CN101226163A - Method for measuring metallic film fatigue life on a flexible substrate - Google Patents
Method for measuring metallic film fatigue life on a flexible substrate Download PDFInfo
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- CN101226163A CN101226163A CNA200810017372XA CN200810017372A CN101226163A CN 101226163 A CN101226163 A CN 101226163A CN A200810017372X A CNA200810017372X A CN A200810017372XA CN 200810017372 A CN200810017372 A CN 200810017372A CN 101226163 A CN101226163 A CN 101226163A
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Abstract
The invention discloses a fatigue life test method of metallic film on a flexible substrate, which comprises processing fatigue test under integral circulation stress load on a metallic film/flexible substrate system with better interface combination, recording the stress-strain curvature and resistance change-circulation frequency curvature of the metallic film, detecting the metallic film microcosmic structure under different circulation frequencies in the fatigue process to obtain a metallic film surface damage topography-resistance change-circulation frequency curvature. The invention uses the sharp increase of resistance change on the resistance change-circulation frequency curvature to represent metallic film damage and define a fatigue life Nf. The strain amplitude delta epsilon and relative fatigue life Nf obtained from the stress-strain curvature forms the metallic film fatigue property failure evaluation of the metallic film/flexible substrate system. The inventive method has simple test, accurate measurement and prior property.
Description
Technical field
The present invention relates to metallic film material, belong to the membraneous material field, relate to the evaluation of metallic film material fatigue behaviour, particularly the metal membrane in flexible substrate method for testing fatigue life.
Background technology
Flexible circuit board is widely used in VLSI (very large scale integrated circuit) and the microelectromechanical systems (MEMS), and generally the metallic film material (as copper and aluminium) that connects up as metallization promptly is deposited on and forms metallic film/flexible base, board system on this flexible base, board.As engineering metal construction membraneous material, its fatigue behaviour is an important index very, can be used for material safety design and life prediction.Yet because metallic film material is in micron or submicron-scale on the one dimension direction, the fatigue that has limited membraneous material loads and fatigue behaviour research, and therefore military service behavior and evaluation fatigue lifetime thereof under CYCLIC LOADING becomes the problem demanding prompt solution that guarantees microelectronic material, device and equipment dependability operation with Study on Forecast to metallic film material.
For the metallic film that is deposited on the rigid substrates, be used for the preparation and the related experiment process complexity of the sample of CYCLIC LOADING, to the equipment requirements height, limited the research of its fatigue property test and used.On the other hand, can with deposit metal films on flexible base, board, be whole stress application CYCLIC LOADING to film/matrix, utilize the sudden change (increase) of load width of cloth control metal membrane strain amplitude to come the formation of characterizing metal film fatigue damage, provide its fatigue lifetime.But for the metallic film that is deposited on the flexible base, board, because metallic film tends to stretch with the flexible base, board coupling in deformation process, metallic film often shows a kind of uniform plastic yield mode, yet keeps enough deformabilities even produced microscopic damage.From the angle analysis of microcosmic be exactly, though produced numerous tiny micro-cracks in the metallic film, but, the big crackle of film breaks do not occur being enough to cause, so film can continue to take place plastic yield to reach high deformation strain because these micro-cracks are equally distributed.
However, owing to produced numerous micro-cracks already in the metallic film, the electric property that these micro-cracks will have a strong impact on metallic film is resistance for example, causes seriously shorten the actual life of metallic film.Therefore, press for and set up a kind of safer and easy metallic film fatigue life and determine method, be beneficial to the material design reference.All the time, this problem has all been given great concern both at home and abroad, but relevant concrete definite method had not seen also but that report was arranged.
Summary of the invention
Direct purpose of the present invention is to overcome above-mentioned prior art deficiency, and a kind of metal membrane in flexible substrate method for testing fatigue life is provided, and the test of this method is simple, measures accurately and has an apriority.
Technical scheme of the present invention is achieved in that according to the following steps carries out:
(1) adopt the magnetron sputtering deposition method with deposit metal films on flexible base, board, its elastic strain 〉=2%; Thickness of metal film 50 nanometers-20 micron; Deposition process parameters is: sputtering power 120-180W; Sputtering bias-voltage-60--80V; Background air pressure 3.0 * 10
-3-4.5 * 10
-3Pa; Operating air pressure (Ar) 0.1-0.3Pa;
(2) adopting range is that little puller system of 250N carries out the loading of whole pulsating stress with metallic film/flexible base, board system is heavy.In loading procedure, metallic film is subjected to tension while flexible base, board also to be in the elastic stretching deformation stage, when unloading, the flexible base, board of elastic shrinkage gives the metallic film compressive stress, thereby load with this fatigue and cyclic of drawing-press that realizes metallic film that circulates, the record stress-strain curve obtains strain amplitude Δ ε;
(3) adopt resistance test measuring apparatus metal thin film resistor to change (Δ=(R-R relatively
0)/R
0, R wherein
0Be the resistance value of metallic film before stretching, R is the resistance value of metallic film in the drawing process) with the variation of loaded cycle number of times, draw resistance variations-cycle index curve; By the microstructure of different cycle index metal membranes in the sem observation fatigue process, obtain metallic film surface damage pattern-resistance variations-cycle index curve;
(4) the unexpected increase with resistance variations on resistance variations-cycle index curve comes the damage of characterizing metal film; Pairing cycle index is defined as strain amplitude Δ ε pairing fatigue lifetime of N when resistance variations increases suddenly on resistance variations-cycle index curve
f
Described metallic film material is metallic copper or aluminium, and flexible substrate material is a polyimide.
Can simulate the fatigue behaviour and the inefficacy of metallic film in actual condition metal membrane/flexible base, board system artificially by the present invention, and the inefficacy critical cycle number of times under a certain strain amplitude of quantitative measurement, realize determining of following fatigue lifetime of metallic film CYCLIC LOADING.
Embodiment
The present invention is owing to the quantity and the distribution of underbead crack in the metal material can reflect by the resistance variations of material, therefore when metallic film/flexible base, board system is carried out the strain CYCLIC LOADING and is write down resistance variations-cycle index curve, microstructure by different cycle index metal membranes in the sem observation fatigue process, cycle index when determining micro-crack and occurring, obtain metallic film surface damage pattern-resistance variations-cycle index relation, determine fatigue lifetime by the unique point that resistance variations on this relation and the resistance variations-cycle index curve increases suddenly.
Embodiment 1:
The polyimide flexible base, board is processed into traditional tensile sample shape, and (20 * 6mm) is the effective workspace of sample, and the roomy district at two ends is the load clamp area in middle long narrow district.On effective workspace, thickness is 50 nanometers to the employing magnetron sputtering technique with the metallic copper thin film deposition, and deposition process parameters is: sputtering power 150W; Sputtering bias-voltage-80V; Background air pressure 4.5 * 10
-3Pa; Operating air pressure (Ar) 0.1Pa.The employing range is that little puller system of 250N applies the power cyclic loading to metallic film/flexible base, board system, strain amplitude is 0.05%-1.0%, adopt of the variation of the relative changes delta of resistance test measuring apparatus metallic copper sheet resistance, by the microstructure of different cycle index metal membranes in the sem observation fatigue process with cycle index N; Obtain metal thin film resistor variation-cycle index curve and surface damage pattern-resistance variations-cycle index curve.Suddenly increase by resistance variations on resistance variations-cycle index curve that to be the fatigue lifetime that the fatigue failure criterion obtains this metallic copper film under this strain amplitude cyclic loading be 8000 times.
Embodiment 2:
The polyimide flexible base, board is processed into traditional tensile sample shape, and (20 * 6mm) is the effective workspace of sample, and the roomy district at two ends is the load clamp area in middle long narrow district.On effective workspace, thickness is 700 nanometers to the employing magnetron sputtering technique with the metallic aluminium thin film deposition, and deposition process parameters is: sputtering power 180W; Sputtering bias-voltage-70V; Background air pressure 3.0 * 10
-3Pa; Operating air pressure (Ar) 0.2Pa.The employing range is that little puller system of 250N applies the power cyclic loading to metallic film/flexible base, board system, strain amplitude is 0.06%-1.2%, adopt of the variation of the relative changes delta of resistance test measuring apparatus metallic aluminium sheet resistance, by the microstructure of different cycle index metal membranes in the sem observation fatigue process with cycle index N; Obtain metal thin film resistor variation-cycle index curve and surface damage pattern-resistance variations-cycle index curve.Suddenly increase by resistance variations on resistance variations-cycle index curve that to be the fatigue lifetime that the fatigue failure criterion obtains this metallic aluminium film under this strain amplitude cyclic loading be 4000 times.
Embodiment 3:
The polyimide flexible base, board is processed into traditional tensile sample shape, and (20 * 6mm) is the effective workspace of sample, and the roomy district at two ends is the load clamp area in middle long narrow district.On effective workspace, thickness is 2 microns to the employing magnetron sputtering technique with the metallic copper thin film deposition, and deposition process parameters is: sputtering power 120W; Sputtering bias-voltage-80V; Background air pressure 4.5 * 10
-3Pa; Operating air pressure (Ar) 0.1Pa.The employing range is that little puller system of 250N applies the power cyclic loading to metallic film/flexible base, board system, strain amplitude is 0.045%-0.9%, adopt of the variation of the relative changes delta of resistance test measuring apparatus metallic copper sheet resistance, by the microstructure of different cycle index metal membranes in the sem observation fatigue process with cycle index N; Obtain metal thin film resistor variation-cycle index curve and surface damage pattern-resistance variations-cycle index curve.Suddenly increase by resistance variations on resistance variations-cycle index curve that to be the fatigue lifetime that the fatigue failure criterion obtains this metallic copper film under this strain amplitude cyclic loading be 2500 times.
Embodiment 4:
The polyimide flexible base, board is processed into traditional tensile sample shape, and (20 * 6mm) is the effective workspace of sample, and the roomy district at two ends is the load clamp area in middle long narrow district.On effective workspace, thickness is 5 microns to the employing magnetron sputtering technique with the metallic copper thin film deposition, and deposition process parameters is: sputtering power 150W; Sputtering bias-voltage-60V; Background air pressure 4.5 * 10
-3Pa; Operating air pressure (Ar) 0.3Pa.The employing range is that little puller system of 250N applies the power cyclic loading to metallic film/flexible base, board system, strain amplitude is 0.10%-2.0%, adopt of the variation of the relative changes delta of resistance test measuring apparatus metallic copper sheet resistance, by the microstructure of different cycle index metal membranes in the sem observation fatigue process with cycle index N; Obtain metal thin film resistor variation-cycle index curve and surface damage pattern-resistance variations-cycle index curve.Suddenly increase by resistance variations on resistance variations-cycle index curve that to be the fatigue lifetime that the fatigue failure criterion obtains this metallic copper film under this strain amplitude cyclic loading be 300 times.
Embodiment 5:
The polyimide flexible base, board is processed into traditional tensile sample shape, and (20 * 6mm) is the effective workspace of sample, and the roomy district at two ends is the load clamp area in middle long narrow district.On effective workspace, thickness is 15 microns to the employing magnetron sputtering technique with the metallic aluminium thin film deposition, and deposition process parameters is: sputtering power 150W; Sputtering bias-voltage-80V; Background air pressure 4.5 * 10
-3Pa; Operating air pressure (Ar) 0.3Pa.The employing range is that little puller system of 250N applies the power cyclic loading to metallic film/flexible base, board system, strain amplitude is 0.075%-1.5%, adopt of the variation of the relative changes delta of resistance test measuring apparatus metallic aluminium sheet resistance, by the microstructure of different cycle index metal membranes in the sem observation fatigue process with cycle index N; Obtain metal thin film resistor variation-cycle index curve and surface damage pattern-resistance variations-cycle index curve.Suddenly increase by resistance variations on resistance variations-cycle index curve that to be the fatigue lifetime that the fatigue failure criterion obtains this metallic aluminium film under this strain amplitude cyclic loading be 550 times.
Embodiment 6:
The polyimide flexible base, board is processed into traditional tensile sample shape, and (20 * 6mm) is the effective workspace of sample, and the roomy district at two ends is the load clamp area in middle long narrow district.On effective workspace, thickness is 17 microns to the employing magnetron sputtering technique with the metallic copper thin film deposition, and deposition process parameters is: sputtering power 180W; Sputtering bias-voltage-80V; Background air pressure 4.5 * 10
-3Pa; Operating air pressure (Ar) 0.1Pa.The employing range is that little puller system of 250N applies the power cyclic loading to metallic film/flexible base, board system, strain amplitude is 0.01%-0.5%, adopt of the variation of the relative changes delta of resistance test measuring apparatus metallic copper sheet resistance, by the microstructure of different cycle index metal membranes in the sem observation fatigue process with cycle index N; Obtain metal thin film resistor variation-cycle index curve and surface damage pattern-resistance variations-cycle index curve.Suddenly increase by resistance variations on resistance variations-cycle index curve that to be the fatigue lifetime that the fatigue failure criterion obtains this metallic copper film under this strain amplitude cyclic loading be 16000 times.
Embodiment 7:
The polyimide flexible base, board is processed into traditional tensile sample shape, and (20 * 6mm) is the effective workspace of sample, and the roomy district at two ends is the load clamp area in middle long narrow district.On effective workspace, thickness is 20 microns to the employing magnetron sputtering technique with the metallic copper thin film deposition, and deposition process parameters is: sputtering power 130W; Sputtering bias-voltage-60V; Background air pressure 4.5 * 10
-3Pa; Operating air pressure (Ar) 0.2Pa.The employing range is that little puller system of 250N applies the power cyclic loading to metallic film/flexible base, board system, strain amplitude is 0.04%-0.8%, adopt of the variation of the relative changes delta of resistance test measuring apparatus metallic copper sheet resistance, by the microstructure of different cycle index metal membranes in the sem observation fatigue process with cycle index N; Obtain metal thin film resistor variation-cycle index curve and surface damage pattern-resistance variations-cycle index curve.Suddenly increase by resistance variations on resistance variations-cycle index curve that to be the fatigue lifetime that the fatigue failure criterion obtains this metallic copper film under this strain amplitude cyclic loading be 5000 times.
Claims (2)
1. the metal membrane in flexible substrate method for testing fatigue life is characterized in that, may further comprise the steps:
(1) adopt the magnetron sputtering deposition method with deposit metal films on flexible base, board, its elastic strain 〉=2%; Thickness of metal film 50 nanometers-20 micron; Deposition process parameters is: sputtering power 120-180W; Sputtering bias-voltage-60--80V; Background air pressure 3.0 * 10
-3-4.5 * 10
-3Pa; Operating air pressure (Ar) 0.1-0.3Pa;
(2) adopting range is that little puller system of 250N carries out the loading of whole pulsating stress with metallic film/flexible base, board system is heavy, in loading procedure, metallic film is subjected to tension while flexible base, board also to be in the elastic stretching deformation stage, when unloading, the flexible base, board of elastic shrinkage gives the metallic film compressive stress, thereby load with this fatigue and cyclic of drawing-press that realizes metallic film that circulates, the record stress-strain curve obtains strain amplitude Δ ε;
(3) adopt the relative changes delta of resistance test measuring apparatus metal thin film resistor=(R-R
0)/R
0, R wherein
0Be the resistance value of metallic film before stretching, R is the resistance value of metallic film in the drawing process, with the variation of loaded cycle number of times, draws resistance variations-cycle index curve; By the microstructure of different cycle index metal membranes in the sem observation fatigue process, obtain metallic film surface damage pattern-resistance variations-cycle index curve;
(4) the unexpected increase with resistance variations on resistance variations-cycle index curve comes the damage of characterizing metal film; Pairing cycle index is defined as strain amplitude Δ ε pairing fatigue lifetime of N when resistance variations increases suddenly on resistance variations-cycle index curve
f
2. metal membrane in flexible substrate method for testing fatigue life according to claim 1 is characterized in that, metallic film material is metallic copper or aluminium, and flexible substrate material is a polyimide.
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| CN200810017372XA CN101226163B (en) | 2008-01-22 | 2008-01-22 | Method for measuring metallic film fatigue life on a flexible substrate |
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|---|---|---|---|
| CN200810017372XA CN101226163B (en) | 2008-01-22 | 2008-01-22 | Method for measuring metallic film fatigue life on a flexible substrate |
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| CN101226163A true CN101226163A (en) | 2008-07-23 |
| CN101226163B CN101226163B (en) | 2010-11-10 |
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