CN102044960A - Method for laying out circuit board of frequency-variable controller, circuit board and frequency-variable controller - Google Patents
Method for laying out circuit board of frequency-variable controller, circuit board and frequency-variable controller Download PDFInfo
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- CN102044960A CN102044960A CN2010102865898A CN201010286589A CN102044960A CN 102044960 A CN102044960 A CN 102044960A CN 2010102865898 A CN2010102865898 A CN 2010102865898A CN 201010286589 A CN201010286589 A CN 201010286589A CN 102044960 A CN102044960 A CN 102044960A
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Abstract
The invention relates to a method for laying out a circuit board of a frequency-variable controller. The method comprises the following steps of: arranging a plurality of functional units on the circuit board, wherein each functional unit is provided with a respective earthing area; setting earthing areas of a power factor control sampling unit and an intelligent driver module sampling unit to be adjacent to each other and connected with each other; and setting the earthing area of a microcontroller unit to be independent of the earthing areas of a power factor control sampling area and an intelligent driver module sampling area, and to be connected with the earthing areas of the power factor control sampling area and the intelligent driver module sampling area by a capacitor. The invention also relates to the circuit board and the frequency-variable controller. By implementing method for laying out the circuit board of the frequency-variable controller, the circuit board and the frequency-variable controller, the invention has the advantages that the frequency-variable controller works stably and has high interference resistance.
Description
Technical field
The present invention relates to circuit board, more particularly, relate to a kind of frequency-variable controller circuit-board laying-out method, circuit board and frequency-variable controller thereof.
Background technology
Frequency converter has more use occasion in the energy, power supply, control field, generally speaking, frequency converter need be provided with Active PFC unit (PFC), on the one hand, make the work of frequency converter be unlikely to, make also that on the other hand frequency converter work is more stable, save the energy more for electrical network brings too many electromagnetic interference.But; PFC and frequency conversion drive have the hard switching characteristic; can be in the very strong interference of the inner generation of frequency converter; and in the scheme of the frequency converter resistance sampling that accounts for dominant position at present; common impedance disturbs and occupies main status again, if this is not solved, then these interference may bring certain error to frequency conversion sampled value wherein; under serious situation, may make that above-mentioned frequency converter work is undesired or unstable.Therefore, in order to guarantee the normal or stable work of frequency converter, need be to its circuit board suitable layout in addition.
Summary of the invention
The technical problem to be solved in the present invention is; the common impedance that is brought by ground connection that may exist in the above-mentioned frequency converter at prior art disturbs the undesired or unsettled defective that causes, and provides a kind of and reduces in the frequency converter common impedance and make its frequency-variable controller circuit-board laying-out method, circuit board and frequency-variable controller thereof comparatively normal or steady operation.
The technical solution adopted for the present invention to solve the technical problems is: the circuit-board laying-out method of constructing a kind of frequency-variable controller, described circuit board is provided with a plurality of functional units, comprise micro controller unit, power factor (PF) control sampling unit, intelligent driver module (Intelligent Power Module, IPM) sampling unit, described each functional unit is respectively arranged with ground area separately; It is adjacent to one another and interconnect that the ground area of power factor (PF) control sampling unit and described intelligent driver module sampling unit is set; The ground area that described micro controller unit is set is independent of the ground area of described power factor (PF) control sample area and described intelligent driver module sample area, and is attached thereto by electric capacity.
In the circuit-board laying-out method of frequency-variable controller of the present invention, the connection line that the ground area of described power factor (PF) control sample area and described intelligent driver module sample area is set is rectangle or rectangle or polygon.
In the circuit-board laying-out method of frequency-variable controller of the present invention, described circuit board is a multi-layer sheet, described micro controller unit ground area and described circuit board top layer or bottom are set, the ground area that described power factor (PF) control sample area and described intelligent driver module sample area are set is in described circuit board bottom or top layer, and described two zones are connected with a plurality of via holes that are connected described circuit board top layer and bottom by described electric capacity.
The invention still further relates to a kind of circuit board of frequency-variable controller, described circuit board is provided with a plurality of functional areas, comprise micro controller unit, power factor (PF) control sampling unit, the intelligent driver module sampling unit, it is characterized in that, described each functional unit comprises ground area separately respectively, the ground area of power factor (PF) control sampling unit and described intelligent driver module sampling unit is adjacent to one another and interconnect, the ground area of described micro controller unit is independent of the ground area of described power factor (PF) control sample area and described intelligent driver module sample area, and is attached thereto by electric capacity.
In frequency-variable controller circuit board of the present invention, the connection line of the ground area of described power factor (PF) control sample area and described intelligent driver module sample area is rectangle or rectangle or polygon.
In frequency-variable controller circuit board of the present invention, described circuit board is a multi-layer sheet, described micro controller unit ground area is positioned at described circuit board top layer or bottom, the ground area of described power factor (PF) control sample area and described intelligent driver module sample area is positioned at described circuit board bottom or top layer, and described two zones are connected with a plurality of via holes that are connected described circuit board top layer and bottom by described electric capacity.
The invention still further relates to a kind of frequency-variable controller, comprise the frequency-variable controller circuit board, described frequency-variable controller circuit board is provided with a plurality of functional areas, comprise micro controller unit, power factor (PF) control sampling unit, the intelligent driver module sampling unit, it is characterized in that, described each functional unit comprises ground area separately respectively, the ground area of power factor (PF) control sampling unit and described intelligent driver module sampling unit is adjacent to one another and interconnect, the ground area of described micro controller unit is independent of the ground area of described power factor (PF) control sample area and described intelligent driver module sample area, and is attached thereto by electric capacity; The connection line of the ground area of described power factor (PF) control sample area and described intelligent driver module sample area is that rectangle or rectangle or polygon or described frequency-variable controller circuit board are provided with a plurality of functional areas, comprise micro controller unit, power factor (PF) control sampling unit, the intelligent driver module sampling unit, it is characterized in that, described each functional unit comprises ground area separately respectively, the ground area of power factor (PF) control sampling unit and described intelligent driver module sampling unit is adjacent to one another and interconnect, the ground area of described micro controller unit is independent of the ground area of described power factor (PF) control sample area and described intelligent driver module sample area, and is attached thereto by electric capacity; The connection line of the ground area of described power factor (PF) control sample area and described intelligent driver module sample area is rectangle or rectangle or polygon; Described circuit board is a multi-layer sheet, described micro controller unit ground area is positioned at described circuit board top layer or bottom, the ground area of described power factor (PF) control sample area and described intelligent driver module sample area is positioned at described circuit board bottom or top layer, and described two zones are connected with a plurality of via holes that are connected described circuit board top layer and bottom by described electric capacity.
Implement frequency-variable controller circuit-board laying-out method of the present invention, circuit board and frequency-variable controller thereof, has following beneficial effect: because the power factor (PF) sampling unit on the circuit board of frequency-variable controller and the position of intelligent driver module sampling unit are set to adjacent, and the ground area of its sampling unit is leaned on into mutually, ground area with microcontroller independently and by electric capacity makes it be connected with above-mentioned sampling unit ground area simultaneously, so its common impedance is less, its interference is also less for the influence of sampling, work is comparatively stable, antijamming capability is better.
Description of drawings
Fig. 1 is the structural representation of circuit board among frequency-variable controller circuit-board laying-out method of the present invention, circuit board and the frequency-variable controller embodiment thereof;
Fig. 2 is the electrical schematic diagram of circuit on the circuit board among Fig. 1.
Embodiment
Embodiments of the present invention is further illustrated below in conjunction with accompanying drawing.
As shown in Figure 1, circuit board in frequency-variable controller circuit-board laying-out method of the present invention, circuit board and frequency-variable controller embodiment thereof in Fig. 1, comprises power factor controlling sampling unit 1, intelligent drives sampling unit 2, micro controller unit 3 on this circuit board; What above-mentioned each unit adopted also is structure of the prior art; But, these unit on circuit board layout and prior art in be different.In Fig. 1, all there is the ground area of oneself above-mentioned each unit, wherein, the ground area of above-mentioned power factor controlling sampling unit 1 is power factor (PF) control sampling ground area 11, the ground area of intelligent drives sampling unit 2 is the micro controller unit ground area, ground area 31 of intelligent drives sampling unit ground area 21 and micro controller unit 3, and power factor (PF) control sampling ground area 11 and intelligent drives sampling unit ground area 21 link together by the connecting line 4 that the Copper Foil on the circuit board forms; And the position of above-mentioned two ground areas is very approaching, just makes it approaching when circuit board is provided with as far as possible; In addition, micro-control unit ground area 31 is independent of above-mentioned two ground areas, that is to say between micro controller unit ground area 31 and above-mentioned two ground areas not to be connected, but only link together by electric capacity and above-mentioned two ground areas by Copper Foil on the circuit board.In the present embodiment, the connecting line 4 between above-mentioned power factor (PF) control sampling ground area 11 and the intelligent drives sampling unit ground area 21 is rectangles, in other embodiments, also can be rectangle or polygon; The purpose of She Zhiing is the impedance that reduces between power factor (PF) control sampling ground area 11 and the intelligent drives sampling unit ground area 21 like this, and the interference that makes this common ground impedance be introduced reduces, with stability and the anti-interference that improves this circuit board.In the present embodiment, this circuit board is the single face circuit board, and above-mentioned each ground area all is arranged on the copper foil of circuit board face; In other embodiments, the foregoing circuit plate also can be doubling plate or multi-layer sheet, power factor (PF) control sampling ground area 11, intelligent drives sampling unit ground area 21, micro controller unit ground area 31 can be arranged on the same copper-clad surface, also can be arranged on the different copper-clad surfaces, for example, power factor (PF) control sampling ground area 11, intelligent drives sampling unit ground area 21 is arranged on the low layer of circuit board, the connecting line 4 that connects therebetween also is arranged on circuit board bottom surface, and micro controller unit ground area 31 is arranged on the top layer of circuit board, and electric capacity is passed through in micro controller unit ground area 31, the a plurality of via holes that are arranged on connecting line 4 or the microcontroller ground area 31 connect.
Fig. 2 is the electrical schematic diagram of the circuit board in the present embodiment, according to the connection of prior art, will form a ground articulating and receive interference, as shown in phantom in Figure 2.In the present embodiment, it is very near with the ground linear distance of R2 (sampling resistor) that R1 (sampling resistor) is set, and PFC and IPM are connected with the ground wire of MCU just can be unified into 1 point, and ring guarantees anti-interference with avoiding.But because on the circuit-board laying-out, R1 and R2 have certain distance usually, so deletion PFC is connected (C1 beat x position) with ground wire between the MCU, MCU will be because of the common impedance interference of ground wire problem introducing shown in thick line with being connected of PFC; Can between the ground wire of MCU and PFC, seal in 1 electric capacity (C1), constitute 1 high frequency channel, adopt multipoint earthing (electric capacity is also calculated 1 earth point when high frequency) during high frequency, adopt single-point grounding (electric capacity is equivalent to open circuit when low frequency) during low frequency, can effectively suppress noise.
This enforcement also relates to a kind of frequency-variable controller, and this frequency-variable controller comprises the frequency-variable controller circuit board, and the above-mentioned just circuit board of frequency-variable controller circuit board.
Present embodiment also relates to a kind of layout method of frequency-variable controller, in this circuit-board laying-out method, because circuit board is provided with a plurality of functional units, comprise micro controller unit, power factor (PF) control sampling unit, intelligent driver module (Intelligent Power Module, IPM) sampling unit, and each functional unit is respectively arranged with ground area separately; So it is adjacent to one another and interconnect that the ground area of power factor (PF) control sampling unit and intelligent driver module sampling unit at first is set; Afterwards, the ground area that described micro controller unit is set is independent of the ground area of described power factor (PF) control sample area and described intelligent driver module sample area, and ground area after the connection that makes above-mentioned power factor (PF) control sample area, intelligent driver module sample area is set and the ground area of micro controller unit is attached thereto by electric capacity.In the present embodiment, the connection line that the ground area of above-mentioned power factor (PF) control sample area and intelligent driver module sample area is set is rectangle or rectangle or polygon.In addition, the ifs circuit plate is a multi-layer sheet, the micro controller unit ground area can also be set in circuit board top layer or bottom, and the ground area that power factor (PF) control sample area and intelligent driver module sample area are set is in described circuit board bottom or top layer, and two zones are connected with a plurality of via holes that are connected described circuit board top layer and bottom by described electric capacity.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (7)
1. the circuit-board laying-out method of a frequency-variable controller, described circuit board is provided with a plurality of functional units, comprise micro controller unit, power factor (PF) control sampling unit, intelligent driver module sampling unit, it is characterized in that described each functional unit is respectively arranged with ground area separately; It is adjacent to one another and interconnect that the ground area of power factor (PF) control sampling unit and described intelligent driver module sampling unit is set; The ground area that described micro controller unit is set is independent of the ground area of described power factor (PF) control sample area and described intelligent driver module sample area, and is attached thereto by electric capacity.
2. the circuit-board laying-out method of frequency-variable controller according to claim 1 is characterized in that, the connection line that the ground area of described power factor (PF) control sample area and described intelligent driver module sample area is set is rectangle or rectangle or polygon.
3. the circuit-board laying-out method of frequency-variable controller according to claim 2, it is characterized in that, described circuit board is a multi-layer sheet, described micro controller unit ground area and described circuit board top layer or bottom are set, the ground area that described power factor (PF) control sample area and described intelligent driver module sample area are set is in described circuit board bottom or top layer, and described two zones are connected with a plurality of via holes that are connected described circuit board top layer and bottom by described electric capacity.
4. the circuit board of a frequency-variable controller, described circuit board is provided with a plurality of functional areas, comprise micro controller unit, power factor (PF) control sampling unit, the intelligent driver module sampling unit, it is characterized in that, described each functional unit comprises ground area separately respectively, the ground area of power factor (PF) control sampling unit and described intelligent driver module sampling unit is adjacent to one another and interconnect, the ground area of described micro controller unit is independent of the ground area of described power factor (PF) control sample area and described intelligent driver module sample area, and is attached thereto by electric capacity.
5. the circuit board of frequency-variable controller according to claim 4 is characterized in that, the connection line of the ground area of described power factor (PF) control sample area and described intelligent driver module sample area is rectangle or rectangle or polygon.
6. the circuit board of frequency-variable controller according to claim 5, it is characterized in that, described circuit board is a multi-layer sheet, described micro controller unit ground area is positioned at described circuit board top layer or bottom, the ground area of described power factor (PF) control sample area and described intelligent driver module sample area is positioned at described circuit board bottom or top layer, and described two zones are connected with a plurality of via holes that are connected described circuit board top layer and bottom by described electric capacity.
7. a frequency-variable controller comprises the frequency-variable controller circuit board, it is characterized in that, described frequency-variable controller circuit board is any described circuit board among the claim 4-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010286589 CN102044960B (en) | 2010-09-17 | 2010-09-17 | Method for laying out circuit board of frequency-variable controller, circuit board and frequency-variable controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010286589 CN102044960B (en) | 2010-09-17 | 2010-09-17 | Method for laying out circuit board of frequency-variable controller, circuit board and frequency-variable controller |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102044960A true CN102044960A (en) | 2011-05-04 |
| CN102044960B CN102044960B (en) | 2013-09-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010286589 Expired - Fee Related CN102044960B (en) | 2010-09-17 | 2010-09-17 | Method for laying out circuit board of frequency-variable controller, circuit board and frequency-variable controller |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6055164A (en) * | 1997-11-13 | 2000-04-25 | Lucent Technologies Inc. | System and method for attenuating induced EMI and power converter employing the same |
| CN101741250A (en) * | 2008-11-04 | 2010-06-16 | 友顺科技股份有限公司 | Pulse width modulation control circuit reducing electromagnetic interference by frequency modulation of commercial power and method thereof |
| CN201533251U (en) * | 2009-05-13 | 2010-07-21 | 武汉兴通力电源技术有限公司 | Special-purpose power supply module for power consumption monitoring terminal |
-
2010
- 2010-09-17 CN CN 201010286589 patent/CN102044960B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6055164A (en) * | 1997-11-13 | 2000-04-25 | Lucent Technologies Inc. | System and method for attenuating induced EMI and power converter employing the same |
| CN101741250A (en) * | 2008-11-04 | 2010-06-16 | 友顺科技股份有限公司 | Pulse width modulation control circuit reducing electromagnetic interference by frequency modulation of commercial power and method thereof |
| CN201533251U (en) * | 2009-05-13 | 2010-07-21 | 武汉兴通力电源技术有限公司 | Special-purpose power supply module for power consumption monitoring terminal |
Non-Patent Citations (2)
| Title |
|---|
| 《中国优秀硕士学位论文全文数据库山东大学硕士学位论文》 20080615 张磊 变频空调的电磁骚扰抑制 , * |
| 《电工技术杂志》 20031231 瞿曌等 接地抗干扰技术的讨论 , 第4期 * |
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| CN102044960B (en) | 2013-09-25 |
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Granted publication date: 20130925 |