CN108106775A - A kind of temperature and pressure transmitter - Google Patents
A kind of temperature and pressure transmitter Download PDFInfo
- Publication number
- CN108106775A CN108106775A CN201711326567.8A CN201711326567A CN108106775A CN 108106775 A CN108106775 A CN 108106775A CN 201711326567 A CN201711326567 A CN 201711326567A CN 108106775 A CN108106775 A CN 108106775A
- Authority
- CN
- China
- Prior art keywords
- temperature
- pressure
- housing
- circuit board
- passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
- G01K13/026—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow of moving liquids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
Abstract
Present invention is disclosed a kind of temperature and pressure transmitters, housing is equipped with the passage that the pressure medium of ribbon supply temperature flows into, the passage set there are one entrance and two outlet, circuit board is fixed on the housing, the circuit board is electrically connected with the MEMS pressure chips of two built-in temperature sensors, and two MEMS pressure chips block the pressure signal for being used to be respectively induced outlet in two exits of passage respectively.The present invention uses the method sense temperature of two built-in temperature sensor MEMS pressure chips, shell mechanism design can only consider pressure seal function, therefore there is no the leakage weak spot problems of independent temperature-sensing element (device) lead, in addition product structure is compact, circuit structure is simple, and operation is more reliable and more stable.
Description
Technical field
The present invention relates to the senser elements of measurement temperature and pressure.
Background technology
With the development of automotive engineering, more and more demands for temperature and pressure transmitter, ordinary temperature pressure are generated
Force snesor design needs to include a pressure-sensing device and a temperature-sensing element (device) and processing is believed respectively on circuit boards
Number output, arranged apart, the scheme that signal concentrates on circuit board processing is realized, it is more difficult to realize the miniaturization of sensor, to cloth
It puts size to have higher requirements, and as shown in figure 3, in order to which the stitch of temperature-sensing element (device) is drawn out to circuit board, is being molded
Arrangement route in part or metal shell can often become the weak spot of sealing and be easier to leak in practical applications, make Jie
Cause to fail inside matter intrusion sensor, therefore the place of temperature-sensing element (device) layout can usually become the weakness of pressure seal
Point.
The content of the invention
The technical problems to be solved by the invention be realize it is a kind of stable and reliable in work, being capable of material temperature and pressure simultaneously
The sensor of signal.
To achieve these goals, the technical solution adopted by the present invention is：A kind of temperature and pressure transmitter, housing, which is equipped with, to be supplied
The passage that pressure medium with temperature flows into, the passage are set there are one entrance and two outlets, and electricity is fixed on the housing
Road plate, the circuit board are electrically connected with the MEMS pressure chips of two built-in temperature sensors, two MEMS pressure chips
The pressure signal for being used to be respectively induced outlet in two exits of passage is blocked respectively.
The housing is injection-moulded housing, and the entrance of the passage is located at the front of housing, and two outlets of the passage are equal
Positioned at the reverse side of housing, the circuit board is fixed on the reverse side of housing, and two MEMS pressure chips connect circuit board by stitch,
The stitch is located at the outer surface of circuit board.
Control method based on temperature and pressure transmitter, two MEMS pressure chips use different temperature-compensating meters
Formula is calculated, two MEMS pressure chips export different voltage values under the same pressure of same temperature and are delivered to circuit board.
For the present invention using the method sense temperature of two built-in temperature sensor MEMS pressure chips, shell mechanism design can
Only to consider pressure seal function, therefore the leakage weak spot problem of independent temperature-sensing element (device) lead is not present, in addition product
Compact structure, circuit structure is simple, and operation is more reliable and more stable.
Description of the drawings
The content of every width attached drawing expression in description of the invention and the mark in figure are briefly described below：
Fig. 1,2 are temperature and pressure transmitter structure diagram of the present invention；
Fig. 3 is existing temperature and pressure transmitter structure diagram；
Mark in above-mentioned figure is：1st, housing；2nd, pressure elements；3rd, temperature element (TE；4th, stitch；5th, MEMS pressure core
Piece；6th, circuit board.
Specific embodiment
As shown in Figure 2,3, temperature and pressure transmitter sets the MEMS pressure chips 5 there are two built-in temperature sensor, one
As master chip, one becomes secondary chip, and housing 1 is equipped with the passage that the pressure medium of ribbon supply temperature flows into, and housing 1 is preferred to be molded
Housing 1, housing 1 are equipped with the passage that the pressure medium of ribbon supply temperature flows into, and passage is set there are one entrance and two outlets, passage
Entrance is located at the front of housing 1, and two of passage export the reverse side for being respectively positioned on housing 1, and circuit board 6 is fixed on the reverse side of housing 1,
Two MEMS pressure chips 5 block the pressure signal for being used to be respectively induced outlet in two exits of passage respectively, and pressure is situated between
Matter will be equally distributed to two MEMS pressure chips 5, and said structure design can only consider pressure seal function, therefore not deposit
In the leakage weak spot problem of independent temperature-sensing element (device) lead.
Circuit board 6 is electrically connected with the MEMS pressure chips 5 of two built-in temperature sensors, and two MEMS pressure chips 5 are excellent
It gated stitch 4 and connects circuit board 6, stitch 4 is located at the outer surface of circuit board 6.When pressure medium is in room temperature, two MEMS
Pressure chip 5 provides consistent voltage, plays the role of Redundancy Design, ensures the accuracy of test, and pressure medium carries temperature
When, it can make major minor type chip that will provide different voltage by design, temperature is higher, and the voltage difference of major minor type chip is higher,
So that the sensor can simultaneously output pressure and temperature signal.
MEMS chip is because of silicon sheet material to the sensibility of temperature, it may appear that the output of same pressure at different temperatures
The phenomenon that voltage is different, this phenomenon are referred to as temperature drift.In order to solve the problems, such as temperature drift, MEMS pressure chips 5 can generally integrate one
Temperature sensor using the temperature that temperature sensor is experienced as input, gives pressure signal one compensation in use,
And the size of offset is just determined by the high temperature calibration procedure in production.
The particularity of adjustment algorithm of the present invention is giving two MEMS chips different temperature benefits in high temperature calibration procedure
Calculation formula is repaid, it is defeated because of the different voltage of the difference generation of compensation to be allowed to two chips meetings under the same pressure of same temperature
Go out, which can be used for the temperature for showing that MEMS chip is experienced.
The processing of the voltage differential signal can both be transmitted directly to ECU (circuit board 6) by its computing, can also be in sensor
Temperature voltage signal is processed into circuit design and is then forwarded to ECU.
Directly using integrated temperature sensor output may because output voltage is too low and cause temperature resolution compared with
It is low, but by the design of the compensation formula to two chips, voltage difference can be amplified to reach more accurate temperature
Identification.
The present invention is exemplarily described above in conjunction with attached drawing, it is clear that the present invention implements and from aforesaid way
Limitation, as long as employ the inventive concept and technical scheme of the present invention progress various unsubstantialities improvement or without changing
Other occasions are directly applied to by the design of the present invention and technical solution, within protection scope of the present invention.
Claims (3)
1. a kind of temperature and pressure transmitter, it is characterised in that：Housing is equipped with the passage that the pressure medium of ribbon supply temperature flows into, described
Passage is set there are one entrance and two outlets, and circuit board, the circuit board and two built-in temperatures biographies are fixed on the housing
The MEMS pressure chips electrical connection of sensor, two MEMS pressure chips block respectively to be used to divide in two exits of passage
The pressure signal of outlet is not sensed.
2. temperature and pressure transmitter according to claim 1, it is characterised in that：The housing is injection-moulded housing, described logical
The entrance in road is located at the front of housing, and two of the passage export the reverse side for being respectively positioned on housing, and the circuit board is fixed on shell
The reverse side of body, two MEMS pressure chips connect circuit board by stitch, and the stitch is located at the outer surface of circuit board.
3. the control method based on temperature and pressure transmitter, it is characterised in that：Two MEMS pressure chips are using different
Temperature-compensating calculation formula, two MEMS pressure chips export different voltage value conveyings under the same pressure of same temperature
To circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711326567.8A CN108106775A (en) | 2017-12-13 | 2017-12-13 | A kind of temperature and pressure transmitter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711326567.8A CN108106775A (en) | 2017-12-13 | 2017-12-13 | A kind of temperature and pressure transmitter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108106775A true CN108106775A (en) | 2018-06-01 |
Family
ID=62215728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711326567.8A Pending CN108106775A (en) | 2017-12-13 | 2017-12-13 | A kind of temperature and pressure transmitter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108106775A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109186816A (en) * | 2018-10-24 | 2019-01-11 | 中北大学 | A kind of microminiature digital pressure sensor |
| CN111476991A (en) * | 2020-03-06 | 2020-07-31 | 上海申矽凌微电子科技有限公司 | Double-point temperature measurement system and method suitable for master-slave single bus communication protocol |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201149496Y (en) * | 2008-01-22 | 2008-11-12 | 南京高华科技有限公司 | Pipe type installation structure pressure temperature sensor |
| CN102288516A (en) * | 2011-06-29 | 2011-12-21 | 西安交通大学 | Integrated fluid sensor capable of simultaneously measuring density, pressure and temperature of fluid based on micro-electromechanical system (MEMS) technology |
| CN203519065U (en) * | 2013-11-01 | 2014-04-02 | 重庆长安伟世通发动机控制系统有限公司 | Intake-air temperature and manifold pressure sensor |
| CN103808358A (en) * | 2012-11-13 | 2014-05-21 | 浙江盾安人工环境股份有限公司 | Temperature pressure integrated sensor |
| CN104132767A (en) * | 2014-07-25 | 2014-11-05 | 北京控制工程研究所 | Pressure sensor based on MEMS |
| CN104748905A (en) * | 2015-03-27 | 2015-07-01 | 武汉飞恩微电子有限公司 | Sensor device for synchronously detecting temperature and pressure of refrigerant of air conditioner |
| CN105352632A (en) * | 2015-10-08 | 2016-02-24 | 歌尔声学股份有限公司 | Digital pressure sensor and method for obtaining digital pressure signal |
| CN106338356A (en) * | 2016-09-28 | 2017-01-18 | 广州凯耀资产管理有限公司 | Pressure sensor |
| CN205940853U (en) * | 2016-08-26 | 2017-02-08 | 华景传感科技（无锡）有限公司 | Pressure sensor and car that is suitable for |
| US20170336275A1 (en) * | 2016-05-17 | 2017-11-23 | AAC Technologies Pte. Ltd. | Pressure Transducer |
-
2017
- 2017-12-13 CN CN201711326567.8A patent/CN108106775A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201149496Y (en) * | 2008-01-22 | 2008-11-12 | 南京高华科技有限公司 | Pipe type installation structure pressure temperature sensor |
| CN102288516A (en) * | 2011-06-29 | 2011-12-21 | 西安交通大学 | Integrated fluid sensor capable of simultaneously measuring density, pressure and temperature of fluid based on micro-electromechanical system (MEMS) technology |
| CN103808358A (en) * | 2012-11-13 | 2014-05-21 | 浙江盾安人工环境股份有限公司 | Temperature pressure integrated sensor |
| CN203519065U (en) * | 2013-11-01 | 2014-04-02 | 重庆长安伟世通发动机控制系统有限公司 | Intake-air temperature and manifold pressure sensor |
| CN104132767A (en) * | 2014-07-25 | 2014-11-05 | 北京控制工程研究所 | Pressure sensor based on MEMS |
| CN104748905A (en) * | 2015-03-27 | 2015-07-01 | 武汉飞恩微电子有限公司 | Sensor device for synchronously detecting temperature and pressure of refrigerant of air conditioner |
| CN105352632A (en) * | 2015-10-08 | 2016-02-24 | 歌尔声学股份有限公司 | Digital pressure sensor and method for obtaining digital pressure signal |
| US20170336275A1 (en) * | 2016-05-17 | 2017-11-23 | AAC Technologies Pte. Ltd. | Pressure Transducer |
| CN205940853U (en) * | 2016-08-26 | 2017-02-08 | 华景传感科技（无锡）有限公司 | Pressure sensor and car that is suitable for |
| CN106338356A (en) * | 2016-09-28 | 2017-01-18 | 广州凯耀资产管理有限公司 | Pressure sensor |
Non-Patent Citations (2)
| Title |
|---|
| 刘灿军: "《实用传感器》", 30 June 2004, 国防工业出版社 * |
| 吕强: "《机电一体化原理及应用》", 30 November 2010, 国防工业出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109186816A (en) * | 2018-10-24 | 2019-01-11 | 中北大学 | A kind of microminiature digital pressure sensor |
| CN111476991A (en) * | 2020-03-06 | 2020-07-31 | 上海申矽凌微电子科技有限公司 | Double-point temperature measurement system and method suitable for master-slave single bus communication protocol |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180601 |