CN108243598A - Shell, preparation method and the electronic equipment of a kind of electronic equipment - Google Patents
Shell, preparation method and the electronic equipment of a kind of electronic equipment Download PDFInfo
- Publication number
- CN108243598A CN108243598A CN201810106844.2A CN201810106844A CN108243598A CN 108243598 A CN108243598 A CN 108243598A CN 201810106844 A CN201810106844 A CN 201810106844A CN 108243598 A CN108243598 A CN 108243598A
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- CN
- China
- Prior art keywords
- electronic equipment
- shell
- outer cover
- cover body
- conducting coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
Abstract
The invention discloses the shells, preparation method and electronic equipment of a kind of electronic equipment, by setting composite heat-conducting coating at least part surface of outer cover body, composite heat-conducting coating is made to be coated on outer cover body, raising composite heat-conducting coating is bonded effect with outer cover body, to be conducted the heat that the body of electronic equipment generates in time by composite heat-conducting coating.And by setting multiple first nano-pores in composite heat-conducting coating, the circulation of air can be promoted, so as to improve the heat dissipation effect of electronic equipment.
Description
Technical field
The present invention relates to electronic technology field, the more particularly to shell of a kind of electronic equipment, preparation method and electronics is set
It is standby.
Background technology
Wireless communication is rapidly developed with the information processing technology, the portables electricity such as mobile phone, laptop, tablet computer
Sub- equipment is competitively emerged in large numbers, and more facility is brought to people’s lives.These general portable electronic equipments need to set outer
Shell is to protect its body.However, more heat can be sent out during electronic equipment use, if this partial heat
It cannot distribute in time, the service life of electronic equipment component slow in reacting, in reduction electronic equipment can be caused, such as
Reduce the service life of battery, mainboard.Therefore effectively cool down to electronic equipment particularly important.
At present, the heat-conducting layer formed by metal material is generally set in the housing of the electronics device, with to electronic equipment into
Row heat dissipation.But the heat-conducting layer of metal material is the good conductor of electricity, easily contacts and draws with the conductive component of electronic equipment internal
Short circuit is played, there are security risks.And the heat-conducting layer is also bad with other materials fitting effect, is unfavorable for heat and gives out in time
It goes, so as to influence electronic equipment dissipating heat effect.
Invention content
The embodiment of the present invention provide a kind of electronic equipment shell, preparation method and electronic equipment, to improve and its
The fitting effect of his material and the heat dissipation effect for improving electronic equipment.
Shell an embodiment of the present invention provides a kind of electronic equipment includes：Outer cover body further includes：It is set to described outer
Composite heat-conducting coating at least part surface of shell ontology；The composite heat-conducting coating is provided with multiple first nano-pores.
Correspondingly, the embodiment of the present invention additionally provides a kind of any of the above-described kind of electronic equipment provided in an embodiment of the present invention
The preparation method of shell, including：
Form the outer cover body；
Composite heat-conducting coating is formed at least part surface of the outer cover body；Wherein, the composite heat-conducting coating is set
It is equipped with multiple first nano-pores.
Correspondingly, the embodiment of the present invention additionally provides a kind of electronic equipment, including above-mentioned provided in an embodiment of the present invention
The shell of a kind of electronic equipment.
The present invention has the beneficial effect that：
Shell, preparation method and the electronic equipment of electronic equipment provided in an embodiment of the present invention, by outer cover body
At least part surface on set composite heat-conducting coating, make composite heat-conducting coating be coated on outer cover body on, improve composite heat-conducting
Coating is bonded effect with outer cover body, to be conducted the heat that the body of electronic equipment generates in time by composite heat-conducting coating
It goes out.And by setting multiple first nano-pores in composite heat-conducting coating, the circulation of air can be promoted, so as to improve electricity
The heat dissipation effect of sub- equipment.
Description of the drawings
Fig. 1 is one of overlooking the structure diagram of shell of electronic equipment provided in an embodiment of the present invention；
Fig. 2 is shell shown in FIG. 1 along one of the cross-sectional view in AA ' directions；
Fig. 3 is shell shown in FIG. 1 along the two of the cross-sectional view in AA ' directions；
Fig. 4 is the two of the overlooking the structure diagram of the shell of electronic equipment provided in an embodiment of the present invention；
Fig. 5 is cross-sectional view of the shell shown in Fig. 4 along AA ' directions；
Fig. 6 is the flow chart of preparation method provided in an embodiment of the present invention；
Fig. 7 and Fig. 8 is respectively to have performed the cross-sectional view after each step for preparing shell shown in fig. 5；
The overlooking the structure diagram of shell after Fig. 9 and Figure 10 respectively spraying process of execution.
Specific embodiment
General electronic equipment includes：Mobile phone, laptop, tablet computer, television set, display, Digital Frame, navigation
The products such as instrument.In order to protect the body of electronic equipment, the shell that its body is protected in setting is generally required, such as mobile phone needs to set
To be protected to its body, tablet computer needs that panel computer shell is set to protect its body phone housing.
When shell is applied in electronic equipment, shell is towards the side of the body of electronic equipment as its inner surface, and shell is away from electricity
The side of the body of sub- equipment is as its outer surface.Also, in the specific implementation, the shape of these electronic equipments, size be not yet
It is identical to the greatest extent, therefore the parameters such as the shape of its shell, size are also not quite similar.And other for these electronic equipments must can not
Few component part is it will be apparent to an ordinarily skilled person in the art that having, and this will not be repeated here, also be should not be used as pair
The limitation of the present invention.
In order to make the purpose of the present invention, technical solution and advantage are clearer, below in conjunction with the accompanying drawings, to the embodiment of the present invention
The specific embodiment of the shell of the electronic equipment of offer, preparation method and electronic equipment is described in detail.It should manage
Solution, preferred embodiment disclosed below are merely to illustrate and explain the present invention, are not intended to limit the present invention.And it is not rushing
In the case of prominent, the feature in embodiment and embodiment in the application can be combined with each other.
Each layer film thickness and shape do not reflect the actual proportions of the shell of electronic equipment in attached drawing, and purpose is only illustrated to say
Bright the content of present invention.
With reference to shown in Fig. 1 to Fig. 3 (Fig. 2 and Fig. 3 is by taking M=2 as an example), a kind of electronic equipment provided in an embodiment of the present invention
Shell can include：Outer cover body 100 and the composite heat-conducting coating being set at least part surface of outer cover body 100
200_m (the M of m=1,2,3 ...；M is the sum of composite heat-conducting coating set on one surface of outer cover body)；Composite heat-conducting coating
200_m is provided with multiple first nano-pore 210_m.
The shell of electronic equipment provided in an embodiment of the present invention, it is multiple by being set at least part surface of outer cover body
Heat conducting coating is closed, composite heat-conducting coating is made to be coated on outer cover body, raising composite heat-conducting coating is bonded effect with outer cover body
Fruit, to be conducted the heat that the body of electronic equipment generates in time by composite heat-conducting coating.And by composite guide
Multiple first nano-pores in hot coating are set, the circulation of air can be promoted, so as to improve the heat dissipation effect of electronic equipment.
In electronic device works, battery, mainboard region can be included by generating the more region of heat.Specific
During implementation, in the shell of electronic equipment provided in an embodiment of the present invention, composite heat-conducting coating can correspond to electricity in outer cover body
The battery region setting of sub- equipment.The heat that battery generates can be distributed in time in this way, improve the use of battery
Service life.Certainly, in the specific implementation, composite heat-conducting coating can also correspond to the mainboard region of electronic equipment in outer cover body
Setting.The heat that mainboard generates can be distributed in time in this way, improve the service life of mainboard.
In practical applications, general electronic equipment will appear whole the phenomenon that generating heat, such as mobile phone when in use can
Complete machine is generated heat.Therefore, in order to reduce the temperature of complete machine, heat dissipation is improved, in the specific implementation, in electricity provided in an embodiment of the present invention
In the shell of sub- equipment, composite heat-conducting coating can be at least one of the inner surface of covering shell ontology and outer surface surface.
Specifically, as shown in Fig. 2, composite heat-conducting coating 200_m can be with one in the inner surface and outer surface of covering shell ontology 100
Surface.As shown in figure 3, composite heat-conducting coating 200_m not only can be with the inner surface of covering shell ontology 100, it but also can be with covering shell
The outer surface of ontology 100.In practical applications, these needs design determining according to actual application environment, are not limited thereto.
In practical application, in order to further improve the service life of electronic equipment body, it is also necessary to prevent dust and water
Divide and enter electronic equipment body.The diameter of general dust is about 50 μm, and the gas in air is generally nanoscale, such as N2's
Diameter is about 0.364nm, O2Diameter be about 0.346nm, the diameter of He is about 0.289nm, CO2Diameter be about 0.33nm.This
A diameter of nanoscale of the first nano-pore in the composite heat-conducting coating of the shell for the electronic equipment that inventive embodiments provide, therefore
Effectively external dust can be prevented to enter, and can admitted air into, quickly to be distributed heat by air.Specifically
Ground, the diameter of the first nano-pore could be provided as 1~10nm.Certainly, the environment of housing application is different, then corresponding dust is straight
Diameter may be also different, therefore the diameter of the first nano-pore can design determining according to actual application environment, be not limited thereto.
Also, the porosity of composite heat-conducting coating can be more than 96.5%, be not limited thereto.
In the specific implementation, in order to which moisture is prevented to enter the body of electronic equipment, composite heat-conducting coating can be set as
Hydrophobic coating.Partial moisture can be prevented to enter the body of electronic equipment in this way.
Further, in order to which the vapor in air is effectively avoided to enter the body of electronic equipment, and heat dissipation is improved,
When it is implemented, as shown in Figure 2 and Figure 3, in the shell of electronic equipment provided in an embodiment of the present invention, composite heat-conducting coating can
To be set as at least two layers, i.e. composite heat-conducting coating 200_1 and composite heat-conducting coating 200_2；Also, per adjacent two layers composite guide
First nano-pore 210_1,210_2 of hot coating 200_1,200_2 are in the orthographic projection no overlap of outer cover body.Specifically, in reality
In the application of border, composite heat-conducting coating could be provided as two layers, three layers, four layers ... etc., be not limited thereto.
Specifically, it is illustrated by taking composite heat-conducting coating 200_1,200_2 as shown in Figure 2 as an example, in outer cover body 100
A surface two layers composite heat-conducting coating 200_1 and 200_2, also, the first nano-pore of composite heat-conducting coating 200_1 are set
210_1 is in the orthographic projection of outer cover body 100 and the first nano-pore 210_2 of composite heat-conducting coating 200_2 in outer cover body 100
Orthographic projection no overlap.Since the diameter of air is smaller, outside air can be made to pass through the first nano-pore 210_1 entrance, then pass through
Gap between two layers of composite heat-conducting coating 200_1 and composite heat-conducting coating 200_2 enters the first nano-pore 210_2, and the
Air in one nano-pore 210_2 can also be flowed out by the channel from the first nano-pore 210_1, so as to so that composite heat-conducting
Coating 200_1 and 200_2 realizes good selection gas permeability, and then the heat being transferred on outer cover body 100 is made to pass through air
It distributes, improves thermal diffusivity.Also, electronic equipment is entered by above-mentioned path in order to prevent to be scattered in the vapor in air
Body, in the specific implementation, each layer composite heat-conducting coating can be set as hydrophobic coating.It carries in air in this way
During vapor, the vapor in air can be isolated, so as to avoid vapor by the hydrophobicity of composite heat-conducting coating
Into the body of electronic equipment, so as to improve block-water effect.
In practical applications, the characteristic that material conducts heat can be generally characterized by thermal conductivity factor, and material is led
Hot coefficient is higher, and the performance for conducting heat is better.In the specific implementation, in the outer of electronic equipment provided in an embodiment of the present invention
In shell, the material of composite heat-conducting coating can include：Thermoplastic resin is more than the Heat Conduction Material of 2000W/ (m*K) with thermal conductivity factor
Mixing material.Wherein, thermoplastic resin due to good toughness, thermal stability is high, chemical resistance is strong, flame resistance is good, storage
Phase is unrestricted, can bond to form being stained with property coating well with many metals and nonmetallic materials, can make so compound
Heat conducting coating is effectively pasted on the surface of outer cover body to come off.Also, toughness and the bending resistance of shell can also be made
Intensity enhancing improves the impact resistance of shell, when shell is applied in electronic equipment, can improve the safety of electronic equipment
Property.In addition, thermoplastic resin also has good recyclability, recyclable, repeatable utilization and characteristic free from environmental pollution
The developing direction of current material environment friendly is adapted to.Also, the thermal conductivity factor of the Heat Conduction Material used in the embodiment of the present invention is long-range
In the thermal conductivity factor of metal material, so as to which effectively further heat is conducted.
General graphene has higher thermal conductivity factor with carbon nanotube, wherein, the thermal conductivity factor of carbon nanotube can be
3000~6000W/ (m*k), the thermal conductivity factor of graphene may be about 5300W/ (m*k), therefore in the specific implementation, heat conduction material
Material can include：One of graphene and carbon nanotube combine.Certainly, in practical applications, Heat Conduction Material can also include
Thermal conductivity factor is more than the other materials of 2000W/ (m*K), is not limited thereto.
Polyphenylene sulfide is the structure connected by phenyl ring through sulphur atom, it not only has the performance of common engineering plastics,
And have higher thermal stability, and preferable chemical resistance and flame resistance and nontoxic, and it can also be with many gold
Belong to and nonmetallic materials bond the being stained with property coating formed well.In the specific implementation, thermoplastic resin can include polyphenylene sulfide
Ether.Certainly, in practical applications, thermoplastic resin can also include other materials, be not limited thereto.
Between the environment temperature that general electronic equipment is in is about -80~260 DEG C, in the specific implementation, by graphene with
One of carbon nanotube or combination are mixed into the composite heat-conducting coating that is obtained in polyphenylene sulfide, can low temperature resistant and high temperature resistant, therefore
When the shell that will have composite heat-conducting coating is applied to electronic equipment, which has higher safety.
The material of the shell of general electronic equipment can include：The materials such as plastics, metal, glass and ceramics.Specific
During implementation, the material of the housing main body of the shell of electronic equipment provided in an embodiment of the present invention can be glass or ceramics.
In order to further reduce organism temperature, raising is radiated, in the specific implementation, with reference to shown in Fig. 4 and Fig. 5, shell sheet
At least part region of body 100 is provided with multiple second nano-pores 110.Composite heat-conducting coating 200_ can be bypassed air through in this way
110 shape of the first nano-pore 210_2 and the second nano-pore in the first nano-pore 210_1, composite heat-conducting coating 200_2 in 1
Into the circulation path of air, electronic equipment dissipating heat performance is further improved.Also, the diameter of the second nano-pore is also configured as nanometer
Grade, therefore dust can also effectively be prevented to enter the body of electronic equipment.Specifically, the diameter of the second nano-pore can be 20-
50nm.Certainly, the environment of housing application is different, then the diameter of corresponding dust may be also different, therefore the second nano-pore is straight
Diameter can design determining according to actual application environment, be not limited thereto.
Further, in order to improve the heat dissipation effect to battery, in the specific implementation, the second nano-pore can be arranged on outer
Shell ontology corresponds to the battery region setting of electronic equipment.The heat that battery generates can be distributed in time in this way, with
Improve the service life of battery.
Further, in order to improve the heat dissipation effect to mainboard, in the specific implementation, the second nano-pore can also be arranged on
Outer cover body corresponds to the mainboard region setting of electronic equipment.
In practical applications, general electronic equipment will appear whole the phenomenon that generating heat, such as mobile phone when in use can
Complete machine is generated heat, and therefore, in order to reduce the temperature of complete machine, heat dissipation is improved, in the specific implementation, in electricity provided in an embodiment of the present invention
In the shell of sub- equipment, the second nano-pore can be arranged in the whole region of outer cover body.
In the specific implementation, when electronic equipment is mobile phone, shell provided in an embodiment of the present invention can be phone housing.
In practical applications, the shape of phone housing, size needs design determining according to actual application environment, are not limited thereto.
Certainly, it is laptop, tablet computer, television set, display, Digital Frame, navigator etc. in electronic equipment
During product, shell provided in an embodiment of the present invention may be laptop, tablet computer, television set, display, digital phase
The shell of the products such as frame, navigator, is not limited thereto.
Based on same inventive concept, the embodiment of the present invention additionally provides a kind of any of the above-described kind provided in an embodiment of the present invention
The preparation method of the shell of electronic equipment, as shown in fig. 6, this method may include steps of：
S601, outer cover body is formed.Specifically, the outer cover body of formation can have the second nano-pore, can not also have
There is the second nano-pore, be not limited thereto.
S602, composite heat-conducting coating is formed at least part surface of outer cover body；Wherein, composite heat-conducting coating is provided with
Multiple first nano-pores.
Above-mentioned preparation method provided in an embodiment of the present invention, it is compound by being formed at least part surface of outer cover body
Heat conducting coating makes composite heat-conducting coating be coated on outer cover body, and raising composite heat-conducting coating is bonded effect with outer cover body,
The heat that the body of electronic equipment generates to be conducted in time by composite heat-conducting coating.And by being applied in composite heat-conducting
Multiple first nano-pores are formed in layer, the circulation of air can be promoted, so as to improve the heat dissipation effect of electronic equipment.
In the specific implementation, in preparation method provided in an embodiment of the present invention, composite heat-conducting coating is formed, it specifically can be with
Including：
Heat Conduction Material of the thermal conductivity factor more than 2000W/ (m*K) is added in thermoplastic resin and forms composite coating mixing
Liquid；
Composite coating mixed liquor is sprayed at least part surface of outer cover body using spraying process, makes to be sprayed at outer
Composite coating mixed liquor on shell ontology forms multiple first nano-pores；
By the housing main body for being coated with composite coating mixed liquor be dried successively processing, high-temperature fusion plastics processing and
Quenching treatment forms composite heat-conducting coating.
It in the specific implementation, will be multiple using spraying process at least twice in preparation method provided in an embodiment of the present invention
Coating mixed liquor is closed to be sprayed at least part surface of outer cover body, and make the composite coating being sprayed at every time on outer cover body
Mixed liquor forms multiple first nano-pores.At least two layers of composite guide can be formed at least part surface of outer cover body in this way
Hot coating.Also, for the housing main body after each spraying process, the housing main body of composite coating mixed liquor will be coated with successively
Processing, high-temperature fusion plastics processing and quenching treatment is dried, forms composite heat-conducting coating.
Below for forming the structure of shell shown in fig. 5, to above-mentioned preparation method provided in an embodiment of the present invention into
Row explanation.The method for preparing shell shown in fig. 5, may comprise steps of：
(1) outer cover body 100 with the second nano-pore 110 is formed；As shown in Figure 7.
Specifically, outer cover body is formed using glass or ceramics, multiple the is formed on outer cover body by laser technology
Two nano-pores.Alternatively, using tape casting technique, prepared by glass or ceramic material to form the shell sheet with the second nano-pore
Body.The outer cover body with the second nano-pore is formed by other methods it is, of course, also possible to adopt, is not limited thereto.
(2) inner surface for being covered each by outer cover body 100 is formed on outer cover body 100 to receive with outer surface and with first
The first layer composite heat-conducting coating 200_1 of metre hole 210_1, as shown in Figure 8.
Specifically, Heat Conduction Material of the thermal conductivity factor more than 2000W/ (m*K) is added in thermoplastic resin and forms compound painting
Expect mixed liquor.Wherein, can specifically include：Graphene and carbon nanotube are added in polyphenylene sulfide；Wherein, graphene is received with carbon
The mass ratio of mitron is 0.1~1:1, the mass ratio of graphene and polyphenylene sulfide is 0.01~5:100, polyphenylene sulfide gets around regulations finger
Number is 15~100g/10min.
Composite coating mixed liquor is sprayed in the inner surface and the outer surface of outer cover body using first time spraying process, is made
The composite coating mixed liquor being sprayed on outer cover body forms multiple first nano-pore 210_1；As shown in Figure 9.In practical spray
It applies in technical process, during spraying composite coating, multiple nano-pores are formed in the one layer of composite coating mixed liquor that can be formed in spraying,
And by the parameter for controlling spraying process, the size of the diameter of the first nano-pore can be controlled.
By the housing main body for being coated with composite coating mixed liquor be dried successively processing, high-temperature fusion plastics processing and
Quenching treatment forms composite heat-conducting coating 200_1.Wherein, can specifically include：The shell of composite coating mixed liquor will be coated with
Processing is dried under conditions of temperature is 80 DEG C, the time is 0.5~1h in main body；Later temperature for 340~360 DEG C, when
Between to carry out high-temperature fusion plastics processing under conditions of 2~3h；Quenching treatment is finally carried out, to form composite heat-conducting coating 200_
1。
(3) covering first layer composite heat-conducting coating 200_1 is formed on outer cover body 100 and with the first nano-pore 210_
2 second layer composite heat-conducting coating 200_2, as shown in Figure 5.
Specifically, composite coating mixed liquor is sprayed to the inner surface and appearance of outer cover body using second of spraying process
On face, make to be sprayed at the composite coating mixed liquor on outer cover body and form multiple first nano-pore 210_2；As shown in Figure 10.The
One nano-pore 210_2 and the first nano-pore 210_1 is in the orthographic projection no overlap of outer cover body.
By the housing main body for being coated with composite coating mixed liquor be dried successively processing, high-temperature fusion plastics processing and
Quenching treatment forms composite heat-conducting coating 200_2.Wherein, can specifically include：The shell of composite coating mixed liquor will be coated with
Processing is dried under conditions of temperature is 80 DEG C, the time is 0.5~1h in main body；Later temperature for 340~360 DEG C, when
Between to carry out high-temperature fusion plastics processing under conditions of 2~3h；Quenching treatment is finally carried out, to form composite heat-conducting coating 200_
1。
It should be noted that in order to avoid shell is thicker, the thickness of every layer of composite heat-conducting coating of formation can be 10~
50nm.Also, the process of above-mentioned carry out quenching treatment can with it is of the prior art identical, be not limited thereto.
Based on same inventive concept, the embodiment of the present invention additionally provides a kind of electronic equipment, is carried including the embodiment of the present invention
The shell of any of the above-described kind of electronic equipment supplied.The principle and the outer shell phase of aforementioned electronic devices that the electronic equipment solves the problems, such as
Seemingly, thus the implementation of the electronic equipment may refer to aforementioned electronic devices shell implementation, repeat part details are not described herein.
In the specific implementation, electronic equipment provided in an embodiment of the present invention can be mobile phone, laptop, tablet electricity
The products such as brain, television set, display, Digital Frame, navigator.And for other essential groups of these electronic equipments
Into being partly it will be apparent to an ordinarily skilled person in the art that having, this will not be repeated here, also should not be used as to the present invention
Limitation.
Shell, preparation method and the electronic equipment of electronic equipment provided in an embodiment of the present invention, by outer cover body
At least part surface on set composite heat-conducting coating, make composite heat-conducting coating be coated on outer cover body on, improve composite heat-conducting
Coating is bonded effect with outer cover body, to be conducted the heat that the body of electronic equipment generates in time by composite heat-conducting coating
It goes out.And by setting multiple first nano-pores in composite heat-conducting coating, the circulation of air can be promoted, so as to improve electricity
The heat dissipation effect of sub- equipment.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
God and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (16)
1. the shell of a kind of electronic equipment, including：Outer cover body, which is characterized in that further include：It is set to the outer cover body
Composite heat-conducting coating at least part surface；The composite heat-conducting coating is provided with multiple first nano-pores.
2. the shell of electronic equipment as described in claim 1, which is characterized in that the composite heat-conducting coating is at least two layers；
Also, the first nano-pore per adjacent two layers composite heat-conducting coating is in the orthographic projection no overlap of the outer cover body.
3. the shell of electronic equipment as described in claim 1, which is characterized in that the composite heat-conducting coating covers the shell
At least one of the inner surface of ontology and outer surface surface.
4. the shell of electronic equipment as described in claim 1, which is characterized in that the composite heat-conducting coating is applied for hydrophobicity
Layer.
5. the shell of electronic equipment as described in claim 1, which is characterized in that the material of the composite heat-conducting coating includes：
The mixing material of thermoplastic resin and Heat Conduction Material of the thermal conductivity factor more than 2000W/ (m*K).
6. the shell of electronic equipment as claimed in claim 5, which is characterized in that the Heat Conduction Material includes：Graphene and carbon
One of nanotube or combination.
7. the shell of electronic equipment as claimed in claim 5, which is characterized in that the thermoplastic resin includes polyphenylene sulfide.
8. the shell of electronic equipment as described in claim 1, which is characterized in that at least part region of the outer cover body is set
It is equipped with multiple second nano-pores.
9. the shell of electronic equipment as claimed in claim 8, which is characterized in that second nano-pore is in the outer cover body
The battery region setting of the corresponding electronic equipment.
10. the shell of electronic equipment as claimed in claim 8, which is characterized in that second nano-pore is in the shell sheet
Body corresponds to the mainboard region setting of the electronic equipment.
A kind of 11. preparation method of such as shell of claim 1-10 any one of them electronic equipments, which is characterized in that packet
It includes：
Form the outer cover body；
Composite heat-conducting coating is formed at least part surface of the outer cover body；Wherein, the composite heat-conducting coating is provided with
Multiple first nano-pores.
12. method as claimed in claim 11, which is characterized in that the formation composite heat-conducting coating specifically includes：
Heat Conduction Material of the thermal conductivity factor more than 2000W/ (m*K) is added in thermoplastic resin and forms composite coating mixed liquor；
The composite coating mixed liquor is sprayed at least part surface of the outer cover body using spraying process, makes spraying
Multiple first nano-pores are formed in the composite coating mixed liquor on the outer cover body；
By the housing main body for being coated with the composite coating mixed liquor be dried successively processing, high-temperature fusion plastics processing and
Quenching treatment forms the composite heat-conducting coating.
13. method as claimed in claim 12, which is characterized in that mixed the composite coating using spraying process at least twice
Liquid is closed to be sprayed at least part surface of the outer cover body, and make the composite coating being sprayed at every time on the outer cover body
Mixed liquor forms multiple first nano-pores.
14. method as claimed in claim 12, which is characterized in that the formation composite coating mixed liquor specifically includes：
Graphene and carbon nanotube are added in polyphenylene sulfide；Wherein, the graphene and the mass ratio of the carbon nanotube are
0.1~1:1, the mass ratio of the graphene and the polyphenylene sulfide is 0.01~5:100, the polyphenylene sulfide gets around regulations index
For 15~100g/10min.
15. method as claimed in claim 12, which is characterized in that under conditions of temperature is 80 DEG C, the time is 0.5~1h into
Row is dried；
High-temperature fusion plastics processing is carried out under conditions of temperature is 340~360 DEG C, the time is 2~3h.
16. a kind of electronic equipment, which is characterized in that including：Such as the shell of claim 1-10 any one of them electronic equipments.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810106844.2A CN108243598A (en) | 2018-02-02 | 2018-02-02 | Shell, preparation method and the electronic equipment of a kind of electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810106844.2A CN108243598A (en) | 2018-02-02 | 2018-02-02 | Shell, preparation method and the electronic equipment of a kind of electronic equipment |
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| CN108243598A true CN108243598A (en) | 2018-07-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810106844.2A Pending CN108243598A (en) | 2018-02-02 | 2018-02-02 | Shell, preparation method and the electronic equipment of a kind of electronic equipment |
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| CN (1) | CN108243598A (en) |
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| CN102947372A (en) * | 2010-04-22 | 2013-02-27 | 阿克马法国公司 | Thermoplastic and/or elastomeric composite material containing carbon nanotubes and graphenes |
| CN105101755A (en) * | 2015-08-31 | 2015-11-25 | 新纳科技有限公司 | Heat-conducting structure and heat-dissipation device |
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| CN1851909A (en) * | 2006-06-05 | 2006-10-25 | 董勉国 | Aluminium-alloy high-power semi-conductor radiator and preparing method |
| CN101480858A (en) * | 2008-01-11 | 2009-07-15 | 清华大学 | Carbon nano-tube composite material and preparation method thereof |
| KR100949786B1 (en) * | 2009-07-03 | 2010-03-30 | 두성산업 주식회사 | Ceramic composition for heat sink and excellent in heat rediate and heat absorption heat sink manufactured from the same |
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Application publication date: 20180703 |