CN106881925A - A kind of copper-clad plate - Google Patents
A kind of copper-clad plate Download PDFInfo
- Publication number
- CN106881925A CN106881925A CN201611268220.8A CN201611268220A CN106881925A CN 106881925 A CN106881925 A CN 106881925A CN 201611268220 A CN201611268220 A CN 201611268220A CN 106881925 A CN106881925 A CN 106881925A
- Authority
- CN
- China
- Prior art keywords
- nano
- copper
- clad plate
- polyamide
- particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/106—Carbon fibres, e.g. graphite fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/558—Impact strength, toughness
Abstract
This application discloses a kind of copper-clad plate, specifically include：Polyamide/mineral Nanocomposite layer, the Copper Foil being arranged on the Polyamide/mineral Nanocomposite layer and the carbon fibre web being arranged under the Polyamide/mineral Nanocomposite layer., directly be made for Copper Foil, Polyamide/mineral Nanocomposite layer and carbon fibre web lamination by the copper-clad plate of the application, effectively improves synchronous toughness reinforcing enhancement effect.
Description
Technical field
The application is related to a kind of copper-clad plate, more particularly to a kind of copper-clad plate with new structure.
Background technology
In copper-clad plate field, the manufacture method of existing copper-clad plate is typically on Kapton epoxy resin in coating
Deng adhesive, after drying, it and Copper Foil are combined on a pair of hot-rollings and are temporarily clung, adhesive is fully cured and is just covered
Copper coin.With the development of copper-clad plate material, requirement to its intensity and toughness also more and more higher.
The content of the invention
The purpose of the application is to provide a kind of production method of copper-clad plate, simple to operate, beneficial to production acceptable performance
Copper-clad plate.
Another object of the present invention is to provide a kind of copper-clad plate, with new structure, effectively solve with copper-clad plate material
The development of material, the needs of problems of the copper-clad plate to having intensity and toughness concurrently.
To achieve the above object, the present invention provides a kind of production method of copper-clad plate, comprises the following steps：
Step 1, offer Copper Foil, reinforcing material, and prepare polyimide/inorganic nano glue；
Step 2, polyimide/inorganic nano glue is coated on Copper Foil using coating equipment；
Step 3, drying semi-solid preparation, polyimide/inorganic nano glue form composite layer on Copper Foil；
Step 4, by with Polyamide/mineral Nanocomposite layer Copper Foil strengthening material is placed in its composite wood charge level
On material, the size of reinforcing material can as needed equal to or less than the area of composite layer；
In step 5, Copper Foil, composite layer, the carbon fibre web feeding press that folded will be located at together, pressing solidification makes
Obtain copper-clad plate.
The beneficial effects of the invention are as follows：The production method of copper-clad plate of the invention, Copper Foil is formed in by the way that resin is coated
On, then copper-clad plate, process is simple, high yield rate is obtained with reinforcing material pressing；Its composite layer and enhancement layer can strengthen and cover
The intensity and toughness of copper coin, meet the market demand.
Brief description of the drawings
Fig. 1 is the production method flow chart of copper-clad plate of the invention；
Fig. 2 is the structural representation of copper-clad plate of the invention.
Specific embodiment
As shown in figure 1, it is the production method flow chart of copper-clad plate of the invention, the production method of the copper-clad plate is included such as
Lower step：
Copper Foil 1, carbon fibre net 3 in step 1, offer Fig. 2, and prepare polyimide/inorganic nano glue；Copper Foil 1 can
It is rolled copper foil or electrolytic copper foil, and copper alloy etc..
It is prepared by the Polyamide/mineral Nanocomposite of the composite layer.
Nano material is a kind of canonical system for being in cluster and macro object boundary transition region, and its structure was both different from
Body block of material, also different from single atom, its special layer of structure makes it have skin effect, bulk effect, quantum chi
Very little effect etc., possesses the physics and chemical characteristic of a series of novel.Compound being obtained of inorganic nano material and organic polymer is had
Machine/inorganic nano composite material, the advantages of make rigidity, dimensional stability and the heat endurance of inorganic material and organic polymer
Toughness is combined, and can more effectively improve composite property.Polymer based nanocomposites often show many and are different from
The characteristic of conventional composites materials, such as synchronous toughness reinforcing enhancement effect, high intensity, high-modulus etc..Polyimides (PI) is to repeat single
Aromatic heterocycle polymer compound containing imide group in unit, with good heat resistance, heat endurance and excellent mechanics,
Electricity, chemical property etc..Inorganic nano-particle (it may be said that Nano titanium nitride, aluminium nitride etc.) incorporation PI can be substantially improved into PI
Properties, for example, its thermal coefficient of expansion can be reduced, improve its physical and mechanical properties, improve its dielectric properties and shaping
Processability etc..When Polyamide/mineral Nanocomposite is prepared, obtain the material shape of stabilization nano-scale and inorganic receive
Rice corpuscles can be uniformly dispersed in polymeric matrix extremely important, influence Polyamide/mineral Nanocomposite performance
Two key factors are the boundaries of degree of scatter and inorganic nano-particle and polyimides of the inorganic nano-particle in polyimides
Face adhesive strength.And determine that the key of the two factors is the surface-active of particle.The surface atom number of inorganic nano-particle compared with
It is many, and lack adjacent atom around surface atom, have many hanging strong, have with unsaturation, therefore inorganic nano-particle
There is more strongly active surface, it is easy to easily reunite between adsorption other materials, particle, disperse tired in polyimides
Difficulty, but it is high with the interfacial adhesion strength of polyimides.In order to obtain balance between dispersion and interfacial adhesion strength, make inorganic receiving
Rice corpuscles is well dispersed in polyimide matrix, there is suitable boundary strength again, just must be to the surface-active of nano-particle
It is controlled.The surface-active of inorganic nano-particle is controlled in this example using VTES coupling agent.With nothing
During the nano particle reinforced tenacity increased PI of machine, we mainly utilize its high surface and high-specific surface area.Work as nanoparticle surface
It is wrapped by completely, the ability that nano-particle is reunited declines, surface-active also declines therewith, the interfacial adhesion strength with PI drops
It is low；When nanoparticle surface is less capped, nano-particle keeps high surface, and the interfacial adhesion strength with PI is big, but
Still easily reunite between particle.Therefore, nano-particle is carried out surface it is modified when, in order to take into account nano-particle in the base
The influence to factors such as nano composite material performances of dispersiveness and basal body interface adhesive strength and coupling agent, nanometer can only be made
The part surface active site absorption coupling agent of particle, the surface-active of the nano-particle after realization treatment is completely clean between surface
Particle surface-active and the surface-active of particle that coats completely of surface between.
According to Langmuir adsorption theories, the surface-active of solids is relevant with the material mass of its adsorption.Profit
Surface of solids adsorption theory is used, coupling agent is controlled in the adsorbance of nanoparticle surface, so as to control its surface-active.Analysis is received
The adsorption free energy and surface free energy and the impact strength of nano composite material of rice corpuscles, take the use of silane coupler
It is 2.0wt% (in terms of nano-particle) to measure, and in an aqueous medium, anion surfactant can substantially improve the profit of nano-particle
Wet performance, adopting water-dispersible technology makes VTES coupling agent part cover nanoparticle surface, by modified
Nano-particle be that there is preferably dispersiveness, and with surface-active higher, foot can be reached with the bonding interface of PI matrixes
Enough intensity.
The particle diameter of inorganic nano-particle can be 10-400nm；VTES coupling agent (CH2=
CHSi(OC2H5)3)；It is pure that acetone, paraffin, methyl alcohol are analysis.Polyimide/inorganic nano is prepared using melt-mixing method
Composite.
Step 2, resin adhesive liquid is coated on Copper Foil 1 using coating equipment
Step 3, drying semi-solid preparation, Polyamide/mineral Nanocomposite glue form resin bed 2 on Copper Foil, and
Carbon fibre web and Copper Foil with composite layer are cut into each needs dimensions；The inorganic nano material is nano oxygen
Change titanium, nano zine oxide, the nano-metal-oxide such as nano aluminium oxide, or the inorganic nano material be Nano titanium nitride,
The nano-metal-oxides such as nano silicon nitride zinc, nano aluminum nitride, or other inorganic nano materials.
Step 4, by with Polyamide/mineral Nanocomposite layer Copper Foil strengthening material is placed in its composite wood charge level
On material, the size of reinforcing material can as needed equal to or less than the area of composite layer；
Step 5, folded will be located at during Copper Foil 1 together, composite layer 2, carbon fibre web 3 send into press, pressing solidification, i.e.,
Copper-clad plate is obtained.
Claims (2)
1. a kind of copper-clad plate, including：Polyamide/mineral Nanocomposite layer, be arranged on the polyimide/inorganic nano
Copper Foil on composite layer and it is arranged on the lower whole of the Polyamide/mineral Nanocomposite layer or local carbon fibre
Dimension net.
2. copper-clad plate according to claim 1, it is characterised in that the inorganic nano material is nano-titanium oxide, nanometer
The nano-metal-oxides such as zinc oxide, nano aluminium oxide, or the inorganic nano material is Nano titanium nitride, nano silicon nitride
The nano-metal-oxides such as zinc, nano aluminum nitride, or other inorganic nano materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611268220.8A CN106881925A (en) | 2016-12-31 | 2016-12-31 | A kind of copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611268220.8A CN106881925A (en) | 2016-12-31 | 2016-12-31 | A kind of copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106881925A true CN106881925A (en) | 2017-06-23 |
Family
ID=59175438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611268220.8A Pending CN106881925A (en) | 2016-12-31 | 2016-12-31 | A kind of copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106881925A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108047982A (en) * | 2017-11-14 | 2018-05-18 | 浙江元集新材料科技股份有限公司 | A kind of preparation method of special heat-resistant bonded of the height of aluminum-based copper-clad plate |
| CN108059926A (en) * | 2017-11-14 | 2018-05-22 | 浙江元集新材料科技股份有限公司 | A kind of preparation method of the special high heat conduction bonding sheet of aluminum-based copper-clad plate |
| CN114714711A (en) * | 2022-05-16 | 2022-07-08 | 江苏耀鸿电子有限公司 | High-wear-resistance corrosion-resistant epoxy resin copper-clad plate and preparation method thereof |
-
2016
- 2016-12-31 CN CN201611268220.8A patent/CN106881925A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108047982A (en) * | 2017-11-14 | 2018-05-18 | 浙江元集新材料科技股份有限公司 | A kind of preparation method of special heat-resistant bonded of the height of aluminum-based copper-clad plate |
| CN108059926A (en) * | 2017-11-14 | 2018-05-22 | 浙江元集新材料科技股份有限公司 | A kind of preparation method of the special high heat conduction bonding sheet of aluminum-based copper-clad plate |
| CN114714711A (en) * | 2022-05-16 | 2022-07-08 | 江苏耀鸿电子有限公司 | High-wear-resistance corrosion-resistant epoxy resin copper-clad plate and preparation method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170623 |