CN108599713B - Multichannel power management module - Google Patents
Multichannel power management module Download PDFInfo
- Publication number
- CN108599713B CN108599713B CN201810545668.2A CN201810545668A CN108599713B CN 108599713 B CN108599713 B CN 108599713B CN 201810545668 A CN201810545668 A CN 201810545668A CN 108599713 B CN108599713 B CN 108599713B
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- Prior art keywords
- diode chip
- low
- field electrode
- electrode frame
- low pressure
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- 244000144985 peep Species 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000013068 control sample Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
- H02S40/345—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes with cooling means associated with the electrical connection means, e.g. cooling means associated with or applied to the junction box
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Photovoltaic Devices (AREA)
Abstract
The invention discloses a kind of multichannel power management module, including at least two low-field electrode frames, low pressure diode chip is provided between adjacent low-field electrode frame；The top of the low-field electrode frame offers convergent belt fairlead, and the weld part of normal current input terminal is equipped with positioned at the lower part of the low-field electrode frame in left side, the weld part of normal current output end is equipped with positioned at the low-field electrode frame on right side；Further include two high-field electrode frames, is provided with high-voltage diode chip between two high-field electrode frames；It is equipped with the weld part of component by-pass current input terminal positioned at the high-field electrode frame in left side, the weld part of sampled signal output end is equipped with positioned at the high-field electrode frame on right side；It further include a coordination electrode frame, which is equipped with the weld part of output end after a control.Multichannel power management module creepage distance of the invention lengthens, and also has the function of component bypass output, has the characteristics that be less prone to cause thermal damage, further ensured usability, heat sinking function is good.
Description
Technical field
The present invention relates to technical field of photovoltaic modules, more particularly to a kind of multichannel power management module.
Background technique
Solar energy is a kind of renewable resource, and photovoltaic module is widely used in solar power generation, and photovoltaic junction box is used
In the interconnection for realizing photovoltaic module and external power supply component, the electric power of photovoltaic module is output to outside.Inside photovoltaic module
When battery crack occurs or is blocked by shadow generation hot spot effect, the Schottky diode of photovoltaic component terminal box assembling is served as
The bypass protector of photovoltaic module, to ensure that the normal operation of photovoltaic module.
Photovoltaic power source management module is an important component in photovoltaic terminal box, can be used for various assemblies simultaneously
Photovoltaic panel terminal box in, to protect energy caused by illumination component may be shielded when there is hot spot effect
Battery component is consumed.In general, the diode chip for backlight unit in the photovoltaic component terminal box by riveting or crimping or welding or passes through
Auxiliary element is plugged on electric conductor, and passes heat dissipation by the pin of diode.In this way, the PN of the diode chip for backlight unit ties production
Raw heat is difficult to dissipate, and causes diode chip for backlight unit temperature rise higher, is easily damaged, and diode chip for backlight unit damages in existing technology
After bad, protective bypass effect be cannot work normally.
Summary of the invention
In view of the deficienciess of the prior art, the object of the invention is that providing a kind of multichannel power management mould
Block, creepage distance lengthen, and have component bypass output, have the characteristics that be less prone to cause thermal damage.
To achieve the goals above, the technical solution adopted by the present invention is that it is such: a kind of multichannel power management module,
Including at least two low-field electrode frames, low pressure diode chip is provided between adjacent low-field electrode frame；The low pressure
The top of electrode framework offers convergent belt fairlead, and the lower part positioned at the low-field electrode frame in left side is inputted equipped with normal current
The weld part at end is equipped with the weld part of normal current output end positioned at the low-field electrode frame on right side；It further include two high-voltage electricity
Pole frame is provided with high-voltage diode chip between two high-field electrode frames；The high-voltage diode chip and two pole of low pressure
Tube chip is total to cathode connection, and the weld part of component by-pass current input terminal is equipped with positioned at the high-field electrode frame in left side, is located at the right side
The high-field electrode frame of side is equipped with the weld part of sampled signal output end.
It as a preferred embodiment, further include a coordination electrode frame, which exports after being equipped with a control
The weld part at end, after the control output end by single-pole double-throw switch (SPDT) respectively with normal current input terminal, component by-pass current
Input terminal connection.
As a preferred embodiment, the welding of the weld part of the component by-pass current input terminal and normal current input terminal
Portion is connected directly.
As a preferred embodiment, the low-field electrode frame has 4, respectively the first low-field electrode frame, second low
Electrode framework, third low-field electrode frame and the 4th low-field electrode frame are pressed, in the first low-field electrode frame, second low
It is provided with the first low pressure diode chip between pressure electrode framework, in the second low-field electrode frame, third low-field electrode frame
It is provided with the second low pressure diode chip between frame, is set between the third low-field electrode frame and the 4th low-field electrode frame
It is equipped with third low pressure diode chip；The first low pressure diode chip, the second low pressure diode chip, two pole of third low pressure
Tube chip is connected in series, wherein the input terminal of the first low pressure diode chip is connected to the welding of normal current input terminal
The output end in portion, third low pressure diode chip is connected to the weld part of normal current output end.
As a preferred embodiment, the lower part of the first low-field electrode frame is the weld part of normal current input terminal.
As a preferred embodiment, the lower part of the 4th low-field electrode frame is the weld part of normal current output terminal,
The lower part for being wherein located at the weld part and the 4th low-field electrode frame of the sampled signal output end of the high-field electrode frame on right side is
The weld part of normal current output end is same weld part.
As a preferred embodiment, there are three the high-voltage diode chips, respectively the first high-voltage diode chip,
Two high-voltage diode chips, third high-voltage diode chip, the first high-voltage diode chip are parallel to first after series connection
Low pressure diode chip, the second low pressure diode chip, on third low pressure diode chip；The second high-voltage diode chip
On the first low pressure diode chip, the second low pressure diode chip after being parallel to series connection, the third high-voltage diode chip
On the second low pressure diode chip, third low pressure diode chip after being parallel to series connection.
As a preferred embodiment, further include a heat sink electrodes frame, be set to the weld part of normal current input terminal with
Between the weld part of component by-pass current input terminal.
As a preferred embodiment, there is the low pressure diode chip P knot to tie with N, and the N of the low pressure diode chip
This is located on the low-field electrode frame on right side for knot electrical connection, while the P knot of the low pressure diode chip is electrically connected to by wire jumper
On the low-field electrode frame in left side.
As a preferred embodiment, there is the high-voltage diode chip P knot to tie with N, and the N of the high-voltage diode chip
This is located on the high-field electrode frame on right side for knot electrical connection, while the P knot of the high-voltage diode chip is electrically connected to by wire jumper
On the high-field electrode frame in left side.
Compared with prior art, beneficial effects of the present invention: multichannel power management module creepage distance of the invention adds
It is long, also have the function of component bypass output, has the characteristics that be less prone to cause thermal damage, further ensured usability, radiate
Better function.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of multichannel power management module in embodiment 1-1 in the present invention；
Fig. 2 is the schematic internal view of multichannel power management module in embodiment 1-1 in the present invention；
Fig. 3 is the schematic diagram of multichannel power management module in embodiment 1-1 in the present invention；
Fig. 4 is the structural schematic diagram of multichannel power management module in embodiment 1-2 in the present invention；
Fig. 5 is the schematic internal view of multichannel power management module in embodiment 1-2 in the present invention；
Fig. 6 is the schematic diagram of multichannel power management module in embodiment 1-2 in the present invention；
Fig. 7 is the structural schematic diagram of multichannel power management module in embodiment 1-3 in the present invention；
Fig. 8 is the schematic internal view of multichannel power management module in embodiment 1-3 in the present invention；
Fig. 9 is the schematic diagram of multichannel power management module in embodiment 1-3 in the present invention；
Figure 10 is the top view of intelligent wiring box in the present invention；
Figure 11 is the bottom view of intelligent wiring box in the present invention；
Figure 12 is the sectional view along A-A of Figure 11 in the present invention；
Figure 13 is the explosive view of the intelligent wiring box in the present invention with multichannel power management module.
Specific embodiment
The invention will be further described combined with specific embodiments below.Following embodiment is only used for clearly illustrating
Technical solution of the present invention, and not intended to limit the protection scope of the present invention.
Embodiment 1:
As shown in Fig. 1 ~ 3, a kind of multichannel power management module, including at least two low-field electrode frames 11, it is adjacent
Low pressure diode chip 12 is provided between low-field electrode frame 11；The top of the low-field electrode frame 11 offers convergent belt
Fairlead 13 is equipped with the weld part of normal current input terminal 14 positioned at the lower part of the low-field electrode frame 11 in left side, is located at right side
Low-field electrode frame 11 be equipped with normal current output end 15 weld part；It further include two high-field electrode frames 16, two height
High-voltage diode chip 17 is provided between pressure electrode framework 16；The high-voltage diode chip 17 and low pressure diode chip 12
Cathode connection altogether is equipped with the weld part of component by-pass current input terminal 18 positioned at the high-field electrode frame 16 in left side, is located at right side
High-field electrode frame 16 be equipped with sampled signal output end 15 weld part.
It further include a coordination electrode frame 19, the coordination electrode frame as shown in Fig. 1 ~ 3 as a kind of preferred embodiment 1-1
Frame 19 is equipped with the weld part of output end 110 after a control, and output end 110 is distinguished by single-pole double-throw switch (SPDT) 111 after the control
It is connect with normal current input terminal 14, component by-pass current input terminal 18.
Specifically, the low-field electrode frame 11 has 4, respectively the first low-field electrode frame 113, the second low-field electrode
Frame 114, third low-field electrode frame 115 and the 4th low-field electrode frame 116, the first low-field electrode frame 113,
The first low pressure diode chip 117 is provided between second low-field electrode frame 114, the second low-field electrode frame 114,
The second low pressure diode chip 118 is provided between third low-field electrode frame 115, in the third low-field electrode frame 115
Third low pressure diode chip 119 is provided between the 4th low-field electrode frame 116；The first low pressure diode chip
117, the second low pressure diode chip 118, third low pressure diode chip 119 are connected in series, wherein two pole of the first low pressure
The input terminal of tube chip 117 is connected to the weld part of normal current input terminal 14, the output end of third low pressure diode chip 119
It is connected to the weld part of normal current output end 15.
Specifically, the lower part of the first low-field electrode frame 113 is the weld part of normal current input terminal 14.
Specifically, the lower part of the 4th low-field electrode frame 116 is the weld part of normal current output terminal 15, wherein position
It is in the lower part of the weld part and the 4th low-field electrode frame 116 of the sampled signal output end 15 of the high-field electrode frame 16 on right side
The weld part of normal current output end 15 is same weld part, therefore normal current output end 15 and sampled signal output end here
15 are all made of reference numerals 15 in the example shown.
Specifically, further including a heat sink electrodes frame 112, it is set to by the weld part and component of normal current input terminal 14
It between the weld part of road current input terminal 18, can further increase heat radiation function, prevent from damaging.
More specifically, the weld part of each frame is a flat copper sheet, instead of original bulky riveting,
Consumptive material can be reduced.
Specifically, there is the low pressure diode chip 12 P knot to tie with N, and the N knot of the low pressure diode chip 12 is electrically connected
It connects this to be located on the low-field electrode frame 11 on right side, while the P knot of the low pressure diode chip 12 is electrically connected to by wire jumper 120
On the low-field electrode frame 11 in left side.
Specifically, there is the high-voltage diode chip 17 P knot to tie with N, and the N knot of the high-voltage diode chip 17 is electrically connected
It connects this to be located on the high-field electrode frame 16 on right side, while the P knot of the high-voltage diode chip 17 is electrically connected to by wire jumper 120
On the high-field electrode frame 16 in left side.
Using the diode chip for backlight unit connection type of this structure, the heat not only generated is smaller, and heat dissipation preferably, and is not easy to melt
There is the phenomenon that cause thermal damage；Wherein wire jumper 120 is made of metallic copper,.
Specifically, the outer enclosure of the low pressure diode chip 12, high-voltage diode chip 17, wire jumper 120 has epoxy
Resin layer 121, plastic packaging performance is good, long service life.
When it is implemented, in the present embodiment, be parallel on the first low pressure diode chip 117 first battery 122,
It is parallel with the second battery 123 on second low pressure diode chip 118, is parallel with third on third low pressure diode chip 119
Battery 124, when the first battery 122, the second battery 123, third battery 124 work normally, the first low pressure diode chip
117, the second low pressure diode chip 118, third low pressure diode chip 119 are not turned on, and output end 110 passes through list after control
Double-pole double throw switch 111 is connect with normal current input terminal 14, and high-voltage diode chip 17 is not turned on, and is connected to output end after control
Sample devices 125 between 110 and normal current output end 15 works normally；When the first battery 122 damage, the second battery 123,
When third battery 124 works normally, the conducting of the first low pressure diode chip 117, the second low pressure diode chip 118, third
Low pressure diode chip 119 is not turned on, and output end 110 passes through single-pole double-throw switch (SPDT) 111 and normal current input terminal after control
14 connections, high-voltage diode chip 17 are not turned on, and are connected to adopting between output end 110 and normal current output end 15 after control
Sample equipment 125 works normally；When the first battery 122, the second battery 123 damage, when third battery 124 works normally, first is low
Diode chip for backlight unit 117, the conducting of the second low pressure diode chip 118 are pressed, third low pressure diode chip 119 is not turned on, after control
Output end 110 is connect by single-pole double-throw switch (SPDT) 111 with normal current input terminal 14, and high-voltage diode chip 17 is not turned on, even
The sample devices 125 after control between output end 110 and normal current output end 15 is connected to work normally；When the first battery 122,
When second battery 123, third battery 124 damage, the first low pressure diode chip 117, the second low pressure diode chip 118,
Third low pressure diode chip 119 is both turned on, and output end 110 passes through single-pole double-throw switch (SPDT) 111 and component bypass input after control
18 connection of end, high-voltage diode chip 17 are connected, and are connected to adopting between output end 110 and sampled signal output end 15 after control
Sample equipment 125 works normally.The present invention is provided with the function of component bypass output, has further ensured usability.
As a kind of preferred embodiment 1-2, as shown in Fig. 4 ~ 6, the difference with embodiment 1-1 is: the component bypass
The weld part of current input terminal 18 and the weld part of normal current input terminal 14 are connected directly.The present embodiment is embodiment 1-1's
On the basis of structure it is simple, reduce cost, long service life.
When it is implemented, when the first battery 122, the second battery 123, third battery 124 work normally, the first low pressure
Diode chip for backlight unit 117, the second low pressure diode chip 118, third low pressure diode chip 119 are not turned on, high-voltage diode
Chip 17 is not turned on；When the first battery 122 damages, when the second battery 123, third battery 124 work normally, the first low pressure two
Pole pipe chip 117 is connected, and the second low pressure diode chip 118, third low pressure diode chip 119 are not turned on, two pole of high pressure
Tube chip 17 is not turned on；When the first battery 122, the second battery 123 damage, when third battery 124 works normally, the first low pressure two
Pole pipe chip 117, the conducting of the second low pressure diode chip 118, third low pressure diode chip 119 are not turned on, high-voltage diode
Chip 17 is not turned on；When the first battery 122, the second battery 123, third battery 124 damage, high-voltage diode chip 17 is led
It is logical, further first low pressure diode chip 117, the second low pressure diode chip 118, third low pressure diode chip 119
It is not turned on.
As a kind of preferred embodiment 1-3, as shown in Fig. 7 ~ 9, the difference with embodiment 1-2 is: two pole of high pressure
There are three tube chips 17, respectively the first high-voltage diode chip 171, the second high-voltage diode chip 172, two pole of third high pressure
Tube chip 173, the first low pressure diode chip 117, second that the first high-voltage diode chip 173 is parallel to after series connection are low
On pressure diode chip for backlight unit 118, third low pressure diode chip 119；After the second high-voltage diode chip 171 is parallel to series connection
The first low pressure diode chip 117, on the second low pressure diode chip 118, the third high-voltage diode chip 172 is in parallel
On the second low pressure diode chip 118, third low pressure diode chip 119 after series connection.The present embodiment is embodiment 1-2's
On the basis of temperature rise effect it is more preferable.
When it is implemented, when the first battery 122, the second battery 123, third battery 124 work normally, the first low pressure
Diode chip for backlight unit 117, the second low pressure diode chip 118, third low pressure diode chip 119 are not turned on, the first high pressure two
Pole pipe chip 171 is not turned on, the second high-voltage diode chip 172 is not turned on, third high-voltage diode chip 173 is not turned on；When
The damage of first battery 122, when the second battery 123, third battery 124 work normally, the first low pressure diode chip 117 is led
Logical, the second low pressure diode chip 118, third low pressure diode chip 119 are not turned on, the first high-voltage diode chip 171
It is not turned on, the second high-voltage diode chip 172 is not turned on, third high-voltage diode chip 173 is not turned on；When the first battery 122,
The damage of second battery 123, when third battery 124 works normally, the conducting of the first high-voltage diode chip 171, two pole of the second high pressure
Tube chip 172 is not turned on, the advanced tube chip 173 of third high pressure is not turned on, and further first low pressure diode chip 117 is not led
Lead to, the second low pressure diode chip 118 is not turned on, third low pressure diode chip 119 is not turned on；When the first battery 122, second
When battery 123, third battery 124 damage, the first high-voltage diode chip 171, the second high-voltage diode chip 172 are not led
Logical, third high-voltage diode chip 173 is connected, further first low pressure diode chip 117, the second low pressure diode chip
118, third low pressure diode chip 119 is not turned on；When the first battery 122 normal work, the second battery 123, third battery
124 damage when, the first high-voltage diode chip 171 is not turned on, the second high-voltage diode chip 172 conducting, third high pressure two
Pole pipe chip 173 is not turned on, and further first low pressure diode chip 117, the second low pressure diode chip 118, third are low
Pressure diode chip for backlight unit 119 is not turned on.
Embodiment 2:
As shown in Figure 10 ~ 13, a kind of intelligent wiring box, including box cover 21, box body 22, cassette bottom 23, the cassette bottom 23 are arranged
In box body 22 bottom and form an encapsulating chamber with box body 22, the box cover 21 is set to the top of box body 22；The cassette bottom 23
Middle part be provided with only glue portion 24, and cassette bottom 23 is separated into top and lower part；The top of the cassette bottom 23 is provided with boss-shaped
Convergent belt guiding port 25, offer multiple grooves 26 on the convergent belt guiding port 25；The lower part of the cassette bottom 23 is provided with filling
Glue mouth 27, positioned at the middle position of bottom end.
Specifically, the two sides at the middle part of the cassette bottom 23 offer encapsulating peep hole 28, it is convenient to be observed in encapsulating.
Specifically, the on both sides of the middle of the box body 22 is provided with cable fastening receiving portion 29, which fastens receiving portion 29
It is corresponding with encapsulating peep hole 28, cable 4 is set in intelligent wiring box by briquetting 3 in cable fastening receiving portion 29,
The inner end of the cable 4 is connected to multichannel power management module 1, outer end extends in the outside of the intelligent wiring box.
Specifically, the only glue portion 24 is a raised line wave-shaped, positioned at the top position of encapsulating peep hole 28, right
When intelligent wiring box first time encapsulating, prevent glue by the top of intelligent wiring box.
Specifically, the top of the cassette bottom 23 is provided with the first fastener 210, for being clamped multichannel power management module 1.
Specifically, the lower part of the cassette bottom 23 is provided with the second fastener 211, for being clamped pcb board 2.
The intelligent wiring box integral sealing of the present embodiment, small in size, encapsulating is more easily by light between different terminal boxes
Hint cable 4 is easy to connect.
Embodiment 3:
As shown in Fig. 1 ~ 13, a kind of intelligent wiring box with multichannel power management module,
Including wiring box body, multichannel power management module 1, pcb board 2, the multichannel power management module 1 with
Pcb board 2 is set in wiring box body；The two sides of the wiring box body are respectively arranged with cable 4 by briquetting 3, the cable 4
Inner end be connected on multichannel power management module 1, outer end extends outwardly in terminal box body exterior；
The multichannel power management module 1 includes at least two low-field electrode frames 11, adjacent low-field electrode frame
Low pressure diode chip 12 is provided between 11；The top of the low-field electrode frame 11 offers convergent belt fairlead 13, position
It is equipped with the weld part of normal current input terminal 14 in the lower part of the low-field electrode frame 11 in left side, the low-field electrode frame positioned at right side
Frame 11 is equipped with the weld part of normal current output end 15；The multichannel power management module 1 further includes two high-field electrode frames
Frame 16 is provided with high-voltage diode chip 17 between two high-field electrode frames 16；The high-voltage diode chip 17 and low pressure
Diode chip for backlight unit 12 is total to cathode connection, and the welding of component by-pass current input terminal 18 is equipped with positioned at the high-field electrode frame 16 in left side
Portion is equipped with the weld part of sampled signal output end 15 positioned at the high-field electrode frame 16 on right side；The multichannel power management mould
Block 1 further includes a coordination electrode frame 19, which is equipped with the weld part of output end 110 after a control, described
After control output end 110 by single-pole double-throw switch (SPDT) 111 respectively with normal current input terminal 14, component by-pass current input terminal 18
Connection；
The wiring box body includes box cover 21, box body 22, cassette bottom 23, and the cassette bottom 23 is set to the bottom of box body 22 simultaneously
An encapsulating chamber is formed with box body 22, the box cover 21 is set to the top of box body 22；The middle part of the cassette bottom 23 is provided with only glue
Portion 24, and cassette bottom 23 is separated into the top for accommodating multichannel power management module 1 and the lower part for accommodating pcb board 2；The cassette bottom
23 top is provided with the convergent belt guiding port 25 with the matched boss-shaped of convergent belt fairlead 13, on the convergent belt guiding port 25
Offer multiple grooves 26；The lower part of the cassette bottom 23 is provided with encapsulating mouth 27, positioned at the middle position of bottom end.
In the present embodiment, it using the multichannel power management module 1 in embodiment 1, is connect using the intelligence in embodiment 2
Wire box is the wiring box body of the present embodiment, when it is implemented, in the present embodiment, by the multichannel power supply pipe in embodiment 1
Reason module 1 is connected in the top of cassette bottom 23 by the first fastener 210, and pcb board 2 is connected in cassette bottom 23 by the second fastener 211
Top, then box body 22 connect with cassette bottom 23 and by 27 first time of encapsulating mouth encapsulating, stopping glue portion 24 prevents glue logical
It crosses to the top of intelligent wiring box, the encapsulating peep hole 28 is used to observe state when encapsulating, when solar energy convergent belt is from remittance
Stream band guiding port 25 introduces, and is connected to low-field electrode frame from the extraction of the convergent belt fairlead 13 of multichannel power management module 1
With regard to carrying out second of encapsulating on frame 11, the top of cassette bottom 23 is provided with the convergent belt guiding port 25 of boss-shaped, and the convergent belt
Offering multiple grooves 26 on guiding port 25, encapsulating is easier pass-out, after encapsulating, in 22 upper cover upper box cover 21 of box body, into
The whole sealing of row.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, several improvement and deformations can also be made, these improvement and deformations
Also it should be regarded as protection scope of the present invention.
Claims (7)
1. a kind of multichannel power management module, it is characterised in that: including at least two low-field electrode frames, adjacent low tension
Low pressure diode chip is provided between the frame of pole；The top of the low-field electrode frame offers convergent belt fairlead, is located at
The lower part of the low-field electrode frame in left side is equipped with the weld part of normal current input terminal, and the low-field electrode frame positioned at right side is equipped with
The weld part of normal current output end；Further include two high-field electrode frames, is provided with high pressure between two high-field electrode frames
Diode chip for backlight unit；The high-voltage diode chip is total to cathode with low pressure diode chip and connect, the high-field electrode frame positioned at left side
It is provided with the weld part of component by-pass current input terminal, the weldering of sampled signal output end is equipped with positioned at the high-field electrode frame on right side
Socket part；
The low-field electrode frame has 4, respectively the first low-field electrode frame, the second low-field electrode frame, third low tension
Pole frame and the 4th low-field electrode frame are provided between the first low-field electrode frame, the second low-field electrode frame
First low pressure diode chip is provided with the second low pressure between the second low-field electrode frame, third low-field electrode frame
Diode chip for backlight unit is provided with third low pressure diode core between the third low-field electrode frame and the 4th low-field electrode frame
Piece；The first low pressure diode chip, the second low pressure diode chip, the connection of third low pressure diode chip-in series, wherein
The input terminal of the first low pressure diode chip is connected to the weld part of normal current input terminal, third low pressure diode chip
Output end be connected to the weld part of normal current output end；
The lower part of the first low-field electrode frame is the weld part of normal current input terminal；
There are three the high-voltage diode chips, respectively the first high-voltage diode chip, the second high-voltage diode chip, third
High-voltage diode chip, the first high-voltage diode chip are parallel to the first low pressure diode chip after series connection, second low
On pressure diode chip for backlight unit, third low pressure diode chip；The second high-voltage diode chip is parallel to first low after series connection
Press diode chip for backlight unit, on the second low pressure diode chip, the third high-voltage diode chip is parallel to after series connection second low
On pressure diode chip for backlight unit, third low pressure diode chip.
2. a kind of multichannel power management module according to claim 1, it is characterised in that: further include a coordination electrode frame
Frame, the coordination electrode frame are equipped with the weld part of output end after a control, and output end passes through single-pole double-throw switch (SPDT) after the control
It is connect respectively with normal current input terminal, component by-pass current input terminal.
3. a kind of multichannel power management module according to claim 1, it is characterised in that: the component by-pass current is defeated
The weld part for entering the weld part and normal current input terminal at end is connected directly.
4. a kind of multichannel power management module according to claim 1, it is characterised in that: the 4th low-field electrode frame
The lower part of frame is the weld part of normal current output terminal, wherein be located at the sampled signal output end of the high-field electrode frame on right side
The lower part of weld part and the 4th low-field electrode frame is that the weld part of normal current output terminal is same weld part.
5. a kind of multichannel power management module according to claim 1, it is characterised in that: further include a heat sink electrodes frame
Frame is set between the weld part of normal current input terminal and the weld part of component by-pass current input terminal.
6. a kind of multichannel power management module according to claim 1, it is characterised in that: the low pressure diode chip
It is tied with P knot with N, and the N knot of the low pressure diode chip is electrically connected this and is located on the low-field electrode frame on right side, while this is low
The P knot of pressure diode chip for backlight unit is electrically connected on the low-field electrode frame in left side by wire jumper.
7. a kind of multichannel power management module according to claim 6, it is characterised in that: the high-voltage diode chip
It is tied with P knot with N, and the N knot of the high-voltage diode chip is electrically connected this and is located on the high-field electrode frame on right side, while the height
The P knot of pressure diode chip for backlight unit is electrically connected on the high-field electrode frame in left side by wire jumper.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810545668.2A CN108599713B (en) | 2018-05-31 | 2018-05-31 | Multichannel power management module |
| PCT/CN2018/094170 WO2019227568A1 (en) | 2018-05-31 | 2018-07-03 | Multi-channel power supply management module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810545668.2A CN108599713B (en) | 2018-05-31 | 2018-05-31 | Multichannel power management module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108599713A CN108599713A (en) | 2018-09-28 |
| CN108599713B true CN108599713B (en) | 2019-06-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810545668.2A Active CN108599713B (en) | 2018-05-31 | 2018-05-31 | Multichannel power management module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108599713B (en) |
| WO (1) | WO2019227568A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103208916A (en) * | 2012-01-11 | 2013-07-17 | 太阳能安吉科技有限公司 | Photovoltaic Module |
| CN104052391A (en) * | 2013-03-15 | 2014-09-17 | 索兰托半导体公司 | Photovoltaic Bypass And Output Switching |
| CN204794891U (en) * | 2015-07-30 | 2015-11-18 | 苏州同泰新能源科技有限公司 | Photovoltaic terminal box with integrated module of bypass |
| WO2018054835A1 (en) * | 2016-09-23 | 2018-03-29 | Sma Solar Technology Ag | Solar module, phovoltaic system, and voltage limitation method |
| CN208337498U (en) * | 2018-05-31 | 2019-01-04 | 苏州同泰新能源科技有限公司 | Multichannel power management module |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106130469A (en) * | 2016-08-31 | 2016-11-16 | 济南晶恒电子有限责任公司 | Encapsulated member stagewise photovoltaic bypass diode (led) module |
| CN107425808A (en) * | 2017-06-07 | 2017-12-01 | 江苏通灵电器股份有限公司 | It is a kind of to rapidly switch off system applied to photovoltaic generation |
-
2018
- 2018-05-31 CN CN201810545668.2A patent/CN108599713B/en active Active
- 2018-07-03 WO PCT/CN2018/094170 patent/WO2019227568A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103208916A (en) * | 2012-01-11 | 2013-07-17 | 太阳能安吉科技有限公司 | Photovoltaic Module |
| CN104052391A (en) * | 2013-03-15 | 2014-09-17 | 索兰托半导体公司 | Photovoltaic Bypass And Output Switching |
| CN204794891U (en) * | 2015-07-30 | 2015-11-18 | 苏州同泰新能源科技有限公司 | Photovoltaic terminal box with integrated module of bypass |
| WO2018054835A1 (en) * | 2016-09-23 | 2018-03-29 | Sma Solar Technology Ag | Solar module, phovoltaic system, and voltage limitation method |
| CN208337498U (en) * | 2018-05-31 | 2019-01-04 | 苏州同泰新能源科技有限公司 | Multichannel power management module |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019227568A1 (en) | 2019-12-05 |
| CN108599713A (en) | 2018-09-28 |
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