CN107352506A - A kind of method for realizing metal nano material transfer - Google Patents
A kind of method for realizing metal nano material transfer Download PDFInfo
- Publication number
- CN107352506A CN107352506A CN201710570972.8A CN201710570972A CN107352506A CN 107352506 A CN107352506 A CN 107352506A CN 201710570972 A CN201710570972 A CN 201710570972A CN 107352506 A CN107352506 A CN 107352506A
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- China
- Prior art keywords
- nano material
- substrate
- metal nano
- substrates
- transfer
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
- B82B3/0061—Methods for manipulating nanostructures
- B82B3/0076—Methods for manipulating nanostructures not provided for in groups B82B3/0066 - B82B3/0071
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
Abstract
The invention discloses a kind of method for realizing metal nano material transfer, including：Blanket substrates after one hydrophilic treated are covered on the substrate for carrying metal nano material, metal nano material is clipped between the two substrates, so as to two substrates being stacked together；Applying on two substrates being stacked together makes the tighter pressure of the two substrate attachings, separates the two substrates after release, so as to realize the transfer of metal nano material.Not only cost is low, simple to operate by the present invention, and has filled up the blank of nano material micro-processing technology, is produced in batches suitable for volume to volume.
Description
Technical field
The present invention relates to nano material micro Process field, more particularly to a kind of method for realizing metal nano material transfer.
Background technology
Nano material possesses the unexistent peculiar property of macroscopic material, in microelectronics, the neck such as biology, fine ceramics, chemical industry
Domain has a wide range of applications.The use of nano material can be related to microscopic fields operation (such as：Nano material it is advance
Arrangement), it usually needs the nano material arranged in advance is transferred to the position of needs by we.
At present, the method for widely used nano material transfer mainly has stickup transfer and embedded transfer.Paste transfer
It is that nano material is transferred on sticking substrate using the effect of pasting of adhesive, but this mode generally has transfer not
The problem of complete, but also the impurity of adhesive can be introduced between nano material, it is unfavorable for the practical application of nano material.It is embedding
It is typically that certain organic liquid is covered on nano material to enter formula transfer, takes organic film off after cured and nanometer can be achieved
The transfer of material, but the nano material that this mode is applicable is limited, and there is also the problem of introducing impurity, it is unfavorable for a nanometer material
The practical application of material.Therefore the method for finding a kind of lossless transfer of nano material is particularly important.
The content of the invention
For above-mentioned weak point of the prior art, the invention provides a kind of side for realizing metal nano material transfer
Method, not only cost is low, simple to operate, and has filled up the blank of nano material micro-processing technology, raw suitable for volume to volume batch
Production.
The purpose of the present invention is achieved through the following technical solutions：
A kind of method for realizing metal nano material transfer, comprises the following steps：
Step A, a blanket substrates are covered on the substrate for carrying metal nano material, press from both sides metal nano material
Between the two substrates, so as to two substrates being stacked together；Wherein, the hydrophily of the blanket substrates is better than institute
State the substrate for carrying metal nano material；
Step B, applying on two substrates being stacked together makes the tighter pressure of the two substrate attachings, is unloading
The two substrates are separated after pressure, so as to realize the transfer of metal nano material.
Preferably, described metal nano material includes metal nanometer line, metal nanoparticle, metal nano ball, metal
At least one of nano-array.
Preferably, described blanket substrates and the described substrate for carrying metal nano material are same substrate.
Preferably, described blanket substrates and the described substrate for carrying metal nano material are substrate not of the same race.
Preferably, described blanket substrates are rigid substrate or flexible substrate.
Preferably, the described substrate for carrying metal nano material is rigid substrate or flexible substrate.
Preferably, described blanket substrates pass through hydrophilic treated.
As seen from the above technical solution provided by the invention, it is provided by the invention to realize what metal nano material shifted
The characteristics of substrate adhesive force that method make use of metal nano material strong to hydrophily is stronger, the strong blanket substrates of hydrophily are covered
It is placed on the substrate for carrying metal nano material, and application makes the two linings on the substrate by being stacked together to the two
Bottom is bonded tighter pressure, so as to realized under the conditions of without existing for adhesive metal nano material from hydrophily difference substrate to
Transfer on the strong substrate of hydrophily.As can be seen here, this realize metal nano material transfer method not only cost it is low, operation letter
List, impurity will not be introduced, and fill up the blank of nano material micro-processing technology, produced in batches suitable for volume to volume.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, required use in being described below to embodiment
Accompanying drawing be briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for this
For the those of ordinary skill in field, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing.
Fig. 1 is the stereoscan photograph for shift front and rear nano silver wire in the embodiment of the present invention 1.
Fig. 2 is the resistance schematic diagram for shift nano silver wire conductive film on front and rear substrate in the embodiment of the present invention 1.
Fig. 3 is the schematic flow sheet that the embodiment of the present invention 1 provides the method for realizing metal nano material transfer.
Embodiment
With reference to the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Ground describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.Based on this
The embodiment of invention, the every other implementation that those of ordinary skill in the art are obtained under the premise of creative work is not made
Example, belongs to protection scope of the present invention.
The method provided by the present invention for realizing metal nano material transfer is described in detail below.
A kind of method for realizing metal nano material transfer, comprises the following steps：
Step A, a blanket substrates are covered on the substrate for carrying metal nano material, press from both sides metal nano material
Between the two substrates, so as to two substrates being stacked together.Wherein, the hydrophily of the blanket substrates is better than institute
State the substrate for carrying metal nano material.
Step B, applying on two substrates being stacked together makes the tighter pressure of the two substrate attachings, is unloading
The two substrates are separated after pressure, so as to realize the transfer of metal nano material under the conditions of without existing for adhesive.
Specifically, this realizes that the method for metal nano material transfer can include embodiments below：
(1) blanket substrates described in are not carry the substrate of metal nano material, that is, are needed metal nano material
It is transferred in the blanket substrates.The hydrophily of the blanket substrates is better than the substrate for carrying metal nano material, and golden
The metal nanometer material substrate adhesive force strong to hydrophily is stronger, thus under the effect of the pressure metal nano material can realize by
The substrate of hydrophily difference is transferred on the strong substrate of hydrophily.In actual applications, described blanket substrates preferably carry out parent
Blanket substrates after water process.
(2) this realizes that the applicable substrate scope of the method for metal nano material transfer is wide.Described blanket substrates with it is described
The substrate for carrying metal nano material can be same substrate, or substrate not of the same race.The blanket substrates and
The substrate for carrying metal nano material can use rigid substrate or flexible substrate.The rigid substrate such as tempering glass
Glass, stainless steel plate, plastic plate etc.；The flexible substrate such as polyester (PET) substrate, polyimides (PD) substrate, film polyethylene
Alcohol (PVA) substrate etc..
(3) this realizes that the applicable metal nano material scope of the method for metal nano material transfer is wide.The metal nano
Material can include the metal nano materials such as metal nanometer line, metal nanoparticle, metal nano ball, metal nano array.
(4) this realizes that the method for metal nano material transfer realizes metal nano material under the conditions of without existing for adhesive
From the substrate of hydrophily difference to the transfer on the strong substrate of hydrophily, and can carry out at normal temperatures and pressures, without being heat-treated,
Therefore cost it is low, it is simple to operate, impurity will not be introduced into metal nano material.
(5) using this realize metal nano material transfer method nano wire reticular membrane is shifted, not only cost it is low,
It is simple to operate, impurity will not be introduced, and film contacts property can be improved, reduce film resistor.
(6) this realizes that the method for metal nano material transfer needs metal nano material to be attached on substrate, therefore can be with
Metal nano material is coated in substrate in advance, forms the substrate for carrying metal nano material.
As fully visible, not only cost is low, simple to operate for the embodiment of the present invention, and has filled up nano material micro-processing technology
Blank, suitable for volume to volume produce in batches.
In order to more clearly from show technical scheme provided by the present invention and caused technique effect, below with tool
What body embodiment was provided the embodiment of the present invention realizes that the method for metal nano material transfer is described in detail.
Embodiment 1
As shown in figure 3, a kind of method for realizing metal nano material transfer, comprises the following steps：
Step a, take two PET substrates to be put into ethanol solution to be cleaned by ultrasonic 20 minutes, then cleaned and dried with deionized water
It is dry, so as to obtain two dry PET substrates；Then one of PET substrate is cleaned 30 in ozone-plasma cleaning machine
Minute (i.e. hydrophilic treated), so as to obtain the strong PET substrate of a hydrophily (PET cleaned through ozone-plasma cleaning machine
Substrate has stronger hydrophily).
Step b, nano silver wire is sprayed on the PET substrate cleaned without ozone-plasma cleaning machine, so as to be held
It is loaded with the PET substrate of nano silver wire.
Step c, the strong PET substrate of hydrophily is covered on the PET substrate for carrying nano silver wire, makes silver nanoparticle wire clamp
Between the two PET substrates, so as to two PET substrates being stacked together.
Step d, applying on two PET substrates being stacked together makes the tighter pressure of the two substrate attachings.
Step e, after release and the strong PET substrate of hydrophily is opened, so as to which nano silver wire has been transferred to the strong PET of hydrophily
On substrate, i.e., nano silver wire is realized under the conditions of without existing for adhesive and is successfully shifted (as shown in the f in Fig. 3).
Specifically, following observation and detection are carried out during the embodiment of the present invention 1 is implemented：
(1) (i.e. silver nanoparticle is carried in the step b of the embodiment of the present invention 1 to substrate before not carrying out nano silver wire transfer respectively
The PET substrate of line) on nano silver wire, carry out nano silver wire transfer after the strong substrate of hydrophily (the i.e. step e of the embodiment of the present invention 1
The strong PET substrate of middle hydrophily) on nano silver wire and carry out nano silver wire transfer after initial substrates (i.e. the present invention implementation
In the step e of example 1 without ozone-plasma cleaning machine clean PET substrate) on nano silver wire be observed, so as to obtain as
The stereoscan photograph for shift front and rear nano silver wire shown in Fig. 1；Wherein, before Fig. 1 a is do not carry out nano silver wire transfer
The stereoscan photograph of nano silver wire on substrate, Fig. 1 b are the silver nanoparticle on the strong substrate of hydrophily after progress nano silver wire transfer
The stereoscan photograph of line, Fig. 1 c are that the ESEM for not carrying out the nano silver wire after nano silver wire transfer in initial substrates shines
Piece, it can be seen that by Fig. 1 a, Fig. 1 b and Fig. 1 c：The nano silver wire before nano silver wire transfer on substrate is not carried out has been paved into netted knot
Structure；After nano silver wire turns, do not remained substantially in initial substrates, what this explanation embodiment of the present invention 1 was provided realizes that metal is received
The method of rice material transfer can realize the complete transfer of nano silver wire.
(2) respectively to not carrying out before nano silver wire transfer nano silver wire conductive film on substrate and carrying out nano silver wire transfer
Nano silver wire conductive film carries out resistance detection on the strong substrate of hydrophily afterwards, so as to obtain it is as shown in Figure 2 shift it is front and rear
Substrate on nano silver wire conductive film resistance contrast schematic diagram；Wherein, 1 in Fig. 2 represents not carry out nano silver wire transfer
The resistance of nano silver wire conductive film on preceding substrate, 2 in Fig. 2 represent to carry out after nano silver wire transfers silver on the strong substrate of hydrophily
The resistance of nano wire conductive film.As seen from Figure 2：After carrying out nano silver wire transfer, the resistance of nano silver wire conductive film
There is 92% reduction, improve the electric conductivity of nano silver wire conductive film, the realization that this explanation embodiment of the present invention 1 is provided
The method of metal nano material transfer can not only realize the transfer of metal nano material, and can strengthen nano silver wire conduction
The electric conductivity of film.
As fully visible, not only cost is low, simple to operate for the embodiment of the present invention, and has filled up nano material micro-processing technology
Blank, suitable for volume to volume produce in batches.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art is in the technical scope of present disclosure, the change or replacement that can readily occur in,
It should all be included within the scope of the present invention.Therefore, protection scope of the present invention should be with the protection model of claims
Enclose and be defined.
Claims (7)
- A kind of 1. method for realizing metal nano material transfer, it is characterised in that comprise the following steps：Step A, a blanket substrates are covered on the substrate for carrying metal nano material, metal nano material is clipped in this Between two substrates, so as to two substrates being stacked together；Wherein, the hydrophily of the blanket substrates is better than described hold It is loaded with the substrate of metal nano material；Step B, applying on two substrates being stacked together makes the tighter pressure of the two substrate attachings, after release The two substrates are separated, so as to realize the transfer of metal nano material.
- 2. the method according to claim 1 for realizing metal nano material transfer, it is characterised in that described metal nano Material includes at least one of metal nanometer line, metal nanoparticle, metal nano ball, metal nano array.
- 3. the method according to claim 1 or 2 for realizing metal nano material transfer, it is characterised in that described blank Substrate and the described substrate for carrying metal nano material are same substrate.
- 4. the method according to claim 1 or 2 for realizing metal nano material transfer, it is characterised in that described blank Substrate and the described substrate for carrying metal nano material are substrate not of the same race.
- 5. the method according to claim 1 or 2 for realizing metal nano material transfer, it is characterised in that described blank Substrate is rigid substrate or flexible substrate.
- 6. the method according to claim 1 or 2 for realizing metal nano material transfer, it is characterised in that described carrying The substrate for having metal nano material is rigid substrate or flexible substrate.
- 7. the method according to claim 1 or 2 for realizing metal nano material transfer, it is characterised in that described blank Substrate passes through hydrophilic treated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710570972.8A CN107352506A (en) | 2017-07-13 | 2017-07-13 | A kind of method for realizing metal nano material transfer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710570972.8A CN107352506A (en) | 2017-07-13 | 2017-07-13 | A kind of method for realizing metal nano material transfer |
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| CN107352506A true CN107352506A (en) | 2017-11-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109950135A (en) * | 2019-03-25 | 2019-06-28 | 深圳第三代半导体研究院 | A kind of gallium oxide nano material transfer method |
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| US20090183816A1 (en) * | 2008-01-17 | 2009-07-23 | Samsung Electronics Co., Ltd. | Method of transferring carbon nanotubes |
| CN102050424A (en) * | 2009-11-06 | 2011-05-11 | 清华大学 | Method for preparing carbon nanotube thin film and method for preparing thin film transistor |
| CN102372254A (en) * | 2010-08-06 | 2012-03-14 | 鸿富锦精密工业（深圳）有限公司 | Method for transfer printing nano wire |
| CN104040694A (en) * | 2011-11-08 | 2014-09-10 | 东北大学 | Damascene Template For Directed Assembly And Transfer Of Nanoelements |
| JP2016129263A (en) * | 2016-03-30 | 2016-07-14 | 大日本印刷株式会社 | Nano-imprint method |
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2017
- 2017-07-13 CN CN201710570972.8A patent/CN107352506A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090183816A1 (en) * | 2008-01-17 | 2009-07-23 | Samsung Electronics Co., Ltd. | Method of transferring carbon nanotubes |
| CN102050424A (en) * | 2009-11-06 | 2011-05-11 | 清华大学 | Method for preparing carbon nanotube thin film and method for preparing thin film transistor |
| CN102372254A (en) * | 2010-08-06 | 2012-03-14 | 鸿富锦精密工业（深圳）有限公司 | Method for transfer printing nano wire |
| CN104040694A (en) * | 2011-11-08 | 2014-09-10 | 东北大学 | Damascene Template For Directed Assembly And Transfer Of Nanoelements |
| JP2016129263A (en) * | 2016-03-30 | 2016-07-14 | 大日本印刷株式会社 | Nano-imprint method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109950135A (en) * | 2019-03-25 | 2019-06-28 | 深圳第三代半导体研究院 | A kind of gallium oxide nano material transfer method |
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Application publication date: 20171117 |