CN108515694B - Flexible pressure sensor chip based on 3D printing technology and manufacturing method thereof - Google Patents
Flexible pressure sensor chip based on 3D printing technology and manufacturing method thereof Download PDFInfo
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- CN108515694B CN108515694B CN201810349909.6A CN201810349909A CN108515694B CN 108515694 B CN108515694 B CN 108515694B CN 201810349909 A CN201810349909 A CN 201810349909A CN 108515694 B CN108515694 B CN 108515694B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
- B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/379—Handling of additively manufactured objects, e.g. using robots
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Abstract
A chip of a flexible pressure sensor based on 3D printing technology and a manufacturing method thereof are disclosed, wherein the chip comprises a flexible upper polar plate, the flexible upper polar plate is contacted with a flexible lower polar plate which is uniformly distributed with a miniature pyramid array, flexible film electrodes are manufactured on the contact surfaces of the flexible upper polar plate and the flexible lower polar plate, and the flexible film electrodes on the flexible upper polar plate and the flexible lower polar plate are respectively connected with an external circuit through leads; the manufacturing method comprises the steps of 3D printing flexible upper and lower polar plates, and cleaning; then adopting conductive adhesive to closely adhere the conducting wire on the flexible upper and lower polar plates, and curing; then, carrying out oxygen plasma treatment on the flexible upper and lower electrode plates, soaking a layer of PEDOT (PSS) solution, and baking to finish the manufacture of the flexible film electrode; finally, the flexible upper polar plate and the flexible lower polar plate are stuck together by using a polyimide insulating tape, and a gap between the side surfaces of the flexible upper polar plate and the flexible lower polar plate is sealed; the invention has the advantages of low processing cost, short processing period, simple and convenient manufacture, diversified material selection, integrated structure and the like.
Description
Technical Field
The invention belongs to the technical field of additive manufacturing and sensors, and particularly relates to a flexible pressure sensor chip based on a 3D printing technology and a manufacturing method thereof.
Background
3D printing belongs to additive manufacturing technology, and is a technology for realizing the construction of a three-dimensional object by fusing liquid solidification or powder particles together layer by layer under the control of a computer. In recent years, the method is widely and commercially applied to the manufacture of parts in the fields of buildings, automobiles, aerospace, medicine and the like. The materials for 3D printing applications are mainly metals, ceramics, composites, polymers, and the like. The traditional sensor manufacturing technology, taking the MEMS process as an example, has the defects of difficulty in processing a true three-dimensional free-form structure, difficulty in utilizing a composite functional material with excellent performance, complex processing technology, low processing efficiency, high cost and the like.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a flexible pressure sensor chip based on a 3D printing technology and a manufacturing method thereof, which have the advantages of low processing cost, short processing period, simplicity and convenience in manufacturing, diversified material selection, integrated structure and the like, and can be used for pressure measurement on irregular object surfaces such as robots, medicine and other fields.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a flexible pressure sensor chip based on 3D printing technique, including flexible upper plate 1, flexible upper plate 1 contacts with the flexible bottom plate 2 of evenly distributed miniature pyramid array 3, make flexible film electrode 4 at flexible upper plate 1 and flexible bottom plate 2 contact surface, flexible film electrode 4 on flexible upper plate 1 and the flexible film electrode 4 on the flexible bottom plate 2 are connected with external circuit through the wire, the wire is located the through-hole 5 that is equipped with on the angle that flexible upper plate 1 and flexible bottom plate 2 correspond.
The flexible upper polar plate 1 and the flexible lower polar plate 2 are made of photosensitive flexible polyurethane resin materials.
The flexible thin film electrode 4 is made of a flexible conductive polymer PEDOT: PSS [ poly (3, 4-ethylenedioxythiophene) -poly (styrenesulfonic acid) ].
A manufacturing method of a flexible pressure sensor chip based on a 3D printing technology comprises the following steps:
1) curing the liquid photosensitive flexible polyurethane resin material by using a D L P3D printer to form a flexible upper polar plate 1 with a preset size and a flexible lower polar plate 2 with a uniformly distributed miniature pyramid array 3, wherein through holes 5 are reserved on the corresponding corners of the flexible upper polar plate 1 and the flexible lower polar plate 2;
2) the processed flexible upper polar plate 1 and the flexible lower polar plate 2 are sequentially placed in a cleaning solution and alcohol for ultrasonic cleaning treatment for 5 min; taking out the flexible upper polar plate 1 and the flexible lower polar plate 2, and placing in an ultraviolet lamp box for 20min to completely cure;
3) respectively penetrating two leads through holes 5 reserved on the flexible upper polar plate 1 and the flexible lower polar plate 2, closely adhering the leads to the flexible upper polar plate 1 and the flexible lower polar plate 2 by adopting conductive adhesive, placing the leads in a forced convection oven, baking the leads for 10 minutes at 100 ℃ to completely solidify the conductive adhesive, and naturally cooling the leads to room temperature after taking out;
4) placing the flexible upper polar plate 1 and the flexible lower polar plate 2 connected with the lead in a plasma processor for oxygen plasma treatment for 90 s;
5) placing the flexible upper polar plate 1 and the flexible lower polar plate 2 which are processed by the oxygen plasma into a liquid conductive polymer solution PEDOT (PSS), so that the surfaces of the flexible upper polar plate 1 and the flexible lower polar plate 2 are completely soaked with a layer of PEDOT (PSS);
6) taking out the flexible upper polar plate 1 and the flexible lower polar plate 2 with surfaces soaked with PEDOT, namely PSS solution, putting the flexible upper polar plate 1 and the flexible lower polar plate 2 into a forced convection oven, baking for 15min at 100 ℃, taking out and naturally cooling to room temperature to finish the manufacture of the flexible thin film electrode 4;
7) and (3) sticking the flexible upper polar plate 1 and the flexible lower polar plate 2 together by using a polyimide insulating tape, and simultaneously closing the side gap between the flexible upper polar plate 1 and the flexible lower polar plate 2.
The invention has the beneficial effects that:
the 3D printing process (photocuring molding) is adopted as a manufacturing method, and the flexible piezoresistive material PEDOT, PSS and flexible resin are combined, so that the material selection range of the traditional sensor is expanded. The 3D printing process of photocuring molding has higher precision, can manufacture a microstructure with a complex shape, and has the advantages of low processing cost, short processing period, simple and convenient manufacture, diversified material selection, integrated structure and the like. The force sensor of the invention can be applied in the field of pressure measurement.
Drawings
Fig. 1 is a schematic structural diagram of a flexible pressure sensor chip according to the present invention.
Fig. 2 is a schematic diagram of a cross-sectional resistance model of a flexible pressure sensor chip according to the present invention.
FIG. 3 is a schematic view of a Wheatstone bridge measurement of the flexible pressure sensor chip of the present invention.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1 and 2, a flexible pressure sensor chip based on 3D printing technology includes a flexible upper plate 1, the flexible upper plate 1 contacts with a flexible lower plate 2 of a uniformly distributed micro pyramid array 3, a flexible thin film electrode 4 is fabricated on the contact surface of the flexible upper plate 1 and the flexible lower plate 2, the flexible thin film electrode 4 on the flexible upper plate 1 and the flexible thin film electrode 4 on the flexible lower plate 2 are connected with an external circuit through a wire, and the wire is located in a through hole 5 formed in a corner corresponding to the flexible upper plate 1 and the flexible lower plate 2.
The flexible upper polar plate 1 and the flexible lower polar plate 2 are made of photosensitive flexible polyurethane resin materials.
The flexible thin film electrode 4 is made of a flexible conductive polymer PEDOT: PSS [ poly (3, 4-ethylenedioxythiophene) -poly (styrenesulfonic acid) ].
A manufacturing method of a flexible pressure sensor chip based on a 3D printing technology comprises the following steps:
1) curing the liquid photosensitive flexible polyurethane resin material by using a D L P3D printer to form a flexible upper polar plate 1 with a preset size and a flexible lower polar plate 2 with a uniformly distributed miniature pyramid array 3, wherein through holes 5 are reserved on the corresponding corners of the flexible upper polar plate 1 and the flexible lower polar plate 2;
2) the processed flexible upper polar plate 1 and the flexible lower polar plate 2 are sequentially placed in cleaning solution and alcohol for ultrasonic cleaning treatment for 5min to remove surface impurities and pollutants; taking out the flexible upper polar plate 1 and the flexible lower polar plate 2, and placing in an ultraviolet lamp box for 20min to completely cure;
3) respectively penetrating two leads through holes 5 reserved on the flexible upper polar plate 1 and the flexible lower polar plate 2, closely adhering the leads to the flexible upper polar plate 1 and the flexible lower polar plate 2 by adopting conductive adhesive, placing the leads in a forced convection oven, baking the leads for 10 minutes at 100 ℃ to completely solidify the conductive adhesive, and naturally cooling the leads to room temperature after taking out;
4) placing the flexible upper polar plate 1 and the flexible lower polar plate 2 connected with the lead in a plasma processor for oxygen plasma treatment for 90s, increasing the hydrophilicity of the flexible upper polar plate 1 and the flexible lower polar plate 2, and more easily infiltrating liquid;
5) placing the flexible upper polar plate 1 and the flexible lower polar plate 2 which are subjected to oxygen plasma treatment in a liquid conductive polymer solution PEDOT (PSS) for 30s, so that the surfaces of the flexible upper polar plate 1 and the flexible lower polar plate 2 are completely soaked with a layer of PEDOT (PSS) solution, and the uniformity and consistency of soaking are ensured as much as possible;
6) taking out the flexible upper polar plate 1 and the flexible lower polar plate 2 with surfaces soaked with PEDOT, namely PSS solution, putting the flexible upper polar plate 1 and the flexible lower polar plate 2 into a forced convection oven, baking for 15min at 100 ℃, taking out and naturally cooling to room temperature to finish the manufacture of the flexible thin film electrode 4;
7) the flexible upper polar plate 1 and the flexible lower polar plate 2 are adhered together by using the polyimide insulating adhesive tape, and meanwhile, the side gap between the flexible upper polar plate 1 and the flexible lower polar plate 2 is sealed, so that the flexible thin film electrode 4 is prevented from being influenced by air humidity and the stability of the piezoresistive property of the flexible thin film electrode is avoided.
The working principle of the flexible force sensor chip is as follows:
as shown in fig. 2, when a uniform load F acts on the upper surface of the flexible upper plate 1 of the sensor, the miniature pyramid array 3 deforms under the action of pressure, so as to change the contact area of the flexible thin film electrodes 4 on the surfaces of the flexible upper plate 1 and the flexible lower plate 2, that is, the total resistance R between the flexible upper plate 1 and the flexible lower plate 2 changes, and the total resistance R is represented by the upper plate resistance RtUpper and lower plate contact resistance RcAnd a lower plate resistance RbIs composed of, i.e.
R＝Rt+Rc+Rb
When the distance between the flexible upper polar plate 1 and the flexible lower polar plate 2 is changed,
ΔR＝R-R0＝(Rt+Rc+Rb)-(Rt0+Rc0+Rb0)
since the resistances of the flexible upper polar plate 1 and the flexible lower polar plate 2 are almost unchanged, the above formula can be approximated as
ΔR≈(Rc-Rc0)+(Rb-Rb0)
According to the law of resistance
Where p is the resistivity of the conductor material, L is the length of the conductor, S is the cross-sectional area of the conductor,
the change expression of the resistance value is as follows:
where ρ iscIs the resistivity of the flexible thin-film electrode material, AcContact area of flexible membrane electrodes on the upper and lower plate surfaces, LcThickness of flexible film electrode at the contact position of upper and lower electrode plates, DbThe thickness of the flexible film electrode on the side surface of the miniature pyramid, CbPerimeter of flexible membrane electrode contact surface of upper and lower plate surfaces, LbThe length of the thin film electrode on the side surface of the miniature pyramid.
Through an external Wheatstone bridge circuit, as shown in FIG. 3, wherein R is the piezoresistive material film resistor to be measured, Vc is a constant voltage source, R1, R2 and R3 are bridge resistors, and Vo is an output voltage, the resistance value change is converted into an electric signal to be output, so that the acting force-electric signal conversion of the sensor chip is realized, and the measurement of the acting force is completed.
Claims (1)
1. A manufacturing method of a flexible pressure sensor chip based on a 3D printing technology is characterized by comprising the following steps:
1) curing the liquid photosensitive flexible polyurethane resin material by using a D L P3D printer to form a flexible upper polar plate (1) with a preset size and a flexible lower polar plate (2) with the uniformly distributed miniature pyramid arrays (3), wherein through holes (5) are reserved on the corresponding corners of the flexible upper polar plate (1) and the flexible lower polar plate (2);
2) the processed flexible upper polar plate (1) and the flexible lower polar plate (2) are sequentially placed in cleaning solution and alcohol for ultrasonic cleaning treatment for 5 min; taking out the flexible upper polar plate (1) and the flexible lower polar plate (2), and placing in an ultraviolet lamp box for 20min to completely cure the flexible upper polar plate and the flexible lower polar plate;
3) respectively penetrating two leads through holes (5) reserved on the flexible upper polar plate (1) and the flexible lower polar plate (2), closely adhering the leads to the flexible upper polar plate (1) and the flexible lower polar plate (2) by adopting conductive adhesive, placing the leads in a forced convection oven, baking the leads for 10 minutes at 100 ℃ to completely solidify the conductive adhesive, and naturally cooling the leads to room temperature after taking out;
4) placing the flexible upper polar plate (1) and the flexible lower polar plate (2) connected with the lead in a plasma processor for oxygen plasma treatment for 90 s;
5) placing the flexible upper polar plate (1) and the flexible lower polar plate (2) which are subjected to oxygen plasma treatment in a liquid conductive polymer solution PEDOT (PSS), so that a layer of PEDOT (PSS) solution is completely soaked on the surfaces of the flexible upper polar plate (1) and the flexible lower polar plate (2);
6) taking out the flexible upper polar plate (1) and the flexible lower polar plate (2) with surfaces soaked with PEDOT, namely PSS solution, putting the flexible upper polar plate and the flexible lower polar plate into a forced convection oven, baking the flexible upper polar plate and the flexible lower polar plate for 15min at 100 ℃, taking out the flexible upper polar plate and the flexible lower polar plate, and naturally cooling the flexible upper polar plate and the flexible lower polar plate to room temperature to complete the manufacture;
7) the flexible upper polar plate (1) and the flexible lower polar plate (2) are adhered together by using a polyimide insulating adhesive tape, and the gaps on the side surfaces of the flexible upper polar plate (1) and the flexible lower polar plate (2) are sealed at the same time;
a flexible pressure sensor chip based on 3D printing technique, including flexible upper polar plate (1), flexible upper polar plate (1) contacts with flexible bottom plate (2) of evenly distributed miniature pyramid array (3), make flexible film electrode (4) at flexible upper polar plate (1) and flexible bottom plate (2) contact surface, flexible film electrode (4) on flexible upper polar plate (1) and flexible film electrode (4) on flexible bottom plate (2) are connected with external circuit through the wire, the wire is located flexible upper polar plate (1) and flexible bottom plate (2) corresponding through-hole (5) that are equipped with on the angle.
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| CN110440961B (en) * | 2019-08-16 | 2020-11-03 | 新昌县玮康电子科技有限公司 | Wearable piezoresistive sensor system and preparation process thereof |
| CN110608825B (en) * | 2019-09-12 | 2021-08-20 | 复旦大学 | Flexible pressure sensor based on polyimide substrate microstructure and preparation method thereof |
| CN111829697B (en) * | 2020-06-17 | 2022-07-05 | 华中科技大学 | Flexible pressure sensor with convex hemispherical structure and preparation method thereof |
| CN112729628A (en) * | 2020-12-25 | 2021-04-30 | 吉林大学 | Hypersensitive flexible sensor and preparation method thereof |
| CN112895433B (en) * | 2021-01-14 | 2022-04-12 | 河北工业大学 | Flexible sensor device based on 3D printing and preparation method thereof |
| CN112924060B (en) * | 2021-01-22 | 2022-09-30 | 宁波诺丁汉新材料研究院有限公司 | Flexible pressure sensor and preparation method thereof |
| CN113390957A (en) * | 2021-04-27 | 2021-09-14 | 杭州电子科技大学 | Anti-crosstalk eddy current nondestructive flaw detection system based on magnetic sensing probe |
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| CN104409172A (en) * | 2014-05-31 | 2015-03-11 | 福州大学 | 3D manufacturing method of latticed conducting array |
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| CN105865667B (en) * | 2016-05-19 | 2018-06-01 | 北京印刷学院 | Condenser type pliable pressure sensor based on micro-structural dielectric layer and preparation method thereof |
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| CN104409172A (en) * | 2014-05-31 | 2015-03-11 | 福州大学 | 3D manufacturing method of latticed conducting array |
| CN104359597A (en) * | 2014-11-13 | 2015-02-18 | 中国科学院重庆绿色智能技术研究院 | Electronic skin based on three-dimensional flexible substrate graphene and preparing method thereof |
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Effective date of registration: 20201009 Address after: Room 10101, floor 1, building 1, East Industrial Building, modern enterprise center, No. 2, zhangbawu Road, hi tech Zone, Xi'an City, Shaanxi Province 710000 Patentee after: XI'AN WINWAY MACHINERY Co.,Ltd. Address before: Beilin District Xianning West Road 710049, Shaanxi city of Xi'an province No. 28 Patentee before: XI'AN JIAOTONG University |
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