CN103569935A - Method for manufacturing metal micron/ submicron tube array - Google Patents
Method for manufacturing metal micron/ submicron tube array Download PDFInfo
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- CN103569935A CN103569935A CN201310562970.6A CN201310562970A CN103569935A CN 103569935 A CN103569935 A CN 103569935A CN 201310562970 A CN201310562970 A CN 201310562970A CN 103569935 A CN103569935 A CN 103569935A
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- rosin
- submicron
- micron
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Abstract
The invention discloses a method for manufacturing a metal micron/ submicron tube array. The method includes the following steps that a composite structure that quartz fiber gaps are filled with rosin is acquired through the method of the ZL200710134575.2 invention; the composite structure is placed in an HF acid solution, quartz fibers are corroded and removed, and a rosin micro-structure with a hollow micro-tube structure array is formed; gold, platinum, silver, nickel, copper or films of any combination of the metal are deposited on the side walls of micro-tubes of the hollow micro-tube structure array through the chemical plating method, the electroplating method, the atomic layer deposition method and other methods; the rosin is removed, and the metal micron/ submicron tube array structure is acquired. The method is novel, and the acquired micro-structure can be applied to the field of photoelectricity.
Description
Technical field
The present invention relates to the preparation method, particularly a kind of technology of preparing of metal micron/submicron pipe array structure of a kind of sub-micron and micron fine structure material.
Background technology
Metal micron/submicron pipe array structure has a wide range of applications.For example, its unique structure can form in inside very strong magnetic field; Electromagnetic wave and its interaction can excite surface plasma; It has good electric conductivity simultaneously.Therefore, it has a wide range of applications in fields such as photoelectricity, sensing, catalysis.But the preparation of metal micron/submicron pipe array structure is more difficult to preparation with respect to oxide material.
Summary of the invention
The preparation method who the object of this invention is to provide the metal micron-submicron pipe array that a kind of preparation cost is low.
In order to realize foregoing invention object, the technical solution used in the present invention is as follows:
The preparation method's of metal micron-submicron pipe array preparation method, comprises the following steps:
(1) according to the method for patent ZL200710134575.2, obtain the composite construction that rosin is filled quartzy fiber gap;
(2) said structure is placed in to HF acid solution erosion removal quartz fibre, forms the rosin micro-structural that has hollow micro-tubular structure array;
(3) at the microtubule sidewall of above-mentioned hollow micro-tubular structure array, adopt the metallic film of method deposited gold, platinum, silver, nickel, the copper etc. such as chemical plating, plating, ald or its any combination;
(4) remove rosin, obtain the micron/submicron pipe array structure of metal.
Compared with prior art, its remarkable advantage is with low cost in the present invention, without large-scale instrument, and simple and reliable process.The inventive method is novel, and the micro-structural of acquisition can obtain application in fields such as photoelectricity.
Accompanying drawing explanation
Fig. 1 is the preparation method's of metal micron-submicron pipe array schematic diagram.Steps A is removed quartz fibre for rosin being filled to the composite construction HF acid corrosion of quartzy fiber gap; Step B is the side wall deposition metal in gained hollow micro tube array; Step C, for removing rosin, obtains the micron/submicron pipe array structure of metal.
The specific embodiment
Below the present invention is described in further detail.
In embodiment, rosin is filled the composite construction of quartzy fiber gap according to the method acquisition of patent ZL200710134575.2.
Embodiment 1: the composite construction of rosin being filled to quartzy fiber gap is placed in HF acid solution erosion removal quartz fibre, forms the rosin micro-structural that has hollow micro-tubular structure array; Sidewall at above-mentioned hollow micro-tubular structure array microtubule adopts chemical plating method deposited gold film; Remove rosin, obtain golden micron/submicron pipe array structure.
Embodiment 2: the composite construction of rosin being filled to quartzy fiber gap is placed in HF acid solution erosion removal quartz fibre, form the rosin micro-structural that has hollow micro-tubular structure array; Sidewall at above-mentioned hollow micro-tubular structure array microtubule adopts electro-plating method nickel deposited metallic film; Remove rosin, obtain the micron/submicron pipe array structure of nickel.
Embodiment 3: the composite construction of rosin being filled to quartzy fiber gap is placed in HF acid solution erosion removal quartz fibre, form the rosin micro-structural that has hollow micro-tubular structure array; Sidewall at above-mentioned hollow micro-tubular structure array microtubule adopts the method deposition platinum films such as ald; Remove rosin, obtain platinum micron/submicron pipe array structure.
Embodiment 4: the composite construction of rosin being filled to quartzy fiber gap is placed in HF acid solution erosion removal quartz fibre, form the rosin micro-structural that has hollow micro-tubular structure array; Sidewall at above-mentioned hollow micro-tubular structure array microtubule adopts electro-plating method deposited copper metallic film; Remove rosin, obtain copper micron/submicron pipe array structure.
Embodiment 5: the composite construction of rosin being filled to quartzy fiber gap is placed in HF acid solution erosion removal quartz fibre, form the rosin micro-structural that has hollow micro-tubular structure array; Sidewall at above-mentioned hollow micro-tubular structure array microtubule adopts electroless deposition nickel, copper metal film; Remove rosin, obtain ambrose alloy micron/submicron pipe array structure.
Claims (3)
1. the preparation method of metal micron-submicron pipe array, is characterized in that, said method comprising the steps of:
(1) according to the method for patent ZL200710134575.2, obtain the composite construction that rosin is filled quartzy fiber gap;
(2) said structure is placed in to HF acid solution erosion removal quartz fibre, forms the rosin micro-structural that has hollow micro-tubular structure array;
(3) at the microtubule side wall deposition metallic film of above-mentioned hollow micro-tubular structure array;
(4) remove rosin, obtain the micron/submicron pipe array structure of metal.
2. the preparation method of metal micron-submicron pipe array according to claim 1, is characterized in that, in step (3), described depositing metal films adopts chemical plating, plating or Atomic layer deposition method.
3. the preparation method of metal micron-submicron pipe array according to claim 1 and 2, is characterized in that, in step (3), the material of described metallic film is gold, platinum, silver, nickel, copper or above any combination.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310562970.6A CN103569935A (en) | 2013-11-12 | 2013-11-12 | Method for manufacturing metal micron/ submicron tube array |
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| CN201310562970.6A CN103569935A (en) | 2013-11-12 | 2013-11-12 | Method for manufacturing metal micron/ submicron tube array |
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| CN103569935A true CN103569935A (en) | 2014-02-12 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1621183A (en) * | 2004-12-21 | 2005-06-01 | 北京理工大学 | Method for preparing magnetic metal and alloy one dimension nanometer material |
| CN101143705A (en) * | 2007-11-01 | 2008-03-19 | 南京大学 | Method for preparing micrometer and submicron probe arrays |
| CN101469453A (en) * | 2007-12-28 | 2009-07-01 | 北京化工大学 | Alloy nanotube and manufacturing method thereof |
| US7627938B2 (en) * | 2004-10-15 | 2009-12-08 | Board Of Regents, The Univeristy Of Texas System | Tapered hollow metallic microneedle array assembly and method of making and using the same |
| JP4684570B2 (en) * | 2004-03-31 | 2011-05-18 | 独立行政法人科学技術振興機構 | Formation method of carbon nanotubes using catalytic metal fine particles regularly arranged on a substrate |
| CN103194772A (en) * | 2013-04-11 | 2013-07-10 | 佛山市中国地质大学研究院 | Electrochemical method for preparing nickel metal tubular nano array |
| CN103303861A (en) * | 2013-05-14 | 2013-09-18 | 中国科学院上海硅酸盐研究所 | Three-dimensional ordered precious metal nanotube array electrode and preparation method thereof |
-
2013
- 2013-11-12 CN CN201310562970.6A patent/CN103569935A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4684570B2 (en) * | 2004-03-31 | 2011-05-18 | 独立行政法人科学技術振興機構 | Formation method of carbon nanotubes using catalytic metal fine particles regularly arranged on a substrate |
| US7627938B2 (en) * | 2004-10-15 | 2009-12-08 | Board Of Regents, The Univeristy Of Texas System | Tapered hollow metallic microneedle array assembly and method of making and using the same |
| CN1621183A (en) * | 2004-12-21 | 2005-06-01 | 北京理工大学 | Method for preparing magnetic metal and alloy one dimension nanometer material |
| CN101143705A (en) * | 2007-11-01 | 2008-03-19 | 南京大学 | Method for preparing micrometer and submicron probe arrays |
| CN101469453A (en) * | 2007-12-28 | 2009-07-01 | 北京化工大学 | Alloy nanotube and manufacturing method thereof |
| CN103194772A (en) * | 2013-04-11 | 2013-07-10 | 佛山市中国地质大学研究院 | Electrochemical method for preparing nickel metal tubular nano array |
| CN103303861A (en) * | 2013-05-14 | 2013-09-18 | 中国科学院上海硅酸盐研究所 | Three-dimensional ordered precious metal nanotube array electrode and preparation method thereof |
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Application publication date: 20140212 |