leakproofness for being conducive to the subsequent sealing element to fingerprint mould group detects, improve detection accuracy.A kind of pressure-detecting device of above-mentioned fingerprint mould group is also provided, after seal fails, the first through hole formation flow of ambient air path of first cavity, the second cavity, welding layer and elastic layer, pressure test instrument can effectively and accurately detect pressure change, can effectively and accurately detect leakproofness.
Description
Technical field
The present invention relates to electronic technology field, in particular to the pressure detecting of a kind of fingerprint mould group and fingerprint mould group fills
It sets.
Background technique
In order to improve the waterproof performance of fingerprint modular structure, need to carry out it waterproofness detection i.e. sealing propertytest, mesh
Preceding to detect for waterproof, producing the principle measured in enormous quantities is to determine its waterproof performance using the changing value of pressure detecting.Example
Such as, joint between each layer of fingerprint mould group is sealed by sealing element, after sealing element, which loosens, to fail, caused by
Air pressure change is smaller, can not effectively carry out pressure detecting, causes fingerprint mould group sealing propertytest accuracy lower.
Summary of the invention
Based on this, it is necessary to the problem for causing sealing propertytest accuracy lower is detected for effective pressure can not be carried out,
The pressure-detecting device of a kind of fingerprint mould group and fingerprint mould group is provided.
A kind of fingerprint mould group, comprising:
Electronic device layer；
Welding layer is set to the side of the electronic device layer, including several spaced welding units；
The elastic layer for offering first through hole is set to the side far from the electronic device layer of the welding layer, with
Interval region between the opposite welding unit in the first through hole position is connected to the first through hole；
Sealing element is contacted with the side wall of the electronic device layer and the elastic layer, connects the electronic device layer
Side wall and the elastic layer, and sealed between the electronic device layer and the elastic layer by the sealing element.
Above-mentioned fingerprint mould group, welding layer are set to the side of electronic device layer, and elastic layer is set to welding layer far from electronics
The side of device layer, i.e. welding layer are between electronic device layer and elastic layer, the sealing element and electronic device layer of setting
Side wall and elastic layer contact, the side wall and elastic layer of connection of electronic devices layer, and between electronic device layer and elastic layer lead to
Overstocked seals, first of interval region and elastic layer in welding layer between the welding unit opposite with first through hole position
Through-hole connection, after sealing element loosens failure, seal failure between electronic device layer and elastic layer is ventable, in this way, leading to again
Crossing welding layer and first through hole can ventilate with outside atmosphere, i.e., can form the path being connected to outside atmosphere in fingerprint mould group,
The circulation of atmosphere can be carried out in fingerprint mould group, thus, before being loosened relative to sealing element, space pressure change in fingerprint mould group
Larger, the leakproofness for being conducive to the subsequent sealing element to fingerprint mould group detects, and improves detection accuracy.
The elastic layer includes the first surface adjacent with the welding layer, the sealing in one of the embodiments,
Part is located at the first surface formation of the side wall of the electronic device layer and the side wall of the welding layer and the elastic layer
In region, the sealing element is also contacted with the first surface of the elastic layer, and connects the side wall of the electronic device layer
With the first surface of the elastic layer.In this way, can not only realize the sealing between electronic device layer and elastic layer, and welding layer is
It is placed between electronic device layer and elastic layer, reduces welding layer and extraneous contact, and be convenient for the setting of sealing element.
The interval region between the welding unit is located at the electronic device layer described in one of the embodiments,
In the view field of welding layer, the first through hole is located at the electronic device layer in the view field of the elastic layer.Such as
This, electronic device layer covers the interval region between first through hole and welding unit, and after sealing by sealing element, electricity can be improved
Leakproofness between sub- device layer and elastic layer.
Above-mentioned fingerprint mould group in one of the embodiments, further includes:
The adhesive tape layer for offering the second through-hole, is set to side of the elastic layer far from the welding layer, and described second
Through-hole is connected to the first through hole；
The reinforcing layer for offering third through-hole is set to side of the adhesive tape layer far from the elastic layer, the third
Through-hole is connected to second through-hole.
In this way, also setting up adhesive tape layer and reinforcing layer on the basis of welding layer and elastic layer is arranged, fingerprint mould group can be improved
Intensity, be also convenient for the detection of the subsequent sealing effect to fingerprint mould group.
The first through hole, the radius phase of second through-hole and the third through-hole in one of the embodiments,
Together, and the central axes of the first through hole, second through-hole and the third through-hole are conllinear.It can make first through hole, second
The area for the connected region that through-hole and third through-hole are formed maximizes, that is, maximizes the area with outside atmosphere circulation, in this way,
The pressure change that sealing element loosens after failure is larger, is conducive to packing pressure detection.
Above-mentioned fingerprint mould group in one of the embodiments, further includes:
Sealing filler, be set to interval region between the welding unit, the first through hole, the second through-hole and
In the connected region that third through-hole is formed.In this way, outside atmosphere can be prevented when without detecting to fingerprint being sealed property of mould group
Its each layer is had an impact into fingerprint mould group.
The sealing filler is sealed colloid in one of the embodiments,.It good airproof performance and is beneficial for disassembly and assembly.
The sealing element is sealed colloid in one of the embodiments,.It good airproof performance and is beneficial for disassembly and assembly
The present invention also provides a kind of pressure-detecting devices such as above-mentioned fingerprint mould group, comprising:
Pressure detecting shell, the welding layer, the electronic device layer and the sealing element of the fingerprint mould group are set
In intracorporal first cavity of the pressure detecting shell, pressure test instrument, the pressure are provided on the pressure detecting shell
Tension gauge device is at least partially disposed in intracorporal second cavity of the pressure detecting shell, first cavity and second cavity
Connection, the pressure detecting shell, the elastic layer, the electronic device layer and the sealing element form confined space.
The pressure-detecting device of above-mentioned fingerprint mould group, including pressure detecting shell, welding layer, electronic device layer and sealing
Part is placed in intracorporal first cavity of pressure detecting shell, and pressure test instrument, pressure detecting instrument are provided on pressure detecting shell
Device is at least partially disposed in intracorporal second cavity of pressure detecting shell, and the first cavity is connected to the second cavity, pressure detecting shell, bullet
Property layer, electronic device layer and sealing element form confined space, by pressure detecting shell, elastic layer, electronic device layer and
The connected space of sealing element formation confined space, the second cavity and the first cavity also seals, and can be examined by pressure test instrument
The pressure in the second cavity is surveyed, after sealing element loosens failure, the seal failure between electronic device layer and elastic layer is ventable,
The path being connected to outside atmosphere, pressure detecting shell, electronic device layer, sealing element and elastic layer can be formed in fingerprint mould group
Between confined space failure, the first cavity and the second cavity can by the sealing element of loosening and electronic device layer or with elastic layer it
Between gap, welding layer and elastic layer first through hole form flow of ambient air path, the pressure of pressure detecting shell internal cavity
It changes greatly, pressure test instrument can effectively and accurately detect pressure change, so as to effectively and accurately detect sealing element
Leakproofness.
The pressure detecting shell is set to described the first of the elastic layer of the fingerprint mould group in one of the embodiments,
Surface.In this way, the first surface by elastic layer supports pressure detecting shell, without external force, pressure detecting shell is realized
Setting, convenient for detection.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of the fingerprint mould group of embodiment；
Fig. 2 is the structural schematic diagram of the fingerprint mould group of another embodiment；
Fig. 3 is a kind of structural schematic diagram of the pressure-detecting device of the fingerprint mould group of embodiment.
Specific embodiment
Referring to Fig. 1, the present invention provides a kind of fingerprint mould group of embodiment, comprising: electronic device layer 110, welding layer
120, elastic layer 130 and sealing element 200.
Welding layer 120 is set to the side of electronic device layer 110, including several spaced welding units 121.
The elastic layer 130 for offering first through hole 131 is set to the one of the separate electronic device layer 110 of welding layer 120
Side, the interval region 122 between the welding unit 121 opposite with 131 position of first through hole are connected to first through hole 131.
Sealing element 200 is contacted with the side wall of electronic device layer 110 and elastic layer 130, connection of electronic devices layer 110
Side wall and elastic layer 130, and sealed between electronic device layer 110 and elastic layer 130 by sealing element 200.
Above-mentioned fingerprint mould group, welding layer 120 are set to the side of electronic device layer 110, and elastic layer 130 is set to welding layer
120 sides far from electronic device layer 110, i.e. welding layer 120 be between electronic device layer 110 and elastic layer 130, if
The sealing element 200 set is contacted with the side wall of electronic device layer 110 and elastic layer 130, the side wall of connection of electronic devices layer 110 with
Elastic layer 130, and sealed between electronic device layer 110 and elastic layer 130 by sealing element 200, it is logical with first in welding layer 120
Interval region 122 between the opposite welding unit 121 in 131 position of hole is connected to the first through hole 131 of elastic layer 130, close
After sealing 200 loosens failure, the seal failure between electronic device layer 110 and elastic layer 130 is ventable, in this way, passing through weldering again
Connecing layer 120 and first through hole 131 can ventilate with outside atmosphere, i.e., can form the road being connected to outside atmosphere in fingerprint mould group
Diameter can carry out the circulation of atmosphere in fingerprint mould group, thus, before loosening relative to sealing element 200, space is pressed in fingerprint mould group
Power changes greatly, and the leakproofness for being conducive to the subsequent sealing element 200 to fingerprint mould group detects, and improves detection accuracy.
Specifically, in the present embodiment, sealing element 200 is wound around the side wall of electronic device layer 110.Due to sealing element 200
To be contacted with the side wall of electronic device layer 110, be with elastic layer 130 contact, and by 200 electronic device layer 110 of sealing element with
It is sealing between elastic layer 130, it is ensured that the leakproofness between electronic device layer 110 and elastic layer 130 divides sealing element 200
Be not wound around electronic device layer 110 side wall further ensure that between the side wall of electronic device layer 110 and elastic layer 130 it is completely close
Envelope, further prevents outside atmosphere to enter between electronic device layer 110 and elastic layer 130.
In the present embodiment, sealing element 200 is sealed colloid.Colloid has elasticity, and sealing element 200 uses sealed colloid,
One side good airproof performance, is on the other hand beneficial for disassembly and assembly.
Elastic layer 130 includes the first surface 132 adjacent with welding layer 120, sealing element in one of the embodiments,
200 are located at the side wall of the side wall of electronic device layer 110 and welding layer 120, the area with the formation of first surface 132 of elastic layer 130
In domain, sealing element 200 is also contacted with the first surface 132 of elastic layer 130, and the side wall of connection of electronic devices layer 110 and elasticity
The first surface 132 of layer 130.
In this way, can not only realize the sealing between electronic device layer 110 and elastic layer 130, and welding layer 120 is placed in electricity
Between sub- device layer 110 and elastic layer 130, welding layer 120 and extraneous contact, and setting convenient for sealing element 200 are reduced
It sets.Specifically, the side wall of the welding layer 120 in the present embodiment is the side wall that outermost layer welds source 121 in welding layer 120.
Specifically, in the present embodiment, the first surface 132 of the side wall with elastic layer 130 of electronic device layer 110 passes through close
Sealing 200 seals.132 supporting sealing member 200 of first surface, in addition, sealing element 200 can be wound around the side of electronic device layer 110
Wall, since it is contacted with the first surface 132 of elastic layer 130, welding layer 120 is placed in electronic device layer 110 and elastic layer 130
Between, sealing element 200 is winding welding layer 120.Since sealing element 200 is contacted with the side wall of electronic device layer 110, with bullet
Property layer 130 first surface 132 be contact, and be wound around around welding layer 120, so that it is guaranteed that electronic device layer 110, welding
Leakproofness between layer 120 and elastic layer 130, prevents outside atmosphere from entering the electronic device layer 110 of fingerprint mould group, welding layer
120 and elastic layer 130 between each layer.
The interval region 122 between welding unit 121 is located at electronic device layer 110 and is welding in one of the embodiments,
In the view field for connecing layer 120, first through hole 131 is located at electronic device layer 110 in the view field of elastic layer 130.
I.e. first through hole 131 is located at electronic device layer 110 in the view field of elastic layer 130, between welding unit 121
Interval region 122 be located at electronic device layer 110 in the view field of welding layer 120, in this way, electronic device layer 110 cover
Electronics device can be improved after sealing by sealing element 200 in interval region 122 between first through hole 131 and welding unit 121
Leakproofness between part layer 110 and elastic layer 130, and after sealing element 200 loosens failure, pass through first through hole 131 and spacer region
Domain can form the access of external atmosphere in fingerprint mould group, be conducive to the detection of the subsequent sealing effect to sealing element 200.
Referring to Fig. 2, above-mentioned fingerprint mould group in one of the embodiments, further includes:
The adhesive tape layer 140 for offering the second through-hole 141, is set to side of the elastic layer 130 far from welding layer 120, and second
Through-hole 141 is connected to first through hole 131；
The reinforcing layer 150 for offering third through-hole 151 is set to side of the adhesive tape layer 140 far from elastic layer 130, third
Through-hole 151 is connected to the second through-hole 141.
On the basis of welding layer 120 and elastic layer 130 are set, adhesive tape layer 140 and reinforcing layer 150 are also set up, can be improved
The intensity of fingerprint mould group is also convenient for the detection of the subsequent sealing effect to fingerprint mould group.In addition, opening up second in adhesive tape layer 140
Through-hole 141, the second through-hole 141 are connected to first through hole 131, open up third through-hole 151 in reinforcing layer 150, third through-hole 151 with
The connection of second through-hole 141 is connection between first through hole 131, the second through-hole 141 and third through-hole 151, due to the
Interval region 122 between the opposite welding unit 121 in one through-hole, 131 position is connected to first through hole 131, interval region 122,
It is connection between first through hole 131, the second through-hole 141 and third through-hole 151, when sealing element 200 is loosened and failed, can leads to
Cross the company between the interval region 122 between welding unit 121, first through hole 131, the second through-hole 141 and third through-hole 151
It is logical, it is connected to outside atmosphere, that is, forms the access to outside atmosphere, the circulation of atmosphere can be carried out, in order to fingerprint mould group
The sealing effect of sealing element 200 is detected, and detection accuracy is improved.
Specifically, in the present embodiment, elastic layer 130 further includes the second surface 133 opposite with first surface 132, glue
Belt 140 is adjacent with second surface 133, i.e., adhesive tape layer 140 is set to second table of the elastic layer 130 far from 120 side of welding layer
Face 133, in this way, making to be arranged between elastic layer 130 and adhesive tape layer 140 even closer, between raising level compactness.
The radius of first through hole 131, the second through-hole 141 and third through-hole 151 is identical in one of the embodiments,
And the central axes of first through hole 131, the second through-hole 141 and third through-hole 151 are conllinear.
The conllinear setting in the central axes of first through hole 131, the second through-hole 141 and third through-hole 151, can make first through hole
131, the area for the connected region that the second through-hole 141 and third through-hole 151 are formed maximizes, that is, maximizes and outside atmosphere stream
Logical area is conducive to packing pressure detection in this way, the pressure change that sealing element 200 loosens after failure is larger.
Above-mentioned fingerprint mould group in one of the embodiments, further includes:
Sealing filler, interval region 122, first through hole 131, the second through-hole 141 being set between welding unit 121
And in the connected region of the formation of third through-hole 151.
When not detected to fingerprint being sealed property of mould group, i.e., without being detected to fingerprint being sealed property of mould group when, can be
The connection that interval region 122, first through hole 131, the second through-hole 141 and third through-hole 151 between welding unit 121 are formed
Sealing filler is set in region, prevents outside atmosphere from entering fingerprint mould group and its each layer is had an impact.
In the present embodiment, sealing filler is sealed colloid.Colloid has elasticity, and sealing filler uses sealant
Body, one side good airproof performance, is on the other hand beneficial for disassembly and assembly.
Electronic device layer 110 is overlapped in the projection of elastic layer 130 respectively with welding layer 120 in one of the embodiments,.
In this way, the area of electronic device layer 110 and welding layer 120 is identical, and alignment setting is laminated, make electronic device layer 110 with
Welding layer 120 is overlapped in the projection of elastic layer 130 respectively, is conducive to the compact for making fingerprint mould group, sealing propertytest side
Just.
Referring to Fig. 3, the present invention also provides a kind of pressure-detecting devices of embodiment such as above-mentioned fingerprint mould group, comprising:
Pressure detecting shell 300, welding layer 120, electronic device layer 110 and the sealing element 200 of above-mentioned fingerprint mould group are set
In the first cavity 331 in pressure detecting shell 300, it is provided with pressure test instrument 400 on pressure detecting shell 300, presses
Tension gauge device is at least partially disposed in the second cavity 332 in pressure detecting shell 300, the first cavity 331 and the second cavity 332
Connection, pressure detecting shell 300, elastic layer 130, electronic device layer 110 and sealing element 200 form confined space.
The pressure-detecting device of above-mentioned fingerprint film group can detect the first cavity 331 and second by pressure test instrument 400
The pressure in connected region that cavity 332 is formed, it is electronic device layer 110, welding layer 120, close after sealing element 200 loosens failure
The space pressure that sealing 200 and elastic layer 130 are formed changes greatly, in the connected region of the first cavity 331 and the second cavity 332
Pressure change is larger, and pressure test instrument 400 can effectively and accurately detect pressure change, close so as to effectively and accurately detect
The leakproofness of sealing 200.
Pressure detecting shell 300 is set to the first surface of the elastic layer 130 of fingerprint mould group in one of the embodiments,
132.It is appreciated that pressure detecting shell 300 is set to elastic layer 130, pressure detecting shell 300 is supported by elastic layer 130,
Pressure detecting shell 300 is supported especially by the first surface 132 of elastic layer 130, without external force, realizes pressure detecting shell
The setting of body 300, convenient for detecting, and the first surface 132 of pressure detecting shell 300, elastic layer 130, sealing element 200 and electricity
Sub- device layer 110 forms confined space.
Pressure detecting shell 300 includes support section 310 interconnected and coupling part in one of the embodiments,
320, coupling part 320 is provided with protrusion part 330, pressure test instrument 400 is set to protrusion part 330, protrudes part
The second cavity 332 is formed in 330, pressure detecting shell 300 is set to elastic layer 130, coupling part by support section 310
320 connect the first cavity 331 of formation with support section 310.Pass through the second of the protrusion part 330 of pressure detecting shell 300
Cavity 332 and coupling part 320 connect the first cavity 331 formed with support section 310 and form the inspection of pressure sensing instruments pressure
The space of survey.In the present embodiment, protrusion part 330 is vertical with coupling part 320, convenient for being placed in elastic layer 130.
Each technical characteristic of above embodiments can be combined arbitrarily, for simplicity of description, not to above-described embodiment
In each technical characteristic it is all possible combination be all described, as long as however, the combination of these technical characteristics be not present lance
Shield all should be considered as described in this specification.
Only several embodiments of the present invention are expressed for above embodiments, and the description thereof is more specific and detailed, but can not
Therefore limitations on the scope of the patent of the present invention are interpreted as.It should be pointed out that for those of ordinary skill in the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection model of the invention
It encloses.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of fingerprint mould group characterized by comprising
Electronic device layer；
Welding layer is set to the side of the electronic device layer, including several spaced welding units；
The elastic layer for offering first through hole is set to the side far from the electronic device layer of the welding layer, and described
Interval region between the opposite welding unit in first through hole position is connected to the first through hole；
Sealing element is contacted with the side wall of the electronic device layer and the elastic layer, connects the side wall of the electronic device layer
With the elastic layer, and sealed between the electronic device layer and the elastic layer by the sealing element.
2. fingerprint mould group according to claim 1, which is characterized in that the elastic layer includes adjacent with the welding layer
First surface, the sealing element be located at the side wall of the electronic device layer and the side wall of the welding layer, with the elastic layer
In the region that the first surface is formed, the sealing element is also contacted with the first surface of the elastic layer, and connects institute
State the side wall of electronic device layer and the first surface of the elastic layer.
3. fingerprint mould group according to claim 1, which is characterized in that the interval region between the welding unit is located at institute
Electronic device layer is stated in the view field of the welding layer, the first through hole is located at the electronic device layer in the elasticity
In the view field of layer.
4. fingerprint mould group according to claim 1, which is characterized in that further include:
The adhesive tape layer for offering the second through-hole is set to side of the elastic layer far from the welding layer, second through-hole
It is connected to the first through hole；
The reinforcing layer for offering third through-hole is set to side of the adhesive tape layer far from the elastic layer, the third through-hole
It is connected to second through-hole.
5. fingerprint mould group according to claim 4, which is characterized in that the first through hole, second through-hole and institute
The radius for stating third through-hole is identical, and the central axes of the first through hole, second through-hole and the third through-hole are conllinear.
6. fingerprint mould group according to claim 5, which is characterized in that further include:
Sealing filler, interval region, the first through hole, the second through-hole and the third being set between the welding unit
In the connected region that through-hole is formed.
7. fingerprint mould group according to claim 6, which is characterized in that the sealing filler is sealed colloid.
8. fingerprint mould group according to claim 1, which is characterized in that the sealing element is sealed colloid.
9. a kind of pressure-detecting device of the fingerprint mould group as described in any one of the claims 1-8, which is characterized in that packet
It includes:
Pressure detecting shell, the welding layer, the electronic device layer and the sealing element of the fingerprint mould group are placed in institute
Intracorporal first cavity of pressure detecting shell is stated, pressure test instrument, the pressure inspection are provided on the pressure detecting shell
It surveys instrument and is at least partially disposed in intracorporal second cavity of the pressure detecting shell, first cavity and second cavity connect
Logical, the pressure detecting shell, the elastic layer, the electronic device layer and the sealing element form confined space.
10. pressure-detecting device according to claim 9, which is characterized in that the pressure detecting shell is set to the finger
The first surface of the elastic layer of line mould group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710601378.0A CN109282950A (en) | 2017-07-21 | 2017-07-21 | The pressure-detecting device of fingerprint mould group and fingerprint mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710601378.0A CN109282950A (en) | 2017-07-21 | 2017-07-21 | The pressure-detecting device of fingerprint mould group and fingerprint mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109282950A true CN109282950A (en) | 2019-01-29 |
Family
ID=65184886
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710601378.0A Pending CN109282950A (en) | 2017-07-21 | 2017-07-21 | The pressure-detecting device of fingerprint mould group and fingerprint mould group |
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| CN104112880A (en) * | 2013-04-19 | 2014-10-22 | 索尼公司 | Inspection apparatus, inspection method, and battery-inspecting chamber |
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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 Nanchang Avenue, Nanchang high tech Zone, Nanchang, Jiangxi 1189 Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. |
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Application publication date: 20190129 |